Method and apparatus for manufacturing electronic device using device chip

Abstract

[Means of Realizing the Object] A substrate having a plurality of device chips is brought into contact with a first drum including a selective adhesive region, the device chips are transferred by making the device chips be adhered to the selective adhesive layer of the first drum and separating at least part of the device chips from the substrate by rotating the first drum, then, the device chips on the first drum are made to be come into contact with the other substrate for the product, and the device chips are transferred to the substrate for the product by rotating the first drum. Additionally, the front-and-rear relation for the surfaces may be inversed by, after the device chips on the first drum are transferred to the second drum, transferring the device chips on the second drum to the substrate for the product.

1 . An apparatus, for selectively separating and taking-out at least one of a plurality of device chips adhered to a first adhesive layer on a first substrate from the first substrate by rotating a first drum; and
 for transferring the device chips onto a second substrate having a surface where a second adhesive layer is formed,   wherein the first drum comprises a surface where a third adhesive layer is formed, the third adhesive layer including a selective adhesive region having an adhesive force stronger than an adhesive force of a surrounding region surrounding the selective adhesive region, and   wherein a relationship between an adhesive force of the first adhesive layer, an adhesive force of the second adhesive layer, and an adhesive force of the third adhesive layer satisfies:
 the adhesive force of the first adhesive layer<the adhesive force of the third adhesive layer<the adhesive force of the second adhesive layer. 
   
     
     
         2 . The apparatus according to  claim 1 , wherein hardness of the first to third adhesive layers measured according to JIS K 6253 is 30 to 60. 
     
     
         3 . The apparatus according to  claim 1 , wherein the first to third adhesive layers are made of at least one or more combination selected from acrylic-based adhesive, rubber-based adhesive, vinyl alkyl ether-based adhesive, silicone-based adhesive, polyester-based adhesive, polyamide-based adhesive, urethane-based adhesive, fluorine-based adhesive, epoxy-based adhesive, and polyether-based adhesive. 
     
     
         4 . The apparatus according to  claim 1 , wherein the first to third adhesive layers comprise, as an additive substance, at least one selected from conditioner for viscosity and separation degree, tackifier agent, plasticizer, softener, filler including fibrous glass, glass beads, metal powders, and inorganic powder, coloring agent including pigment and dye, and additive agent including pH adjuster, antioxidant, and ultraviolet absorber. 
     
     
         5 . The apparatus according to  claim 1 , wherein thicknesses of the first to third adhesive layers are equal to or more than 5 μm and equal to or less than 100 μm. 
     
     
         6 . The apparatus according to  claim 1 , wherein thicknesses of the first to third adhesive layers are equal to or more than 10 μm and equal to or less than 60 μm. 
     
     
         7 . The apparatus according to  claim 1 ,
 wherein the third adhesive layer includes a surface having convex portions and non-convex portion, and   wherein height of the convex portion is equal to or more than 5 μm and equal to or less than 60 μm, and an aspect ratio where a base of the convex portion is as a breadth and the height of the convex portion is as a length is equal to or less than 4.   
     
     
         8 . The apparatus according to  claim 7 ,
 wherein the third adhesive layer includes the convex portions, and   wherein taper angles of lateral sides of a sectional shape of the convex portion cut by a plane that is perpendicular to a rotation shaft of the first drum to a vertical line of the convex portions are equal to or more than 20 degrees and equal to or less than 80 degrees.   
     
     
         9 . The apparatus according to  claim 7 ,
 wherein the height of the convex portion is equal to or more than 10 μm and equal to or less than 40 μm, and the aspect ratio is equal to or more than 2 and equal to or less than 3, and   wherein taper angles of lateral sides of a sectional shape of the convex portion cut by a plane that is perpendicular to a rotation shaft of the first drum to a vertical line of the convex portions are equal to or more than 30 degrees and equal to or less than 60 degrees.