Selective dielectric resin application on circuitized core layers

Abstract

A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

What is claimed is: 
     
         1 . A circuitized core layer for multiple-layer printed circuit board manufacturing, the circuitized core layer comprising a partially cured dielectric resin disposed within a region associated with increased resin demand. 
     
     
         2 . The circuitized core layer of  claim 1 , wherein the partially cured dielectric resin is formed by:
 utilizing an inkjet printer to dispense a dielectric resin within the region; and   partially curing the dielectric resin.   
     
     
         3 . The circuitized core layer of  claim 1 , wherein the region associated with increased resin demand corresponds to an area between adjacent copper traces. 
     
     
         4 . The circuitized core layer of  claim 1 , wherein the region associated with increased resin demand is adjacent to a location of a plated through hole (PTH) to be formed after performing a lamination cycle to form a multiple-layer printed circuit board that includes the circuitized core layer. 
     
     
         5 . The circuitized core layer of  claim 1 , wherein the partially cured dielectric resin is substantially similar to a partially cured resin within a layer of pre-impregnated (prepreg) material adjacent to the region of the circuitized core layer in a layup that is laminated to form a multiple-layer printed circuit board that includes the circuitized core layer.