Integrated Circuitry and Methods for Manufacturing Same

Abstract

Processes for manufacturing cellulose based integrated circuitry constructions are provided, the processes can include providing a first substrate having a plurality of vias; providing a first conductive material to the one surface of the substrate; providing adhesive to the other surface; providing a monolithic electronic component to the other surface; providing a second conductive material to the other surface and the monolithic electronic component; providing a backing material to the other surface of the substrate; and providing a second substrate to the backing material to form the construction. A cellulose based integrated circuitry constructions are provided that can include, comprising a first cellulose substrate having one surface opposing another surface and defining a plurality of vias between the surfaces; a first conductive material along the one surface and extending through the vias; a monolithic electronic component on the other surface; and a second conductive material along the other surface and conductively connecting the first conductive material with the monolithic electronic component; and/or a pair of cellulose substrates having a monolithic electronic component therebetween; and backing material between the substrates, the backing material defining a recess and receiving the monolithic electronic component.

1 - 14 . (canceled) 
     
     
         15 . A cellulose based integrated circuitry construction comprising:
 a first cellulose substrate having one surface opposing another surface and defining a plurality of vias between the surfaces;   a first conductive material along the one surface and extending through the vias;   a monolithic electronic component on the other surface; and   a second conductive material along the other surface and conductively connecting the first conductive material with the monolithic electronic component.   
     
     
         16 . The integrated circuitry of  claim 15  further comprising adhesive coupling the monolithic electronic component to the other surface, the adhesive defining a concave surface. 
     
     
         17 . The integrated circuitry of  claim 15  further comprising a second cellulose substrate coupled to the first cellulose substrate. 
     
     
         18 . The integrated circuitry of  claim 17  further comprising a backing material between the substrates. 
     
     
         19 . The integrated circuitry of  claim 17  further comprising adhesive material extending over the monolithic electronic component and second conductive material. 
     
     
         20 . A cellulose based integrated circuitry construction comprising:
 a pair of cellulose substrates having a monolithic electronic component therebetween; and   at least one of the substrates defining a recess and receiving the monolithic electronic component.   
     
     
         21 . The integrated circuitry of  claim 20  further comprising adhesive coupling the monolithic electronic component to one of the substrates. 
     
     
         22 . The integrated circuitry of  claim 21  wherein the monolithic electronic component is substantially rectangular and the adhesive extends to the perimeter walls of the monolithic electronic component. 
     
     
         23 . The integrated circuitry of  claim 21  further comprising conductive material between the substrates. 
     
     
         24 . The integrated circuitry of  claim 23  wherein the conductive material extends from corners of the monolithic electronic component along the substrates and defines lines of conductive material.