Method for forming plating

Abstract

A plating is formed on one side of a cathode by applying a paste composed of particles mixed with a plating liquid to one side of the cathode, disposing a liquid holding member impregnated with the plating liquid on one side of an anode, opposing the cathode and the anode face, and then bringing the liquid holding member and the paste into contact with each other, and applying a voltage between the cathode and the anode.

1 . A method for forming a plating, the method forming a plating on one side of a cathode by:
 applying, to the side of the cathode, a paste obtained by mixing particles with a plating liquid;   disposing a liquid holding member impregnated with the plating liquid on one side of an anode;   opposing the cathode and the anode, and then bringing the liquid holding member and the paste into contact with each other; and   applying a voltage between the cathode and the anode,   wherein the particles comprise either a metal or a resin.   
     
     
         2 . The method according to  claim 1 , wherein the paste is mixed with a surfactant. 
     
     
         3 . (canceled) 
     
     
         4 . The method for forming a plating according to  claim 1 , wherein the particles have a particle size of 0.02 μm or more and 0.6 μm or less. 
     
     
         5 . The method for forming a plating according to  claim 1 , wherein the particles are 10% by weight or more and 72% by weight or less with respect to the paste. 
     
     
         6 . The method for forming a plating according to  claim 1 , wherein the liquid holding member is a sponge. 
     
     
         7 . The method for forming a plating according to  claim 2 , wherein the particles have a particle size of 0.02 μm or more and 0.6 μm or less. 
     
     
         8 . The method for forming a plating according to  claim 2 , wherein the particles are 10% by weight or more and 72% by weight or less with respect to the paste. 
     
     
         9 . The method for forming a plating according to  claim 4 , wherein the particles are 10% by weight or more and 72% by weight or less with respect to the paste. 
     
     
         10 . The method for forming a plating according to  claim 2 , wherein the liquid holding member is a sponge. 
     
     
         11 . The method for forming a plating according to  claim 4 , wherein the liquid holding member is a sponge. 
     
     
         12 . The method for forming a plating according to  claim 5 , wherein the liquid holding member is a sponge.