Sacrificial layer for electrochromic device fabrication

Abstract

Methods for protecting transparent electronically conductive layers on glass substrates are described herein. Methods include depositing a sacrificial coating during deposition of the transparent electronically conductive layer, before packing the glass substrate for storage or shipping, after unpacking glass substrates from a stack of glass substrates, and/or after a washing operation prior to fabricating an electrochromic stack on the transparent electronically conductive layer. Methods also include removing the sacrificial coating during a washing operation, during tempering, or prior to depositing an electrochromic stack by, e.g., heating the sacrificial coating or exposing the sacrificial coating to an inert plasma.

1 . A method of manufacturing an electrochromic device comprising an electrochromic stack between a first and a second transparent electronically conductive layer configured to deliver an electrical potential difference over surfaces of the electrochromic stack and thereby cause optical switching of the electrochromic device, the method of manufacturing comprising:
 depositing a sacrificial coating over a substrate, the substrate comprising the first transparent electronically conductive layer; and   prior to coating a glass substrate with the second transparent electronically conductive layer of the electrochromic stack, removing the sacrificial coating.   
     
     
         2 . The method of  claim 1 , wherein removing the sacrificial coating comprises heating the sacrificial coating to temperature between about 200° C. and about 700° C. 
     
     
         3 . (canceled) 
     
     
         4 . The method of  claim 1 , wherein removing the sacrificial coating comprises a wash operation conducted prior to coating the substrate with the second transparent electronically conductive layer. 
     
     
         5 . The method of  claim 1 , wherein removing the sacrificial coating comprises exposing the sacrificial coating to an acidic solution. 
     
     
         6 . The method of  claim 1 , wherein removing the sacrificial coating comprises exposing the sacrificial coating to a basic solution. 
     
     
         7 . (canceled) 
     
     
         8 . The method of any of  claim 1 , wherein removing the sacrificial coating comprises mechanically removing the sacrificial coating. 
     
     
         9 . (canceled) 
     
     
         10 . The method of  claim 1 , wherein removing the sacrificial coating is performed in a coater prior to depositing the electrochromic stack on the substrate. 
     
     
         11 . The method of  claim 10 , wherein removing the sacrificial coating comprises exposing the sacrificial coating to a plasma etching process. 
     
     
         12 . (canceled) 
     
     
         13 . (canceled) 
     
     
         14 . The method of  claim 1 , wherein removing the sacrificial coating comprises peeling the sacrificial coating from the substrate. 
     
     
         15 . (canceled) 
     
     
         16 . The method of  claim 1 , wherein depositing the sacrificial coating is performed in a first facility and removing the sacrificial coating is performed in a second facility. 
     
     
         17 . The method of  claim 1 , wherein the sacrificial coating comprises an organic or inorganic coating selected from the group consisting of acrylic materials, ceramic materials, adhesive materials, and vinyl material. 
     
     
         18 . The method of  claim 1 , wherein the sacrificial coating is doped with a metal element selected from the group consisting of iron and manganese. 
     
     
         19 . (canceled) 
     
     
         20 . The method of  claim 1 , further comprising depositing the first transparent electronically conductive layer before depositing the sacrificial coating. 
     
     
         21 . The method of  claim 1 , wherein further comprising packing the substrate into a stack with interleaving material after depositing the sacrificial coating. 
     
     
         22 . The method of  claim 1 , further comprising packing the substrate comprising the sacrificial coating into a stack without using interleaving material. 
     
     
         23 . The method of  claim 1 , further comprising, before depositing the sacrificial coating, unpacking the substrate from a stack of substrates comprising interleaving material, wherein the substrate comprises glass material. 
     
     
         24 . The method of  claim 1 , further comprising cutting the substrate after depositing the sacrificial coating. 
     
     
         25 . The method of  claim 1 , further comprising cutting, grinding, and washing the substrate before depositing the sacrificial coating. 
     
     
         26 . The method of  claim 1 , further comprising tempering the substrate before depositing the sacrificial coating. 
     
     
         27 . (canceled) 
     
     
         28 . The method of  claim 4 , further comprising, prior to removing the sacrificial coating, exposing the substrate comprising the sacrificial coating to a second wash operation without removing the sacrificial coating. 
     
     
         29 . (canceled) 
     
     
         30 . (canceled) 
     
     
         31 . The method of  claim 1 , further comprising depositing a second sacrificial coating and removing the second sacrificial coating, wherein the second sacrificial coating is deposited after removing the first sacrificial coating. 
     
     
         32 . The method of  claim 31 , wherein removing the second sacrificial coating comprises a second wash operation. 
     
     
         33 . The method of  claim 31 , wherein removing the second sacrificial coating exposing the sacrificial coating to a second acidic solution. 
     
     
         34 . The method of  claim 31 , wherein removing the second sacrificial coating comprises exposing the sacrificial coating to a second basic solution. 
     
     
         35 . (canceled) 
     
     
         36 . The method of  claim 31 , wherein removing the second sacrificial coating comprises mechanically removing the sacrificial coating. 
     
     
         37 . The method of  claim 31 , wherein removing the second sacrificial coating is performed in a coater prior to depositing the electrochromic stack on the substrate. 
     
     
         38 . (canceled) 
     
     
         39 . (canceled) 
     
     
         40 . (canceled) 
     
     
         41 . The method of  claim 31 , wherein removing the second sacrificial coating comprises peeling the second sacrificial coating from the substrate. 
     
     
         42 . (canceled) 
     
     
         43 . A glass substrate for fabricating an electrochromic device, the glass substrate comprising a transparent electronically conductive layer and a sacrificial coating for protecting the transparent electronically conductive layer, the sacrificial coating comprising an organic or inorganic coating selected from the group consisting of acrylic materials, ceramic materials, adhesive materials, and vinyl material.