Smart tape and logistics system using the same

Abstract

A smart tape has a flexible substrate, chip, conductive glue, shielding layer and back glue layer. The chip is disposed above or below the flexible substrate. The conductive glue is electrically connected to the chip through the flexible substrate and has a specific pattern, so as to function as a sensing unit for sensing whether the smart tape has been peeled off. The shielding layer is disposed above the chip to protect the chip and prevent oxidation of the conductive glue. The back glue layer is disposed below the flexible substrate.

What is claimed is: 
     
         1 . A smart tape, comprising:
 a flexible substrate;   a chip disposed above or below the flexible substrate;   a conductive glue electrically connected to the chip through the flexible substrate and having a specific pattern, so as to function as a sensing unit for sensing whether the smart tape has been peeled off;   a shielding layer disposed above the chip to protect the chip and prevent oxidation of the conductive glue; and   a back glue layer disposed below the flexible substrate.   
     
     
         2 . The smart tape of  claim 1 , wherein the chip is disposed below the flexible substrate, and the smart tape further comprises:
 an adhesive layer formed on the flexible substrate and a portion of the back glue layer and having an opening, the adhesive layer preventing oxidation of the conductive glue, wherein a portion of the conductive glue is exposed from the opening; and   an anisotropic conductive film formed at the opening to provide a vertical conductive path and thus electrically connect to the conductive glue and the chip, wherein the conductive glue is formed on a portion of the adhesive layer, and the shielding layer covers the conductive glue and a portion of the adhesive layer, wherein the back glue layer is disposed below a portion of the adhesive layer and on an outer side of the chip.   
     
     
         3 . The smart tape of  claim 2 , further comprising:
 a releasing paper disposed below the chip and the back glue layer; and   a carrying substrate disposed above the shielding layer.   
     
     
         4 . The smart tape of  claim 3 , wherein the flexible substrate is made of polyimide, and the carrying substrate is made of polyethylene terephthalate (PET). 
     
     
         5 . The smart tape of  claim 1 , wherein the chip is disposed above the flexible substrate, and the conductive glue further comprises a conductive adhesive member allows the chip to be adhered to the flexible substrate and allow the chip to be electrically connected to the conductive glue through the conductive adhesive member, wherein the shielding layer covers the chip, the conductive glue and the flexible substrate. 
     
     
         6 . The smart tape of  claim 5 , wherein the flexible substrate is made of polyimide. 
     
     
         7 . The smart tape of  claim 1 , wherein the chip is a microcontroller chip and comprises:
 a communication unit;   a read circuit;   a memory; and   a control unit electrically connected to the communication unit, the read circuit, the memory and the conductive glue.   
     
     
         8 . The smart tape of  claim 7 , wherein the control unit sends a scanning signal to the conductive glue, and the conductive glue sends a sensing signal to the control unit. 
     
     
         9 . A logistics system, comprising:
 the smart tape of  claim 1 , adhered to a goods or a package for the goods; and   a server in communication connection with the smart tape to receive a plurality of data sent from the smart tape.   
     
     
         10 . The logistics system of  claim 9 , wherein the plurality of data is a plurality of data blocks forming a block bond.