US2019360759A1PendingUtilityA1
Permeable membrane microchannel heat sinks and methods of making
Assignee: PURDUE RESEARCH FOUNDATIONPriority: May 25, 2018Filed: May 24, 2019Published: Nov 28, 2019
Est. expiryMay 25, 2038(~11.8 yrs left)· nominal 20-yr term from priority
B33Y 80/00H10W 40/47B22F 5/10B22F 10/28F28F 2260/02F28D 2015/0225F28D 15/02F28F 3/12Y02P10/25
50
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Claims
Abstract
Permeable membrane microchannel heat sinks and methods of producing such a heat sink, wherein such a heat sink includes a base and at least first and second microchannels defined by at least one porous and permeable membrane that is on the base and defines primary heat exchange surfaces of the heat sink. The membrane has opposing faces exposed to the first and second microchannels, and a fluid flowing through the heat sink flows from the first microchannel to the second microchannel through pores in the membrane.
Claims
exact text as granted — not AI-modified1 . A heat sink comprising a base and at least first and second microchannels defined by at least one porous and permeable membrane that is on the base and defines primary heat exchange surfaces of the heat sink, the membrane having opposing faces exposed to the first and second microchannels, and an entirety of a fluid flowing through the first microchannel flows from the first microchannel to the second microchannel through pores in the membrane therebetween.
2 . The heat sink of claim 1 , wherein the membrane has a nonlinear horizontal profile.
3 . The heat sink of claim 2 , wherein the nonlinear horizontal profile of the membrane approximates a sine wave.
4 . The heat sink of claim 1 , wherein the membrane has a nonlinear vertical profile.
5 . The heat sink of claim 4 , wherein the membrane is not perpendicular to the base.
6 . The heat sink of claim 1 , further comprising at least one fluid inlet fluidically connected to at least the first microchannel and at least one fluid outlet fluidically connected to at least the second microchannel.
7 . The heat sink of claim 6 , wherein the inlet is fluidically connected to only the first microchannel.
8 . The heat sink of claim 6 , wherein the inlet is fluidically connected to the first microchannel and at least another microchannel of the heat sink.
9 . The heat sink of claim 6 , wherein the outlet is fluidically connected to only the second microchannel.
10 . The heat sink of claim 6 , wherein the outlet is fluidically connected to the second microchannel and at least another microchannel of the heat sink.
11 . The heat sink of claim 1 , wherein the first and second microchannels define flowpaths that are parallel to each other.
12 . The heat sink of claim 1 , wherein the first and second microchannels and the membrane are disposed in a single tier on the base and the membrane is contiguous with and projects away from the base.
13 . The heat sink of claim 1 , further comprising an electronic device in thermal contact with the base of the heat sink, and the fluid is flowing through the heat sink to absorb and transfer heat from the source by conductive heat transfer from the source to the membrane and then convective heat transfer from the membrane to the fluid.
14 . A method of fabricating the heat sink of claim 1 , the method comprising an additive manufacturing technology.
15 . The method of claim 14 , wherein the additive manufacturing technology comprises direct metal laser sintering.Join the waitlist — get patent alerts
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