Local purge within metrology and inspection systems

Abstract

A purge system includes a purge gas distribution manifold that includes at least one port through which light beam from an optical metrology or inspection head is transmitted. The purge gas distribution manifold includes a bottom surface having one or more apertures through which purge gas is expelled. The bottom surface is held in close proximity to the top surface of the substrate and the apertures may be distributed over the bottom surface of the purge gas distribution manifold so that purge gas is uniformly distributed over the entirety of the top surface of the substrate at all measurement positions of the substrate with respect to the optical metrology or inspection head.

What is claimed is: 
     
         1 . An apparatus comprising:
 an optical metrology or inspection head that produces a light beam that is incident on a substrate to be optically measured and is received by the optical metrology or inspection head after interacting with the substrate;   a chuck for holding the substrate, wherein at least one of the chuck and the optical metrology or inspection head is movable to position the substrate at a plurality of measurement positions with respect to the optical metrology or inspection head;   a purge gas distribution manifold coupled to a purge gas source, the purge gas distribution manifold having at least one port through which the light beam is transmitted, wherein there is relative motion between the purge gas distribution manifold and the substrate when the at least one of the chuck and the optical metrology or inspection head is moved to position the substrate at the plurality of measurement positions with respect to the optical metrology or inspection head, the purge gas distribution manifold having a plurality of apertures through which purge gas is expelled over a top surface of the substrate, wherein the plurality of apertures are distributed over a surface area that is larger than a surface area of the top surface of the substrate to distribute the purge gas over an entirety of the top surface of the substrate at all measurement positions of the substrate with respect to the optical metrology or inspection head.   
     
     
         2 . The apparatus of  claim 1 , wherein the purge gas comprises an inert gas. 
     
     
         3 . The apparatus of  claim 2 , wherein the inert gas comprises at least one of clean dry air, nitrogen, argon or a combination thereof. 
     
     
         4 . The apparatus of  claim 1 , wherein the plurality of apertures in the purge gas distribution manifold is formed by a porous media. 
     
     
         5 . The apparatus of  claim 1 , wherein the plurality of apertures in the purge gas distribution manifold is a pattern of holes. 
     
     
         6 . The apparatus of  claim 5 , wherein the holes are coupled to distribution grooves. 
     
     
         7 . The apparatus of  claim 1 , wherein the purge gas distribution manifold is partitioned into a plurality of zones, the purge gas distribution manifold further comprises a plurality of valves coupled to the purge gas source, wherein each zone is associated with at least one valve, each valve being controlled to reduce or stop a flow of purge gas to an associated zone when the substrate is not present within the associated zone. 
     
     
         8 . The apparatus of  claim 7 , further comprising a plurality of bypass valves associated with each valve, wherein each bypass valve provides a reduced flow of purge gas to maintain a charge of purge gas within an associated zone when an associated valve is shut off. 
     
     
         9 . The apparatus of  claim 1 , further comprising a fence surrounding the substrate on the chuck, wherein the fence is held linearly stationary with respect to the substrate when the at least one of the chuck and the optical metrology or inspection head is moved to position the substrate at the plurality of measurement positions with respect to the optical metrology or inspection head. 
     
     
         10 . The apparatus of  claim 9 , wherein the fence comprises an upper surface that is 10 mm or less from a bottom surface of the purge gas distribution manifold. 
     
     
         11 . The apparatus of  claim 1 , further comprising a reference chip, wherein the purge gas distribution manifold extends over the reference chip. 
     
     
         12 . An apparatus comprising:
 an optical metrology or inspection head that produces a light beam that is incident on a substrate to be optically measured and is received by the optical metrology or inspection head after interacting with the substrate;   a chuck for holding the substrate, wherein at least one of the chuck and the optical metrology or inspection head is movable to position the substrate at a plurality of measurement positions with respect to the optical metrology or inspection head;   a purge gas distribution manifold coupled to a purge gas source, the purge gas distribution manifold having at least one port through which the light beam is transmitted, the purge gas distribution manifold is held linearly stationary with respect to the substrate when the at least one of the chuck and the optical metrology or inspection head is moved to position the substrate at the plurality of measurement positions with respect to the optical metrology or inspection head, the purge gas distribution manifold having a plurality of apertures through which purge gas is expelled, wherein a distribution area of the plurality of apertures is within 25 percent of a surface area of a top surface of the substrate to distribute the purge gas over an entirety of the top surface of the substrate at all measurement positions of the substrate with respect to the optical metrology or inspection head.   
     
     
         13 . The apparatus of  claim 12 , wherein the purge gas distribution manifold is within 10 percent of the surface area of the top surface of the substrate. 
     
     
         14 . The apparatus of  claim 12 , wherein the at least one port is a slot that has a length that is a radius of the substrate. 
     
     
         15 . The apparatus of  claim 12 , wherein the purge gas comprises an inert gas. 
     
     
         16 . The apparatus of  claim 15 , wherein the inert gas comprises at least one of clean dry air, nitrogen, argon or a combination thereof. 
     
     
         17 . The apparatus of  claim 12 , wherein the plurality of apertures in the purge gas distribution manifold is formed by a porous media. 
     
     
         18 . The apparatus of  claim 12 , wherein the plurality of apertures in the purge gas distribution manifold is a pattern of holes. 
     
     
         19 . The apparatus of  claim 18 , wherein the holes are coupled to distribution grooves. 
     
     
         20 . The apparatus of  claim 12 , wherein the purge gas distribution manifold is held linearly stationary with respect to the substrate when the at least one of the chuck and the optical metrology or inspection head is moved to position the substrate at the plurality of measurement positions with respect to the optical metrology or inspection head. 
     
     
         21 . The apparatus of  claim 12 , further comprising a fence surrounding the substrate on the chuck, wherein the fence is held linearly stationary with respect to the substrate when the at least one of the chuck and the optical metrology or inspection head is moved to position the substrate at the plurality of measurement positions with respect to the optical metrology or inspection head. 
     
     
         22 . The apparatus of  claim 21 , wherein the fence comprises an upper surface that is 10 mm or less from a bottom surface of the purge gas distribution manifold. 
     
     
         23 . The apparatus of  claim 12 , further comprising a reference chip, wherein the purge gas distribution manifold extends over the reference chip. 
     
     
         24 . An apparatus comprising:
 an optical metrology or inspection head that produces a light beam that is incident on a substrate to be optically measured and is received by the optical metrology or inspection head after interacting with the substrate;   a chuck for holding the substrate, wherein at least one of the chuck and the optical metrology or inspection head is movable to position the substrate at a plurality of measurement positions with respect to the optical metrology or inspection head;   a ceiling having at least one port through which the light beam is transmitted, the ceiling having a bottom surface that is 25 mm or less from a top surface of the substrate; and   a fence surrounding the substrate on the chuck, wherein the fence is held linearly stationary with respect to the substrate when the at least one of the chuck and the optical metrology or inspection head is moved to position the substrate at the plurality of measurement positions with respect to the optical metrology or inspection head, the fence having one or more apertures below the top surface of the substrate and through which purge gas is expelled over the top surface of the substrate to distribute the purge gas over an entirety of the top surface of the substrate at all measurement positions of the substrate with respect to the optical metrology or inspection head.   
     
     
         25 . The apparatus of  claim 24 , wherein the fence comprises an upper surface that is 10 mm or less from the bottom surface of the ceiling. 
     
     
         26 . The apparatus of  claim 24 , wherein the purge gas comprises an inert gas. 
     
     
         27 . The apparatus of  claim 26 , wherein the inert gas comprises at least one of clean dry air, nitrogen, argon or a combination thereof. 
     
     
         28 . The apparatus of  claim 24 , wherein the one or more apertures are on a bottom surface of the fence. 
     
     
         29 . The apparatus of  claim 24 , wherein the purge gas is exhausted through the at least one port in the ceiling. 
     
     
         30 . The apparatus of  claim 24 , further comprising a reference chip, wherein the fence surrounds the substrate and the reference chip.