Chemical vapor deposition apparatus and method of forming film

Abstract

The present invention relates to a chemical vapor deposition apparatus for forming a film on a surface of a substrate(6) held in a reaction container, wherein the reaction container includes a first holding member(4) that is capable of holding the substrate(6) and a second holding member(5) that is capable of holding the substrate(6) independently from the first holding member(4), and at least one holding member among the first holding member(4) and the second holding member(5) is movable in a vertical direction. In addition, a method of forming a film of the present invention includes a first step of holding a substrate(6) by a first holding member(4) to form a film on a surface of a substrate by chemical vapor deposition; a second step of moving at least one holding member among the first holding member(4) and the second holding member(5) in at least one direction of the upper direction and the lower direction to hold the substrate by the second holding member(5); and a third step of forming a film on the surface of the substrate(6) held by the second holding member(5) by the chemical vapor deposition. According to the present invention, there is provided a chemical vapor deposition apparatus and a method of forming a film which are capable of forming a film on the entire surface of a substrate by one film formation.

1 . A chemical vapor deposition apparatus for forming a film on a surface of a substrate held in a reaction container,
 wherein a holding device for holding one or more substrates is provided in the reaction container,   the holding device has one or more holding structures for holding one substrate,   the holding structure includes at least a first holding member that is capable of holding the substrate and a second holding member that is capable of holding the substrate independently from the first holding member, and   at least one holding member among the first holding member and the second holding member is movable in a vertical direction.   
     
     
         2 . The chemical vapor deposition apparatus according to  claim 1 ,
 wherein the first holding member and the second holding member are changeable to each other as a holding member that holds the substrate.   
     
     
         3 . The chemical vapor deposition apparatus according to  claim 1 ,
 wherein a position of a supporting point of the substrate being in contact with the holding member is changeable during film formation.   
     
     
         4 . The chemical vapor deposition apparatus according to  claim 1 ,
 wherein the holding structure causes the substrate to rotate.   
     
     
         5 . The chemical vapor deposition apparatus according to  claim 1 ,
 wherein the holding structure causes the substrate to move in a horizontal direction.   
     
     
         6 . The chemical vapor deposition apparatus according to  claim 1 ,
 wherein the first holding member and the second holding member are in contact with the substrate at two or more supporting points.   
     
     
         7 . The chemical vapor deposition apparatus according to  claim 1 ,
 wherein an effective contact area per one supporting point of the first holding member with the substrate and an effective contact area per one supporting point of the second holding member with the substrate each are 20 mm 2  or smaller.   
     
     
         8 . A method of forming a film on a surface of a substrate by chemical vapor deposition in a reaction container provided with at least a first holding member that is capable of holding the substrate and a second holding member that is capable of holding the substrate independently from the first holding member, the method comprising:
 (a) forming a film on the surface of the substrate by chemical vapor deposition while holding the substrate by the first holding member;   (b) moving at least one holding member among the first holding member and the second holding member in at least one direction of the upper direction and the lower direction to hold the substrate by the second holding member instead of the first holding member; and   (c) forming a film on the surface of the substrate held by the second holding member by chemical vapor deposition.   
     
     
         9 . The method of forming a film according to  claim 8 ,
 wherein steps (a) to (c) are performed during film formation.