US2020021257A1PendingUtilityA1
Combined output matching network and filter for power amplifier with concurrent functionality
Est. expiryMar 24, 2035(~8.7 yrs left)· nominal 20-yr term from priority
H03F 2200/387H04B 1/0064H03F 2200/451H03F 1/565H03F 2200/171H04B 2001/0408H03F 3/19H03F 3/193H03F 3/245H03F 2200/294H03F 3/195H04B 2001/485H03F 3/24H03F 3/213H03F 1/3205H04B 1/44H04B 1/0475H04B 1/0458H03F 1/56H04B 1/40
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Claims
Abstract
Disclosed are systems and methods related to reducing intermodulation products in an RF output signal by matching an impedance of the power amplifier to an impedance of the antenna and concurrently blocking signals having a second fundamental frequency received by the antenna when the antenna is transmitting to inhibit intermodulation products of the first and second fundamental frequencies from re-radiating from the antenna. The matching and blocking are performed concurrently by a single circuit with combined matching and blocking functionality.
Claims
exact text as granted — not AI-modified1 .- 20 . (canceled)
21 . A multi-band wireless mobile device comprising:
first and second antennas associated with first and second radio frequency transmit paths, respectively; and a radio frequency module including a first semiconductor die including an amplifier circuit configured to amplify a radio frequency input signal for transmission by the first antenna, the module further including a first circuit including an LC network connected between the first semiconductor die and an output of the module, the first circuit configured to transform an output impedance of the amplifier circuit to an input impedance of the first antenna, and further configured to block signals radiating from the second antenna from reaching the amplifier circuit.
22 . The wireless mobile device of claim 21 wherein the first circuit includes a plurality of integrated passive devices included in a common package.
23 . The wireless mobile device of claim 21 wherein the first semiconductor die does not include any impedance matching functionality.
24 . The wireless mobile device of claim 21 wherein the first circuit is configured to transform the output impedance of the amplifier circuit from a first value less than 50 ohms to approximately 50 ohms.
25 . The wireless mobile device of claim 24 wherein the first circuit includes a first impedance matching network configured to transform the output impedance of the amplifier circuit from a first value less than 50 ohms to a second value greater than the first value but less than 50 ohms.
26 . The wireless mobile device of claim 25 wherein the first circuit is configured to transform an output impedance of the first impedance matching network from the second value to approximately 50 ohms.
27 . A radio frequency module comprising:
a first semiconductor die including an amplifier circuit configured to amplify a radio frequency input signal; and a first circuit including an LC network, the first circuit connected between the first semiconductor die and an output of the module and configured to transform an output impedance of the amplifier circuit to an input impedance of a first antenna, and to block signals radiating from a second antenna from reaching the amplifier circuit.
28 . The module of claim 27 wherein the first circuit includes a plurality of integrated passive devices included in a common package.
29 . The module of claim 27 wherein the first circuit includes a plurality of surface mount devices.
30 . The module of claim 27 wherein the first circuit is implemented in a second semiconductor die separate from the first semiconductor die.
31 . The module of claim 27 wherein the first semiconductor die does not include an output matching network for matching the output impedance of the amplifier circuit to the input impedance of the first antenna.
32 . The module of claim 27 wherein the first circuit is configured to transform the output impedance of the amplifier circuit from a first value less than 50 ohms to approximately 50 ohms.
33 . The module of claim 27 wherein the first circuit includes a first impedance matching network configured to transform the output impedance of the amplifier circuit from a first value less than 50 ohms to a second value greater than the first value but less than 50 ohms.
34 . The module of claim 33 wherein the first circuit further includes a second impedance matching network configured to transform an output impedance of the first impedance matching network from the second value to approximately 50 ohms.
35 . The module of claim 27 wherein the LC network includes a first inductor and a first capacitor connected in parallel, and a second inductor and a second capacitor connected in parallel, the parallel combination of the first inductor and the first capacitor connected in series with and having a common terminal with the parallel combination of the second inductor and the second capacitor.
36 . The module of claim 35 wherein the LC network further includes a third capacitor connected in series with a third inductor, the series combination of the third capacitor and the third inductor coupled between the common terminal and ground.
37 . The module of claim 36 wherein the LC network further includes a fourth inductor connected between the input of the first circuit and the ground, and a fifth inductor connected between the output of the first circuit and the ground.
38 . The module of claim 27 wherein the first circuit is configured to perform both output matching and filtering.
39 . A method to reduce intermodulation in a radio frequency output signal, the method comprising:
amplifying, with a power amplifier circuit residing on a first semiconductor die, a radio frequency input signal to provide an amplified radio frequency signal for transmission by a first antenna in a first radio frequency path; transforming, with a first circuit including an LC network and connected between the first semiconductor die and an output, an output impedance of the power amplifier circuit to an input impedance of the first antenna; and blocking, with the first circuit, signals radiating from a second antenna associated with a second radio frequency path from reaching the amplifier circuit.
40 . The method of claim 39 wherein the power amplifier circuit is implemented on the first semiconductor die and the first circuit is not implemented on the first semiconductor die.
41 . The method of claim 40 wherein the first circuit is implemented on a second semiconductor die that is separate from the first semiconductor die.
42 . The method of claim 40 wherein the first circuit is configured to perform both output matching and filtering.Join the waitlist — get patent alerts
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