Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Abstract

In one embodiment, a semiconductor manufacturing apparatus includes a substrate holder configured to hold a plurality of substrates such that the substrates are arranged in parallel to each other. The apparatus further includes a fluid injector including a plurality of openings that inject fluid to areas in which distances from surfaces of the substrates are within distances between centers of the substrates adjacent to each other, the fluid injector being configured to change injection directions of the fluid injected from the openings in planes that are parallel to the surfaces of the substrates by self-oscillation.

1 . A semiconductor manufacturing apparatus comprising:
 a substrate holder configured to hold a plurality of substrates such that the substrates are arranged in parallel to each other; and   a fluid injector including a plurality of openings that inject fluid to areas in which distances from surfaces of the substrates are within distances between centers of the substrates adjacent to each other, the fluid injector being configured to change injection directions of the fluid injected from the openings in planes that are parallel to the surfaces of the substrates by self-oscillation.   
     
     
         2 . The apparatus of  claim 1 , wherein
 the substrate holder holds N substrates such that (N−1) gaps are provided between the N substrates where N is an integer of three or more,   each opening of the fluid injector injects the fluid to only one corresponding gap of the N−1 gaps, and   the fluid injector periodically changes the injection directions of the fluid in the planes that are parallel to the surfaces of the substrates.   
     
     
         3 . The apparatus of  claim 1 , wherein
 the fluid injector includes a first pipe that includes a first hole, a second pipe that includes a second hole and a third hole and surrounds the first pipe, and a third pipe that includes a fourth hole corresponding to one of the openings and surrounds the second pipe,   the fluid flows from a first space in the first pipe into a second space between the first pipe and the second pipe through the first hole, flows from the second space into a third space between the second pipe and the third pipe through the second hole, returns from the third space to the second space through the third hole, and is injected from the third space through the fourth hole.   
     
     
         4 . The apparatus of  claim 3 , wherein the second pipe includes, as the third hole, a pair of holes provided to sandwich the second hole. 
     
     
         5 . The apparatus of  claim 1 , wherein the fluid injector includes:
 a first flow passage configured to transfer the fluid from an inlet to an outlet that corresponds to one of the openings; and   a second flow passage configured to return the fluid in the first flow passage from a side of the outlet to a side of the inlet.   
     
     
         6 . The apparatus of  claim 5 , wherein the fluid injector includes, as the second flow passage, a pair of flow passages provided to sandwich the first flow passage. 
     
     
         7 . The apparatus of  claim 5 , wherein the fluid injector is provided inside a pipe configured to supply the fluid to the inlet of the fluid. 
     
     
         8 . The apparatus of  claim 5 , wherein the fluid injector is provided outside a pipe configured to supply the fluid to the inlet of the fluid. 
     
     
         9 . The apparatus of  claim 1 , wherein the fluid injector includes:
 a pipe that is partitioned into a first flow passage configured to transfer the fluid and a second flow passage configured to receive the fluid from the first flow passage, and includes a first hole corresponding to one of the openings on a side of the second flow passage;   a first member that is provided in the pipe so as to partition the first flow passage and the second flow passage, and includes a second hole; and   a second member that is provided in the second flow passage, and forms a flow passage configured to return the fluid in the second flow passage from a side of the first hole to a side of the second hole.   
     
     
         10 . The apparatus of  claim 9 , wherein the second member forms a pair of flow passages configured to return the fluid in the second flow passage from the side of the first hole to the side of the second hole. 
     
     
         11 . The apparatus of  claim 1 , wherein the fluid injector periodically changes the injection directions of the fluid in the planes that are parallel to the surfaces of the substrates. 
     
     
         12 . The apparatus of  claim 11 , wherein a cycle of the periodical change is  10  seconds or less. 
     
     
         13 . A semiconductor manufacturing apparatus comprising:
 a substrate holder configured to hold a substrate to be treated by single substrate processing; and   a fluid injector including an opening that injects fluid to a surface of the substrate, the fluid injector being configured to change an injection direction of the fluid injected from the opening in a plane that is parallel to the surface of the substrate by self-oscillation.   
     
     
         14 . The apparatus of  claim 13 , wherein the fluid injector includes:
 a first flow passage configured to transfer the fluid from an inlet to an outlet that corresponds to the opening; and   a second flow passage configured to return the fluid in the first flow passage from a side of the outlet to a side of the inlet.   
     
     
         15 . The apparatus of  claim 14 , wherein the fluid injector includes, as the second flow passage, a pair of flow passages provided to sandwich the first flow passage. 
     
     
         16 . A method of manufacturing a semiconductor device, comprising:
 holding a plurality of substrates by a substrate holder such that the substrates are arranged in parallel to each other; and   injecting fluid from a plurality of openings of a fluid injector to areas in which distances from surfaces of the substrates are within distances between centers of the substrates adjacent to each other,   wherein the fluid injector changes injection directions of the fluid injected from the openings in planes that are parallel to the surfaces of the substrates by self-oscillation.   
     
     
         17 . The method of  claim 16 , wherein
 the substrate holder holds N substrates such that (N−1) gaps are provided between the N substrates where N is an integer of three or more,   each opening of the fluid injector injects the fluid to only one corresponding gap of the N−1 gaps, and   the fluid injector periodically changes the injection directions of the fluid in the planes that are parallel to the surfaces of the substrates.   
     
     
         18 . The method of  claim 16 , wherein
 the fluid injector includes a first pipe that includes a first hole, a second pipe that includes a second hole and a third hole and surrounds the first pipe, and a third pipe that includes a fourth hole corresponding to one of the openings and surrounds the second pipe, and   the fluid flows from a first space in the first pipe into a second space between the first pipe and the second pipe through the first hole, flows from the second space into a third space between the second pipe and the third pipe through the second hole, returns from the third space to the second space through the third hole, and is injected from the third space through the fourth hole.   
     
     
         19 . The method of  claim 16 , wherein the fluid injector includes:
 a first flow passage configured to transfer the fluid from an inlet to an outlet that corresponds to one of the openings; and   a second flow passage configured to return the fluid in the first flow passage from a side of the outlet to a side of the inlet.   
     
     
         20 . The method of  claim 16 , wherein the fluid injector includes:
 a pipe that is partitioned into a first flow passage configured to transfer the fluid and a second flow passage configured to receive the fluid from the first flow passage, and includes a first hole corresponding to one of the openings on a side of the second flow passage;   a first member that is provided in the pipe so as to partition the first flow passage and the second flow passage, and includes a second hole; and   a second member that is provided in the second flow passage, and forms a flow passage configured to return the fluid from a side of the first hole to a side of the second hole.