Substrate processing method

Abstract

A substrate processing method in a substrate processing apparatus that has a cup part for receiving processing liquid such as pure water which is splashed from a substrate. The cup part is formed of electrical insulation material. Hydrophilic treatment may be performed on an outer annular surface of the cup part. Water is held on at least one surface of the cup part while processing the substrate. The water maybe substantially grounded. With the disclosed method, charged potential of the cup part generated by splashing of pure water can be suppressed, without greatly increasing the manufacturing cost of the substrate processing apparatus. As a result, it is possible to prevent electric discharge from occurring on the substrate due to induction charging of the substrate, in application of the processing liquid onto the substrate.

What is claimed is: 
     
         1 . A substrate processing method of processing a substrate in a substrate processing apparatus which comprises a holding part for holding a substrate, a processing liquid applying part for applying processing liquid onto said substrate, and at least one cup part which is formed of electrical insulation material and surrounds said holding part to receive processing liquid splashed from said substrate, comprising the steps of:
 a) applying a liquid including water to an outer annular surface of said at least one cup part to form a layer of said liquid including water on said outer annular surface of said at least one cup part; and   b) applying processing liquid from said processing liquid applying part onto said substrate, wherein said processing liquid is pure water.   
     
     
         2 . The substrate processing method according to  claim 1 , wherein
 hydrophilic treatment is performed on said outer annular surface of said at least one cup part.   
     
     
         3 . The substrate processing method according to  claim 1 , wherein
 said outer annular surface has a textile member or a mesh member thereon.   
     
     
         4 . The substrate processing method according to  claim 1 , wherein
 a normal direction of said substrate is a vertical direction and said at least one cup part moves up and down relatively to said holding part by an elevating mechanism, and   said step a) is performed while a preceding substrate which is processed before said substrate is held by said holding part, and pure water splashed from said preceding substrate is applied to said outer annular surface by positioning an upper end portion of said at least one cup part below said preceding substrate, while ejecting pure water from said processing liquid applying part, in said step a).   
     
     
         5 . A substrate processing method of processing a substrate in a substrate processing apparatus which comprises a holding part for holding a substrate, a processing liquid applying part for applying processing liquid onto said substrate, and a plurality of cup parts each of which is formed of electrical insulation material and surrounds said holding part to receive processing liquid splashed from said substrate, comprising the steps of:
 a) applying a liquid including water to an outer annular surface of an outermost cup part of said plurality of cup parts to form a layer of said liquid including water on said outer annular surface of said outermost cup part, said outermost cup part being located on an outermost side of said plurality of cup parts; and   b) applying processing liquid from said processing liquid applying part onto said substrate, wherein said processing liquid is pure water.   
     
     
         6 . The substrate processing method according to  claim 5 , wherein
 hydrophilic treatment is performed on said outer annular surface of said outermost cup part.   
     
     
         7 . The substrate processing method according to  claim 5 , wherein
 said outermost cup part has a textile member or a mesh member on said outer annular surface.   
     
     
         8 . The substrate processing method according to  claim 5 , wherein
 a normal direction of said substrate is a vertical direction and said at least one cup part moves up and down relatively to said holding part by an elevating mechanism, and   said step a) is performed while a preceding substrate which is processed before said substrate is held by said holding part, and pure water splashed from said preceding substrate is applied to said outer annular surface by positioning an upper end portion of said at least one cup part below said preceding substrate, while ejecting pure water from said processing liquid applying part, in said step a).