Led package and method for manufacturing same

Abstract

Provided is an LED package and a method for manufacturing the same wherein, if its sealing resin containing phosphor particles each having a coating layer is cut or ground, age deterioration of the phosphor particles in the cut or ground surface is prevented. The method includes: mounting LED elements on a substrate; filling a first resin on the substrate to seal the LED elements, the first resin being transparent or translucent and containing wavelength conversion particles configured by forming a coating layer on at least part of the surface of each phosphor particle which converts the wavelength of light emitted from the LED elements; cutting or grinding the first resin; and forming a protective layer with a second resin on a cut surface of the first resin exposed as a result of the cutting or on a ground surface of the first resin, the second resin not containing the wavelength conversion particles.

1 . A method for manufacturing an LED package, comprising the steps of:
 mounting LED elements on a substrate;   filling a first resin on the substrate to seal the LED elements, the first resin being transparent or translucent and containing wavelength conversion particles configured by forming a coating layer on at least part of the surface of each phosphor particle which converts the wavelength of light emitted from the LED elements;   cutting or grinding the first resin; and   forming a protective layer with a second resin on a cut surface of the first resin exposed as a result of the cutting or on a ground surface of the first resin, the second resin not containing the wavelength conversion particles.   
     
     
         2 . The method according to  claim 1 , wherein
 the first resin is cut in the cutting or grinding step,   the cut surface is a side surface of the first resin, and   the second resin is applied to the side surface of the first resin in the forming step.   
     
     
         3 . The method according to  claim 1 , wherein
 in the cutting or grinding step, the first resin is cut while the substrate is left uncut,   the cut surface is a side surface of the first resin, and   the forming step comprises filling the second resin into a groove of the first resin formed by cutting the first resin, curing the second resin, and entirely cutting the cured second resin and the substrate in the thickness direction thereof, thereby obtaining diced LED packages wherein the side surface of the first resin is coated with the second resin.   
     
     
         4 . The method according to  claim 1 , wherein
 an upper surface of the first resin is ground in the cutting or grinding step, and   the protective layer is formed on the upper surface of the first resin in the forming step.   
     
     
         5 . The method according to  claim 1 , wherein
 the LED elements are blue LED elements emitting blue light, and   the phosphor particles are particles of KSF phosphor absorbing part of the blue light to emit red light.   
     
     
         6 . An LED package comprising:
 a substrate;   an LED element mounted on the substrate;   a first resin filled on the substrate to seal the LED element, the first resin being transparent or translucent and containing wavelength conversion particles configured by forming a coating layer on at least part of the surface of each phosphor particle which converts the wavelength of light emitted from the LED element; and   a protective layer covering a surface of the first resin and made of a second resin not containing the wavelength conversion particles, wherein   the surface of the first resin includes broken surfaces of the wavelength conversion particles whose coating layers are cut.   
     
     
         7 . The LED package according to  claim 6 , wherein the second resin contains a scattering agent. 
     
     
         8 . The LED package according to  claim 6 , wherein the second resin is a transparent or translucent resin.