Method for preparing microstructured laminating adhesive articles

Abstract

A method of making a microstructured adhesive article that includes (a) providing an article comprising a crosslinked pressure sensitive adhesive layer disposed on a backing; and (b) embossing the surface of the crosslinked pressure sensitive adhesive layer to form a crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface.

1 . A method of making a microstructured adhesive article comprising:
 (a) providing an article comprising a crosslinked pressure sensitive adhesive layer disposed on a backing, wherein the crosslinked pressure sensitive adhesive layer has a thickness of from about 10 micrometers to about 1500 micrometers; and   (b) embossing the surface of the crosslinked pressure sensitive adhesive layer with a microstructured liner or a molding tool to form a crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface structure, wherein the structure consists of V-grooves or channels and wherein the surface structure is unstable when not in contact with the microstructured liner or molding tool, and the adhesive layer is able to wet out a substrate surface by flattening of the microstructured surface structures and displays complete wet out to a glass substrate after 48 hours.   
     
     
         2 . The method of  claim 1 , wherein embossing comprises contacting the surface of the crosslinked pressure sensitive adhesive layer with a microstructured release liner. 
     
     
         3 . The method of  claim 1 , wherein embossing comprises contacting the surface of the crosslinked pressure sensitive adhesive layer with a microstructured molding tool. 
     
     
         4 . The method of  claim 1 , wherein the crosslinked pressure sensitive adhesive layer comprises a covalently crosslinked pressure sensitive adhesive layer. 
     
     
         5 . The method of  claim 1 , wherein the crosslinked pressure sensitive adhesive layer comprises a physically crosslinked pressure sensitive adhesive layer. 
     
     
         6 . The method of  claim 1 , wherein the crosslinked pressure sensitive adhesive layer comprises a crosslinked acrylic adhesive layer. 
     
     
         7 . The method of  claim 1 , wherein the backing on which the crosslinked pressure sensitive adhesive layer is disposed is removable from the adhesive layer. 
     
     
         8 . The method of  claim 1 , wherein the backing on which the crosslinked pressure sensitive adhesive layer is disposed comprises a microstructured release liner. 
     
     
         9 . The method of  claim 1 , wherein the backing on which the crosslinked pressure sensitive adhesive layer is disposed comprises a polymeric film. 
     
     
         10 . The method of  claim 1 , wherein the backing on which the crosslinked pressure sensitive adhesive layer is disposed comprises a rigid substrate. 
     
     
         11 . The method of  claim 1 , wherein the backing on which the crosslinked pressure sensitive adhesive layer is disposed comprises a non-rigid substrate. 
     
     
         12 . The method of  claim 1 , wherein the crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface is capable of being dry laminated to a substrate to form a laminate. 
     
     
         13 . The method of  claim 12 , wherein during being dry laminated to a substrate to form a laminate, air bleeds out through the microstructural features to prevent the formation of bonding defects. 
     
     
         14 . A microstructured adhesive article prepared according to the method of  claim 1 . 
     
     
         15 . An article comprising a crosslinked pressure sensitive adhesive layer disposed on a structured liner, wherein the crosslinked pressure sensitive adhesive has a microstructured surface structure, wherein the surface structure consists of V-grooves or channels and wherein the surface structure is unstable when not in contact with the structured liner, and the adhesive layer is able to wet out a substrate surface by flattening of the microstructured surface structures due to the minimization of the formation of stresses within the adhesive upon removal of the structured liner, and wherein the crosslinked pressure sensitive adhesive layer has a thickness of from about 10 micrometers to about 1500 micrometers, and wherein the crosslinked pressure sensitive adhesive having a microstructured surface structure displays complete wet out to a glass substrate after 48 hours. 
     
     
         16 . The article of  claim 15 , wherein the article further comprises a backing disposed on the crosslinked pressure sensitive adhesive layer. 
     
     
         17 . The article of  claim 16 , wherein the backing is removable from the adhesive layer. 
     
     
         18 . The article of  claim 16 , wherein the backing comprises a microstructured release liner. 
     
     
         19 . The article of  claim 16 , wherein the backing comprises a polymeric film. 
     
     
         20 . The article of  claim 16 , wherein the backing comprises a rigid substrate. 
     
     
         21 . The article of  claim 16 , wherein the backing comprises a non-rigid substrate.