Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
Abstract
A system for cutting a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum is provided that includes: a laser capable of emitting light along a light path and of a predetermined wavelength that is within the range of wavelengths in which the substrate is transparent; an optical element positioned in the light path of the laser such that the laser in conjunction with the optical element is capable of generating induced nonlinear absorption within at least a portion of the substrate; and an interface block composed of a material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is also transparent. The interface block is positioned in the light path and between the substrate and the optical element. Further, the substrate will include an edge when extracted from a sheet.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An interface block for use in a system for cutting at least one edge of a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum, comprising:
a block of material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is transparent, wherein the block of material comprises a gradient index material, and further wherein the gradient index material has a non-uniform index of refraction.
2 . The interface block according to claim 1 , wherein the gradient index material comprises a plurality of sections, each section having a different index of refraction.
3 . The interface block according to claim 1 , wherein the interface block is shaped in the form of a rectangular parallelepiped.
4 . The interface block according to claim 1 , wherein the interface block is shaped in the form of a triangular parallelepiped.
5 . The interface block according to claim 1 , further comprising:
a notched shoulder formed therein that is adapted to receive one edge of the at least one edge of the substrate therein.
6 . The interface block according to claim 1 , further comprising:
an antireflection coating disposed on a surface of the interface block that is in a light path.
7 . An interface block for use in a system for cutting at least one edge of a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum, comprising:
a block of material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is transparent, wherein the block of material comprises a plurality of pieces of transparent, solid materials, each piece having a different index of refraction.
8 . The interface block according to claim 7 , wherein the interface block is shaped in the form of a rectangular parallelepiped.
9 . The interface block according to claim 7 , wherein the interface block is shaped in the form of a triangular parallelepiped.
10 . The interface block according to claim 7 , further comprising:
a notched shoulder formed therein that is adapted to receive one edge of the at least one edge of the substrate therein.
11 . The interface block according to claim 7 , further comprising:
an antireflection coating disposed on a surface of the interface block that is in a light path.
12 . The interface block according to claim 7 , wherein each piece of the block of material comprises one of a polymer, a glass, a ceramic, and a crystalline material.
13 . The interface block according to claim 7 , wherein the block of material is transparent in one or both of the visible spectrum and the infrared spectrum.
14 . A method for cutting at least one edge of a substrate that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum, comprising:
arranging a laser, an optical element and an interface block such that a beam of light emitted from the laser will pass first through the optical element and subsequently through the interface block; positioning the interface block in juxtaposed relation to the at least one edge of the substrate; and emitting a beam of light from the laser at a wavelength that is within the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is transparent, wherein the emitted beam of light follows a path through the optical element and the interface block whereby the interface block causes the beam of light to angularly intersect and pass through the substrate at a position adjacent to the at least one edge, and wherein the interface block comprises a block of material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate is transparent.
15 . The method according to claim 14 , wherein the block of material comprises different indices of refraction.
16 . The method according to claim 14 , wherein the block of material comprises a gradient index material, and further wherein the gradient index material has a non-uniform index of refraction.
17 . The method according to claim 16 , wherein the gradient index material comprises a plurality of sections, each section having a different index of refraction.
18 . The method according to claim 14 , wherein the block of material comprises a plurality of pieces of transparent, solid materials, each piece having a different index of refraction.
19 . The method according to claim 18 , wherein each piece of the block of material comprises one of a polymer, a glass, a ceramic, and a crystalline material.
20 . The method according to claim 14 , wherein the block of material is transparent in one or both of the visible spectrum and the infrared spectrum.Join the waitlist — get patent alerts
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