Oled packaging structure and oled display panel

Abstract

An organic light emitting diode (OLED) packaging structure and an OLED display device are described. The OLED packaging structure includes a packaging substrate and a drying layer disposed on a surface of the packaging substrate and used to absorb water and oxygen gas. A fabricating material of the drying layer is a metal organic framework compound containing zinc, and the metal organic framework compound containing zinc is a porous structure.

1 . An organic light emitting diode (OLED) packaging structure, comprising:
 a packaging substrate; and   a drying layer disposed on a surface of the packaging substrate and used to absorb water and oxygen gas;   wherein a fabrication material of the drying layer is a metal organic framework compound containing zinc, the metal organic framework compound containing zinc is a porous structure, and a chemical formula of the metal organic framework compound containing zinc is ZnO 4 (BDC) 3 .   
     
     
         2 . The OLED packaging structure according to  claim 1 , wherein a specific surface area of the metal organic framework compound containing zinc is between 2900 m 2 /g and 3362 m 2 /g. 
     
     
         3 . The OLED packaging structure according to  claim 1 , wherein the metal organic framework compound containing zinc is formed by coordination bonding of a zinc ion with an organic ligand para-dicarboxylic acid. 
     
     
         4 . The OLED packaging structure according to  claim 1 , wherein the packaging substrate is a glass substrate, a side portion around the glass substrate is a protrusion portion, wherein the drying layer is disposed on a surface of the glass substrate, and the protrusion portion surrounds the drying layer. 
     
     
         5 . An organic light emitting diode (OLED) display panel, comprising a thin film transistor substrate;
 an OLED light-emitting layer disposed on a surface of the thin film transistor substrate;   an OLED packaging structure disposed above the OLED light-emitting layer, wherein the OLED packaging structure and the thin film transistor substrate form a closed chamber, so as to protect the OLED light-emitting layer;   a frame-sealing adhesive disposed on an edge region of the thin film transistor substrate to glue the thin film transistor substrate to the OLED packaging structure; and   wherein the OLED packaging structure comprises:
 a packaging substrate; and 
 a drying layer disposed on a surface of the packaging substrate and used to absorb water and oxygen gas, wherein the drying layer is disposed on a surface of the packaging structure to which the light-emitting layer is adjacent; 
 wherein a fabricating material of the drying layer is a metal organic framework compound containing zinc, the metal organic framework compound containing zinc is a porous structure. 
   
     
     
         6 . The OLED packaging structure according to  claim 5 , wherein a specific surface area of the metal organic framework compound containing zinc is between 2900 m 2 /g and 3362 m 2 /g. 
     
     
         7 . The OLED packaging structure according to  claim 5 , wherein the metal organic framework compound containing zinc is formed by coordination bonding of a zinc ion with an organic ligand para-dicarboxylic acid. 
     
     
         8 . The OLED packaging structure according to  claim 5 , wherein a chemical formula of the metal organic framework compound containing zinc is ZnO 4 (BDC) 3.    
     
     
         9 . The OLED packaging structure according to  claim 5 , wherein the packaging substrate is a glass substrate, a side portion around the glass substrate is a protrusion portion, the drying layer is disposed on a surface of the glass substrate, and the protrusion portion surrounds the drying layer, wherein the protrusion portion is glued to the thin film transistor substrate by the frame-sealing adhesive. 
     
     
         10 . An organic light emitting diode (OLED) packaging structure, comprising:
 a packaging substrate; and   a drying layer disposed on a surface of the packaging substrate and used to absorb water and oxygen gas;   wherein a fabricating material of the drying layer is a metal organic framework compound containing zinc, and the metal organic framework compound containing zinc is a porous structure.   
     
     
         11 . The OLED packaging structure according to  claim 10 , wherein a specific surface area of the metal organic framework compound containing zinc is between 2900 m 2 /g and 3362 m 2 /g. 
     
     
         12 . The OLED packaging structure according to  claim 10 , wherein the metal organic framework compound containing zinc is formed by coordination bonding of a zinc ion with an organic ligand para-dicarboxylic acid. 
     
     
         13 . The OLED packaging structure according to  claim 10 , wherein the packaging substrate is a glass substrate, a side portion around the glass substrate is a protrusion portion, wherein the drying layer is disposed on a surface of the glass substrate, and the protrusion portion surrounds the drying layer.