Package structure and antenna device using the same

Abstract

An antenna device is provided. The antenna device includes a first substrate and a second substrate facing the first substrate. The first substrate includes an inner surface and an outer surface opposite the inner surface of the first substrate. The second substrate includes an inner surface and an outer surface opposite the inner surface of the second substrate. The antenna device also includes a die disposed between the first substrate and the second substrate, a redistribution layer disposed between the die and the inner surface of the second substrate, and an antenna unit electrically connected to the die via the redistribution layer. The antenna unit is arranged on at least one of the inner surface of the first substrate, the outer surface of the first substrate, the inner surface of the second substrate and the outer surface of the second substrate.

What is claimed is: 
     
         1 . An antenna device, comprising:
 a first substrate, wherein the first substrate comprises an inner surface and an outer surface opposite the inner surface of the first substrate;   a second substrate facing the first substrate, wherein the second substrate comprises an inner surface and an outer surface opposite the inner surface of the second substrate;   a die disposed between the first substrate and the second substrate;   a redistribution layer disposed between the die and the inner surface of the second substrate; and   an antenna unit electrically connected to the die via the redistribution layer;   wherein the antenna unit is arranged on at least one of the inner surface of the first substrate, the outer surface of the first substrate, the inner surface of the second substrate and the outer surface of the second substrate.   
     
     
         2 . The antenna device of  claim 1 , comprising:
 a first sealant disposed between the first substrate and the second substrate;   wherein the first sealant surrounds the die.   
     
     
         3 . The antenna device of  claim 2 , comprising:
 a second sealant,   wherein the first sealant is disposed between the second sealant and the die.   
     
     
         4 . The antenna device of  claim 2 , comprising:
 a plurality of spacers disposed between the first substrate and the second substrate.   
     
     
         5 . The antenna device of  claim 2 , wherein a remaining space between the first substrate and the second substrate inside the first sealant is vacant or filled with air, inert gases or low loss-tangent materials. 
     
     
         6 . The antenna device of  claim 1 , comprising:
 a wire;   wherein the second substrate comprises at least one via hole, and the wire passes through the via hole and is electrically connected the antenna unit and the redistribution layer.   
     
     
         7 . The antenna device of  claim 1 , further comprising:
 a wire;   wherein the first substrate comprises at least one via hole, and the wire passes through the via hole and is electrically connected the antenna unit and the redistribution layer.   
     
     
         8 . The antenna device of  claim 1 , comprising:
 at least one shielding layer disposed on at least one of the inner surface of the first substrate and the inner surface of the second substrate.   
     
     
         9 . The antenna device of  claim 1 , wherein a material of one of the first substrate and the second substrate comprises at least one of glass, polyimide, liquid-crystal polymer, polycarbonate, polypropylene, and polyethylene terephthalate. 
     
     
         10 . A package structure, comprising:
 a first substrate;   a second substrate facing the first substrate;   a redistribution layer disposed between the first substrate and the second substrate;   a die disposed between the redistribution layer and the first substrate;   a metal layer electrically connected to the redistribution layer; and   a sealant disposed between the first substrate and the second substrate and surrounding the die.   
     
     
         11 . The package structure of  claim 10 , wherein a remaining space between the first substrate and the second substrate inside the sealant is vacant or filled with air, inert gases or low loss-tangent materials. 
     
     
         12 . The package structure of  claim 10 , comprising:
 a transmission line disposed between the first substrate and the second substrate;   wherein the transmission line is electrically connected to the die through the redistribution layer, and the transmission line is electrically connected to the metal layer.   
     
     
         13 . The package structure of  claim 12 , comprising:
 at least one via hole penetrating one of the first substrate and the second substrate;   wherein the transmission line passes through the at least one via hole to connect to the metal layer.   
     
     
         14 . The package structure of  claim 10 , comprising:
 a plurality of spacers disposed between the first substrate and the second substrate.   
     
     
         15 . The package structure of  claim 10 , comprising:
 at least one shielding layer disposed on at least one inner surface of the first substrate and the second substrate.   
     
     
         16 . The package structure of  claim 10 , comprising:
 at least one bonding element disposed between the first substrate and the second substrate.   
     
     
         17 . The package structure of  claim 10 , wherein the metal layer is disposed on an inner surface of one of the first substrate and the second substrate or on an outer surface of one of the first substrate and the second substrate. 
     
     
         18 . The package structure of  claim 10 , wherein the metal layer is an antenna unit. 
     
     
         19 . The package structure of  claim 10 , wherein a material of one of the first substrate and the second substrate comprises at least one of glass, polyimide, liquid-crystal polymer, polycarbonate, polypropylene, and polyethylene terephthalate. 
     
     
         20 . The package structure of  claim 10 , comprising:
 a potting compound layer disposed outside sealant.