Wiring board and method for manufacturing same

Abstract

The present invention addresses the problem of reducing a delay time difference between signals transmitted by means of a differential signal wires in a wiring board having glass cloth. A wiring board comprises: an insulating layer which includes fibers having a planar shape with translational symmetry with respect to two linearly independent, predetermined translational vectors, and a layer-like insulating material encapsulating the fibers; and through-holes formed at the starting and end points of a vector which is the sum of substantially integral multiples of the two translational vectors and which has the starting point on the planar shape.

What is claimed is: 
     
         1 . A wiring board comprising:
 an insulating layer including a fabric having a planar shape that is translationally symmetric with respect to predetermined two linearly independent translation vectors and a layered insulating material encapsulating the fabric; and   through-holes formed at starting and end points of a vector that is a sum of substantially integral multiples of each of the two translation vectors and has a starting point on the planar shape.   
     
     
         2 . The wiring board according to  claim 1 , wherein the two translation vectors are substantially perpendicular. 
     
     
         3 . The wiring board according to  claim 1 , further comprising ground through-holes each provided on a line extended from the vector with a distance substantially equal to the vector from each of the through-holes at the starting and end points. 
     
     
         4 . The wiring board according to  claim 1 , wherein a plurality of the insulating layers are stacked. 
     
     
         5 . The wiring board according to  claim 4 , further comprising:
 a pair of first wires provided substantially in parallel on a surface of the insulating layer; and   a pair of second wires provided substantially in parallel on a surface of another insulating layer,   wherein:   one of the pair of first wires and one of the pair of second wires connect to the through-hole at the starting point; and   another of the pair of first wires and another of the pair of second wires connect to the through-hole at the end point.   
     
     
         6 . The wiring board according to  claim 5 , wherein
 a set of the one of the pair of first wires, the one of the pair of second wires, and the through-hole at the starting point, and   a set of the another of the pair of first wires, the another of the pair of second wires, and the through-hole at the end point transmit differential signals.   
     
     
         7 . A wiring board manufacturing method comprising:
 forming an insulating layer by disposing a fabric that has a planar shape that is translationally symmetric with respect to predetermined two linearly independent translation vectors and encapsulating the fabric by a layered insulating material; and   forming through-holes at starting and end points of a vector that is a sum of substantially integral multiples of each of the two translation vectors and has a starting point on the planar shape.   
     
     
         8 . The wiring board manufacturing method according to  claim 7 , wherein the two translation vectors are substantially perpendicular. 
     
     
         9 . The wiring board manufacturing method according to  claim 7 , further comprising forming each of ground through-holes on a line extended from the vector with a distance substantially equal to the vector from each of the through-holes at the starting and end points. 
     
     
         10 . The wiring board manufacturing method according to  claim 7 , further comprising stacking a plurality of the insulating layers. 
     
     
         11 . The wiring board manufacturing method according to  claim 10 , further comprising:
 forming a pair of first wires substantially in parallel on a surface of the insulating layer;   forming a pair of second wires substantially in parallel on a surface of another insulating layer;   connecting one of the pair of first wires and one of the pair of second wires to the through-hole at the starting point; and   connecting another of the pair of first wires and another of the pair of second wires to the through-hole at the end point.   
     
     
         12 . The wiring board manufacturing method according to  claim 11 , wherein a set of the one of the pair of first wires, the one of the pair of second wires, and the through-hole at the starting point, and a set of the another of the pair of first wires, the another of the pair of second wires, and the through-hole at the end point transmit differential signals. 
     
     
         13 . The wiring board according to  claim 2 , further comprising ground through-holes each provided on a line extended from the vector with a distance substantially equal to the vector from each of the through-holes at the starting and end points. 
     
     
         14 . The wiring board according to  claim 2 , wherein a plurality of the insulating layers are stacked. 
     
     
         15 . The wiring board according to  claim 3 , wherein a plurality of the insulating layers are stacked. 
     
     
         16 . The wiring board according to  claim 13 , wherein a plurality of the insulating layers are stacked. 
     
     
         17 . The wiring board manufacturing method according to  claim 8 , further comprising forming each of ground through-holes on a line extended from the vector with a distance substantially equal to the vector from each of the through-holes at the starting and end points. 
     
     
         18 . The wiring board manufacturing method according to  claim 8 , further comprising stacking a plurality of the insulating layers. 
     
     
         19 . The wiring board manufacturing method according to  claim 9 , further comprising stacking a plurality of the insulating layers. 
     
     
         20 . The wiring board manufacturing method according to  claim 17 , further comprising stacking a plurality of the insulating layers.