Low-gloss cured product having excellent stain resistance, and manufacturing method therefor

Abstract

The present invention relates to a cured product having excellent stain resistance and low gloss, a method of manufacturing the same, and an interior material including the cured product. The cured product according to the present invention includes, along with an acrylic oligomer, an oligomer having a functional group containing silicon (Si) and an oligomer having a functional group containing fluorine (F), and thus, has excellent stain resistance and can implement a micro-folded structure on a surface thereof through extreme ultraviolet rays to be used during curing, thereby being capable of realizing low gloss without a matting agent.

1 . A cured product, comprising: a resin composition comprising an oligomer comprising a silicon (Si)-containing functional group; an oligomer comprising a fluorine (F)-containing functional group; and an acrylic oligomer,
 wherein a surface of the cured product has a micro-folded structure, and   a surface gloss of the cured product is 9 or less under a 60° gloss condition.   
     
     
         2 . The cured product according to  claim 1 , wherein a weight change in the cured product subjected to a Taber abrasion resistance test 500 times using an H-18 abradant is 400 mg or less. 
     
     
         3 . The cured product according to  claim 1 , wherein the acrylic oligomer has a weight average molecular weight (Mw) of 100 to 20,000. 
     
     
         4 . The cured product according to  claim 1 , wherein the resin composition further comprises one or more monomers selected from the group consisting of hydroxypropylacrylate, hydroxypropyl(meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 2-hydroxyethylene glycol (meth)acrylate or 2-hydroxypropylene glycol (meth)acrylate, acrylic acid, methacrylic acid, 2-(meth)acryloyloxyacetic acid, 3-(meth)acryloyloxypropyl acid, 4-(meth)acryloyloxybutyl acid, 1,6-hexanediol diacrylate, an acrylic acid duplex, itaconic acid, maleic acid, caprolactone-modified hydroxyl acrylate (CHA), tetraethylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, triethylene glycol diacrylate, pentaerythritol triacrylate, and trimethylolpropane ethoxy triacrylate. 
     
     
         5 . The cured product according to  claim 4 , wherein the resin composition comprises:
 100 parts by weight of the acrylic oligomer;   10 to 40 parts by weight of the oligomer comprising a silicon (Si)-containing functional group;   5 to 15 parts by weight of the oligomer comprising a fluorine (F)-containing functional group; and   30 to 150 parts by weight of the monomer.   
     
     
         6 . The cured product according to  claim 1 , wherein the resin composition further comprises inorganic particles having an average diameter of 1 nm to 100 nm. 
     
     
         7 . The cured product according to  claim 6 , wherein the content of the inorganic particles is 1 to 40 parts by weight based on 100 parts by weight of the total resin composition. 
     
     
         8 . A method of manufacturing a cured product, the method comprising:
 a first light irradiation step of irradiating a resin composition comprising an oligomer comprising a silicon (Si)-containing functional group; an oligomer comprising a fluorine (F)-containing functional group; and an acrylic oligomer with light having a wavelength of 300 nm or less to activate a resin composition;   a second light irradiation step of irradiating the activated resin composition with light having a wavelength of 700 nm or higher to thermally cure the resin composition; and   a third light irradiation step of irradiating the thermally cured resin composition with light having a wavelength of 400 nm or less to optically cure the resin composition.   
     
     
         9 . The method according to  claim 8 , wherein the first and third light irradiation steps are performed under an inert gas condition where the concentration of oxygen (O 2 ) is 10 ppm to 10,000 ppm. 
     
     
         10 . The method according to  claim 8 , wherein, in the second light irradiation step, a surface temperature of the resin composition is 20 to 90° C. 
     
     
         11 . The method according to  claim 8 , wherein the resin composition has a viscosity of 100 cps to 1,000 cps at 25±1° C. 
     
     
         12 . The method according to  claim 8 , further comprising, after the third light irradiation step, a fourth light irradiation step of irradiating the optically cured resin composition with light having a wavelength of 700 nm or higher to thermally cure the resin composition. 
     
     
         13 . An interior material, comprising a substrate; and the cured product according to  claim 1  formed on the substrate. 
     
     
         14 . The interior material according to  claim 13 , wherein the interior material is a flooring material.