Electroless copper plating compositions and methods for electroless plating copper on substrates

Abstract

Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

What is claimed is: 
     
         1 . An electroless copper plating composition comprising one or more sources of copper ions, one or more pyridinium compounds, one or more complexing agents, one or more reducing agents, and, optionally, one or more pH adjusting agents, wherein a pH of the electroless copper plating composition is greater than 7. 
     
     
         2 . The electroless copper plating composition of  claim 1 , wherein the one or more pyridinium compounds or salts thereof are in amounts of at least 0.5 ppm. 
     
     
         3 . The electroless copper plating composition of  claim 1 , wherein the one or more pyridinium compounds have a formula: 
       
         
           
           
               
               
           
         
         wherein R 1  is selected from the group consisting of linear or branched, substituted or unsubstituted (C 1 -C 10 )alkyl, substituted or unsubstituted (C 6 -C 10 )aryl, substituted or unsubstituted (C 6 -C 10 ) heterocyclic aromatic group and substituted or unsubstituted benzyl; and R 2  is selected from the group consisting of hydrogen, hydroxyl, sulfate, amino, carbonyl, carboxyl, vinyl and amide. 
       
     
     
         4 . The electroless copper plating composition of  claim 1 , wherein the one or more complexing agents are chosen from sodium potassium tartrate, sodium tartrate, sodium salicylate, sodium salts of ethylenediamine tetraacetic acid, nitriloacetic acid and its alkali metal salts, gluconic acid, gluconates, triethanolamine, modified ethylene diamine tetraacetic acids, S,S-ethylene diamine disuccinic acid, hydantoin and hydantoin derivatives. 
     
     
         5 . The electroless copper plating composition of  claim 1 , wherein the one or more reducing agents are chosen from aldehydes, borohydrides, substituted borohydrides, boranes, saccharides, and hypophosphite. 
     
     
         6 . The electroless copper plating composition of  claim 1 , further comprising one or more compounds chosen from secondary accelerators, grain refiners and stabilizers. 
     
     
         7 . A method of electroless copper plating comprising:
 a) providing a substrate comprising a dielectric;   b) applying a catalyst to the substrate comprising the dielectric;   c) applying an electroless copper plating composition to the substrate comprising the dielectric, wherein the electroless copper plating composition comprises one or more sources of copper ions, one or more pyridinium compounds, one or more complexing agents, one or more reducing agents, and, optionally, one or more pH adjusting agents, wherein a pH of the electroless copper plating composition is greater than 7; and   d) electroless plating copper on the substrate comprising the dielectric with the electroless copper plating composition.   
     
     
         8 . The method of  claim 7 , wherein the one or more pyridinium compounds or salts thereof are in amounts of at least 0.5 ppm. 
     
     
         9 . The method of  claim 7 , wherein the electroless copper plating composition further comprises one or more compounds chosen from stabilizers and secondary accelerators. 
     
     
         10 . The method of  claim 7 , wherein the electroless copper plating composition is at 40° C. or less. 
     
     
         11 . The method of  claim 7 , wherein the catalyst is a palladium catalyst.