Thermal Buffer Device and Installation Method Therefor
Abstract
A thermal buffer device and installation method therefor are disclosed. The device includes a body and a fastening system. The body has a substantially planar rear surface, is generally cubic in shape, and is formed from a solid piece of thermally insulating material. The fastening system secures the rear surface of the body against an attachment surface within a temperature controlled enclosure, where the attachment surface is at a location in the enclosure selected for temperature monitoring. A temperature probe inserts into the body. The device is designed to resist air temperature changes in the temperature controlled enclosures in which the device is installed (i.e. to operate as a temperature buffer). In a preferred embodiment, the fastening system enables positive mechanical mounting of the device within the temperature controlled enclosures.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A thermal buffer device of a temperature monitoring system, the device comprising:
a body including a substantially planar rear surface, wherein the body is formed from a solid piece of thermally insulating material; and a fastening system for securing the rear surface of the body against an attachment surface within a temperature controlled enclosure, wherein the attachment surface is at a location in the enclosure selected for temperature monitoring.
2 . The thermal buffer device of claim 1 , wherein the body is generally cubic in shape.
3 . The thermal buffer device of claim 1 , wherein the fastening system provides positive mechanical mounting of the thermal buffer device.
4 . The thermal buffer device of claim 1 , wherein the fastening system includes one or more screws that are introduced into thru-holes of the body, at a front surface of the body that opposes the rear surface, and wherein heads of the screws are countersunk below a plane of the front surface to secure the rear surface of the body against the attachment surface.
5 . The thermal buffer device of claim 1 , wherein the attachment surface is substantially planar.
6 . The thermal buffer device of claim 1 , wherein the attachment surface is stationary.
7 . The thermal buffer device of claim 1 , wherein the fastening system includes pieces of hook and loop fastening material affixed to the rear surface of the body and the attachment surface.
8 . The thermal buffer device of claim 1 , wherein the body has a front surface that includes a logo.
9 . The thermal buffer device of claim 1 , wherein the temperature controlled enclosure is a refrigerated enclosure.
10 . The thermal buffer device of claim 1 , wherein the temperature controlled enclosure is a heated enclosure.
11 . The thermal buffer device of claim 1 , wherein the temperature controlled enclosure is a room within a premises.
12 . The thermal buffer device of claim 1 , wherein the thermally insulating material is polyethylene.
13 . A method of installation for a thermal buffer device of a temperature monitoring system, the method comprising:
identifying a temperature controlled enclosure; selecting a location in the temperature controlled enclosure for temperature monitoring and an attachment surface at the monitored location; placing a substantially planar rear surface of a body of the thermal buffer device to be disposed towards the attachment surface; and securing the rear surface of body against the attachment surface.
14 . The method of claim 13 , further comprising the body of thermal buffer device being substantially cubic in shape.
15 . The method of claim 13 , wherein securing the rear surface of body against the attachment surface is accomplished via a fastening system of the thermal buffer device.
16 . The method of claim 13 , wherein securing the rear surface of the body against the attachment surface comprises:
using screws as the fastening system, by introducing the screws from a front surface of the body into thru-holes of the body, the front surface opposing the rear surface; and tightening the screws.
17 . The method of claim 13 , wherein selecting an attachment surface at the monitored location comprises identifying surfaces at the monitored location, and selecting a surface that is substantially planar.
18 . The method of claim 13 , wherein selecting an attachment surface at the monitored location comprises identifying surfaces near the monitored location, and selecting a surface that is stationary.
19 . The method of claim 13 , further comprising the temperature controlled enclosure being a refrigerated enclosure.
20 . The method of claim 13 , further comprising the temperature controlled enclosure being a heated enclosure.Join the waitlist — get patent alerts
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