Light emitting diode package having series connected leds

Abstract

Light emitting diode packages as disclosed herein include a monolithic chip including at least a first and a second light emitting diode (LED) that are electrically coupled in series, wherein the first and the second LEDs each include at least one electrical terminal configured to be electrically coupled to a power source. The monolithic chip is mounted onto a connection substrate having first and second landing pads formed from metallic material and electrically isolated from each other. The monolithic chip is mounted to the connection substrate such that the electrical terminal of the first LED is electrically connected to the first landing pad and the electrical terminal of the second LED is electrically connected to the second landing pad. In an example, the monolithic chip includes a third and a fourth LED electrically coupled to each other in series, and electrically coupled to the first and second LEDs in parallel.

1 .- 20 . (canceled) 
     
     
         21 . A light emitting diode comprising:
 a monolithic chip including:
 at a first and a second light emitting diode (LED) that are electrically coupled in series, wherein the first and the second LEDs each include at least one electrical terminal extending along a common surface of the first and second LEDs and configured to be electrically coupled to a power source; and 
 a third and a fourth LED electrically coupled to each other in series, wherein the third LED is electrically coupled in parallel to the first LED, and wherein the fourth LED is electrically coupled in parallel to the second LED. 
   
     
     
         22 . The light emitting diode as recited in  claim 21 , wherein the third and fourth LEDs each include at least one electrical terminal extending along a common surface of the third and fourth LEDs and configured to be electrically coupled to a power source. 
     
     
         23 . The light emitting diode as recited in  claim 22 , wherein the first and third LEDs share a common first electrical terminal, and wherein the second and fourth LEDs share a common second electrical terminal. 
     
     
         24 . The light emitting diode as recited in  claim 23 , wherein the first electrical terminal is in electrical contact with all LEDs of the monolithic chip that are in parallel electrical connection with one another, and wherein the first electrical terminal extends along one underside location of the chip. 
     
     
         25 . The light emitting diode as recited in  claim 23 , wherein the second electrical terminal is in electrical contact with all LEDs of the monolithic chip that are in parallel electrical connection with one another and extends along one position of the chip, and wherein the second electrical terminal and extends along one underside location of the chip. 
     
     
         26 . The light emitting diode as recited in  claim 21 , wherein the chip comprises a first electrical terminal and a second electrical terminal disposed along an underside of the chip and separated from one another, wherein the first and second electrical terminals are each connected to respective LEDs that are in parallel electrical connection with one another. 
     
     
         27 . The light emitting diode as recited in  claim 26  wherein the first and second electrical terminals are positioned on the chip parallel with one another. 
     
     
         28 . The light emitting diode as recited in  claim 26  wherein the first electrical terminal is located along one edge of the chip and the second electrical terminal is located along a second opposed edge of the chip. 
     
     
         29 . The light emitting diode as recited in  claim 21  comprising a connection substrate having a first and second landing pad, wherein the electrical terminal of the first LED is in electrical connection with the first landing pad and the electrical terminal of the second LED is in electrical connection with the second landing pad. 
     
     
         30 . The light emitting diode as recited in  claim 29 , wherein the connection substrate first and second landing pads are electrically isolated from each other. 
     
     
         31 . A monolithic wafer comprising an array of flip chip light emitting diodes (LEDs) arranged in a number of rows extending along a first axis of the wafer, wherein the LEDs within each row are in series electrical connection with each other, wherein the LEDs at opposed ends of each row are in parallel electrical connection with one another extending along a second axis of the wafer, wherein array of LEDs is in series-parallel connection, wherein the monolithic wafer comprises first and second electrical terminals that extend along a common surface of the wafer and that are in electrical connection with the LEDs. 
     
     
         32 . The monolithic wafer as recited in  claim 31 , wherein the first electrical terminal extends along one of the wafer first axis or second axis, and the second electrical terminal extends along the other of the wafer first axis or second axis. 
     
     
         33 . The monolithic wafer as recited in  claim 31 , wherein the LEDs at the opposed ends of the rows are in electrical connection with the respective first and second electrical terminals. 
     
     
         34 . The monolithic wafer as recited in  claim 31  comprising a connection substrate in electrical connection with the array of LEDs, wherein the connection substrate is disposed along the common surface wafer comprising the first and second electrical terminals. 
     
     
         35 . The monolithic wafer as recited in  claim 34 , wherein the connection substrate comprises first and second landing pads that are in electrical connection with the respective first and second electrical terminals. 
     
     
         36 . The monolithic wafer as recited in  claim 35 , wherein the connection substrate comprises an electrically isolating material interposed between the first and second landing pads. 
     
     
         37 . A method for making a light emitting diode (LED) array comprising the steps of:
 forming a monolithic wafer comprising a number of LEDs each having P and N contacts;   forming two or more strings of LEDs, wherein the LEDs within each string have P and N contacts that are in series connection with one another; and   forming a parallel connection between the LEDs in the two or more strings by connecting together the P contacts of an LED from each string, and connecting together the N contact of an LED from each string.   
     
     
         38 . The method as recited in  claim 37  further comprising:
 forming a P terminal on the wafer that is in electrical connection with the parallel P contacts of the LEDs; and 
 forming an N terminal on a surface of the wafer common to the P terminal, wherein the N terminal is in electrical connection with the parallel N contacts of the LEDs. 
 
     
     
         39 . The method as recited in  claim 38  further comprising:
 forming an electrical connection between the P terminal and a first landing pad of a connection substrate disposed adjacent the wafer surface; and 
 forming an electrical connection between the N terminal and a second landing pad of the connection substrate. 
 
     
     
         40 . The method as recited in  claim 39 , wherein the connection substrate first landing pad and second landing pad are electrically isolated from one another.