Copper and/or copper oxide dispersion, and electroconductive film formed using dispersion

Abstract

A copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor. The copper and/or copper oxide dispersion contains 0.50-60 mass % of copper and/or copper oxide microparticles and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass % of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20° C.; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20° C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate.

1 . An electroconductive film laminate comprising a copper-containing electroconductive film laminated on a substrate, wherein the electroconductive film is formed by printing a copper and/or copper oxide dispersion containing copper and/or copper oxide microparticles in an amount of between 0.50 mass % and 60 mass %, inclusive relative to the total mass of the dispersion, as well as the following (1) to (4):
 (1) a fluorine-containing surfactant that modifies a surface free energy of the dispersion, in an amount of between 0.10 mass % and 2.0 mass %, inclusive relative to the total mass of the dispersion,   (2) an organic dispersing agent having a phosphate group and a number average molecular weight (Mn) of 300 to 30000, in an amount of between 0.10 mass % and 20 mass %, inclusive relative to the total mass of the dispersion,   (3) a dispersing medium having a vapor pressure of 0.010 Pa or higher and lower than 20 Pa at 20° C., in an amount of between 0.050 mass % and 10 mass %, inclusive relative to the total mass of the dispersion, and   (4) a dispersing medium having a vapor pressure of between 20 Pa and 150 hPa, inclusive, relative to the total mass of the dispersion, at 20° C.,   wherein the dispersion has a surface free energy of no greater than 40 mN/m at 25° C.   
     
     
         2 . The electroconductive film laminate according to  claim 1 , wherein an area of the electroconductive film laminate has a diameter of 7 inches or greater, calculated as a circle. 
     
     
         3 . The electroconductive film laminate according to  claim 1 , wherein the printing is reverse printing. 
     
     
         4 . The electroconductive film laminate according to  claim 1 , wherein a minimum line width of the electroconductive film is between 0.10 μm and 30 μm, inclusive, and a minimum space width is between 0.10 μm and 30 μm, inclusive. 
     
     
         5 . An electroconductive film laminate comprising a copper-containing electroconductive film laminated on a substrate, wherein the electroconductive film is formed by printing a copper and/or copper oxide dispersion containing copper and/or copper oxide microparticles in an amount of between 0.50 mass % and 60.0 mass %, inclusive relative to the total mass of the dispersion, and the following (1) to (4):
 (1) a fluorine-containing surfactant that modifies a surface free energy of the dispersion in an amount of between 0.10 mass % and 2.0 mass %, inclusive relative to the total mass of the dispersion,   (2) an organic dispersing agent having a phosphate group and a number average molecular weight (Mn) of 300 to 30000, in an amount of between 0.10 mass % and 20 mass %, inclusive relative to the total mass of the dispersion,   (3) a polyhydric alcohol having 10 or less carbon atoms in an amount of between 0.050 mass % and 10 mass %, inclusive relative to the total mass of the dispersion, and   (4) a monoalcohol having 10 or less carbon atoms,   wherein the dispersion has a surface free energy of no greater than 40 mN/m at 25° C.   
     
     
         6 . The electroconductive film laminate according to  claim 5 , wherein an area of the electroconductive film laminate has a diameter of 7 inches or greater, calculated as a circle. 
     
     
         7 . The electroconductive film laminate according to  claim 5 , wherein the printing is reverse printing. 
     
     
         8 . The electroconductive film laminate according to  claim 5 , wherein a minimum line width of the electroconductive film is between 0.10 μm and 30 μm, inclusive, and a minimum space width is between 0.10 μm and 30 μm, inclusive. 
     
     
         9 . A transistor including a gate electrode, a source electrode, a drain electrode, an insulating layer and a semiconductor layer, wherein at least one electrode from among the gate electrode, source electrode and drain electrode is the electroconductive film according to  claim 1 . 
     
     
         10 . A transistor including a gate electrode, a source electrode, a drain electrode, an insulating layer and a semiconductor layer, wherein at least one electrode from among the gate electrode, source electrode and drain electrode is the electroconductive film according to  claim 5 . 
     
     
         11 . An electroconductive film which is formed through a printing process of a copper and/or copper oxide dispersion containing copper and/or copper oxide microparticles in an amount of between 0.50 mass % and 60.0 mass %, inclusive relative to the total mass of the dispersion, and the following (1) to (4):
 (1) a fluorine-containing surfactant that modifies a surface free energy of the dispersion in an amount of between 0.10 mass % and 2.0 mass %, inclusive relative to the total mass of the dispersion,   (2) an organic dispersing agent having a phosphate group and a number average molecular weight (Mn) of 300 to 30000, in an amount of between 0.10 mass % and 20 mass %, inclusive relative to the total mass of the dispersion,   (3) a polyhydric alcohol having 10 or less carbon atoms in an amount of between 0.050 mass % and 10 mass %, inclusive relative to the total mass of the dispersion, and   (4) a monoalcohol having 10 or less carbon atoms,   wherein the dispersion has a surface free energy of no greater than 40 mN/m at 25° C.   
     
     
         12 . An electroconductive film which is formed through a printing process of a copper and/or copper oxide dispersion containing copper and/or copper oxide microparticles in an amount of between 0.50 mass % and 60 mass %, inclusive relative to the total mass of the dispersion, as well as the following (1) to (4):
 (1) a fluorine-containing surfactant that modifies a surface free energy of the dispersion, in an amount of between 0.10 mass % and 2.0 mass %, inclusive relative to the total mass of the dispersion,   (2) an organic dispersing agent having a phosphate group and a number average molecular weight (Mn) of 300 to 30000, in an amount of between 0.10 mass % and 20 mass %, inclusive relative to the total mass of the dispersion,   (3) a dispersing medium having a vapor pressure of 0.010 Pa or higher and lower than 20 Pa at 20° C., in an amount of between 0.050 mass % and 10 mass %, inclusive relative to the total mass of the dispersion, and   (4) a dispersing medium having a vapor pressure of between 20 Pa and 150 hPa, inclusive, relative to the total mass of the dispersion, at 20° C.,   wherein the dispersion has a surface free energy of no greater than 40 mN/m at 25° C.   
     
     
         13 . A coated film obtained by printing a copper and/or copper oxide dispersion on a substrate,
 wherein the copper and/or copper oxide dispersion contains copper and/or copper oxide microparticles in an amount of between 0.50 mass % and 60 mass %, inclusive relative to the total mass of the dispersion, as well as the following (1) to (4):   (1) a fluorine-containing surfactant that modifies a surface free energy of the dispersion, in an amount of between 0.10 mass % and 2.0 mass %, inclusive relative to the total mass of the dispersion,   (2) an organic dispersing agent having a phosphate group and a number average molecular weight (Mn) of 300 to 30000, in an amount of between 0.10 mass % and 20 mass %, inclusive relative to the total mass of the dispersion,   (3) a dispersing medium having a vapor pressure of 0.010 Pa or higher and lower than 20 Pa at 20° C., in an amount of between 0.050 mass % and 10 mass %, inclusive relative to the total mass of the dispersion, and   (4) a dispersing medium having a vapor pressure of between 20 Pa and 150 hPa, inclusive, relative to the total mass of the dispersion, at 20° C.,   wherein the dispersion has a surface free energy of no greater than 40 mN/m at 25° C.   
     
     
         14 . A method of producing a dispersion of copper and/or copper oxide, comprising combining copper and/or copper oxide microparticles, a fluorine-containing surfactant, a dispersing agent having a phosphate group, and a dispersing medium. 
     
     
         15 . The method according to  claim 14 , wherein:
 an amount of the copper and/or copper oxide microparticles is between 0.50 mass % and 60 mass %, inclusive relative to the total mass of the dispersion,   an amount of the fluorine-containing surfactant is between 0.10 and 2.0 mass %, inclusive relative to the total mass of the dispersion,   an amount of the dispersing agent having a phosphate group is between 0.10 and 20 mass %, inclusive relative to the total mass of the dispersion, and   the dispersing medium comprises:
 a dispersing medium having a vapor pressure of 0.010 Pa or higher and lower than 20 Pa at 20° C., in an amount of between 0.050 mass % and 10 mass %, inclusive relative to the total mass of the dispersion, and 
 a dispersing medium having a vapor pressure of between 20 Pa and 150 hPa, inclusive relative to the total mass of the dispersion, at 20° C. 
   
     
     
         16 . A transistor including a gate electrode, a source electrode, a drain electrode, an insulating layer and a semiconductor layer, wherein at least one electrode from among the gate electrode, source electrode and drain electrode is an electroconductive film formed by reverse printing of a copper and/or copper oxide dispersion containing copper and/or copper oxide microparticles in an amount of between 0.50 mass % and 60 mass %, inclusive relative to the total mass of the dispersion, as well as the following (1) to (4):
 (1) a fluorine-containing surfactant that modifies a surface free energy of the dispersion, in an amount of between 0.10 mass % and 2.0 mass %, inclusive relative to the total mass of the dispersion,   (2) an organic dispersing agent having a phosphate group and a number average molecular weight (Mn) of 300 to 30000, in an amount of between 0.10 mass % and 20 mass %, inclusive relative to the total mass of the dispersion,   (3) a dispersing medium having a vapor pressure of 0.010 Pa or higher and lower than 20 Pa at 20° C., in an amount of between 0.050 mass % and 10 mass %, inclusive relative to the total mass of the dispersion, and   (4) a dispersing medium having a vapor pressure of between 20 Pa and 150 hPa, inclusive, relative to the total mass of the dispersion, at 20° C.,   wherein the dispersion has a surface free energy of no greater than 40 mN/m at 25° C.