Manufacturing method of light-emitting device

Abstract

A manufacturing method of a light-emitting device is provided. A substrate and a light-emitting component disposed on the substrate are provided. A translucent layer is provided. The translucent layer is connected with the light-emitting component by an adhesive layer. A reflective layer is formed above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. A translucent encapsulant is formed on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer.

What is claimed is: 
     
         1 . A manufacturing method of a light-emitting device, comprises:
 providing a substrate and a light-emitting component disposed on the substrate;   providing a translucent layer;   connecting the translucent layer with the light-emitting component by an adhesive layer;   forming a reflective layer above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer; and   forming a translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer.   
     
     
         2 . The manufacturing method according to  claim 1 , wherein before the step of forming the reflective layer above the substrate, the manufacturing method further comprises:
 forming a first singulation path passing through the translucent layer to form the lateral surface of the translucent layer;   wherein after the step of forming the reflective layer above the substrate, the manufacturing method further comprises:
 forming a second singulation path passing through the reflective layer to form a light-emitting chip; 
 disposing the light-emitting chip on the substrate; 
 wherein in the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the translucent encapsulant encapsulates the light-emitting chip. 
   
     
     
         3 . The manufacturing method according to  claim 2 , wherein after the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the manufacturing method further comprises:
 forming a third singulation path passing through the substrate.   
     
     
         4 . The manufacturing method according to  claim 2 , wherein after the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the manufacturing method further comprises:
 forming a third singulation path passing through the translucent encapsulant and the substrate, wherein the translucent encapsulant and the substrate each forms a lateral surface, and the lateral surface of the translucent encapsulant and the lateral surface of the substrate are substantially aligned or flush with each other.   
     
     
         5 . The manufacturing method according to  claim 1 , wherein before the step of forming the reflective layer above the substrate, the manufacturing method further comprises:
 forming a first singulation path passing through the reflective layer to form the lateral surface of the reflective layer;   wherein after the step of forming the reflective layer above the substrate, the manufacturing method further comprises:
 forming a second singulation path passing through the reflective layer and the adhesive layer to form a light-emitting chip; 
 disposing the light-emitting chip on the substrate; 
   wherein in the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the translucent encapsulant encapsulates the light-emitting chip.   
     
     
         6 . The manufacturing method according to  claim 5 , wherein in the step of forming the second singulation path passing through the reflective layer and the adhesive layer to form the light-emitting chip and remove the adhesive layer formed on the lateral surface of the light-emitting component.