Wafer stacking for integrated circuit manufacturing

Abstract

A method of manufacturing integrated devices, and a stacked integrated device are disclosed. In an embodiment, the method comprises providing a substrate; mounting at least a first electronic component on the substrate; positioning a handle wafer above the first electronic component; attaching the first electronic component to the substrate via electrical connectors between the first electronic component and the substrate; and while attaching the first electronic component to the substrate, using the handle wafer to apply pressure, toward the substrate, to the first electronic component, to manage planarity of the first electronic component during the attaching. In an embodiment, a joining process is used to attach the first electronic component to the substrate via the electrical connectors. For example, thermal compression bonding may be used to attach the first electronic component to the substrate via the electrical connectors.

1 . A method of manufacturing integrated devices, comprising:
 providing a substrate;   mounting at least a first flat electronic component on the substrate, the first electronic component having a thickness less than about 20 μm;   positioning a handle wafer above the at least a first electronic component;   attaching the at least a first electronic component to the substrate via electrical connectors between the at least a first electronic component and the substrate; and   while attaching the at least a first electronic component to the substrate, using the handle wafer to apply a pressure, toward the substrate, to the at least a first electronic component, for co-planarity management to prevent the at least a first electronic component, having the thickness less than about 20 μm, from bending and to keep the first electronic component flat during said attaching the at least a first electronic component to the substrate.   
     
     
         2 . The method according to  claim 1 , wherein the attaching the at least a first electronic component to the substrate includes maintaining an open space directly between the first electronic component and the substrate while using the handle wafer to apply the pressure toward the substrate. 
     
     
         3 . The method according to  claim 2 , wherein the attaching the at least a first electronic component to the substrate further includes after using the handle wafer to apply the pressure toward the substrate, filling the open space directly between the at least a first electronic component and the substrate with an adhesive to further attach the at least a first electronic component to the substrate. 
     
     
         4 . The method according to  claim 3 , wherein the filling the open space directly between the at least a first electronic component and the substrate with an adhesive includes using a capillary underfill to fill said open space with the adhesive. 
     
     
         5 . The method according to  claim 3 , wherein the filling the open space directly between the at least a first electronic component and the substrate with an adhesive includes using a vacuum assisted underfill to fill said open space with the adhesive. 
     
     
         6 . The method according to  claim 1 , wherein:
 the attaching the at least a first electronic component to the substrate includes using thermal compression bonding to attach the at least a first electronic component to the substrate via the electrical connectors, including, in said thermal compression bonding, applying pressure to the electrical connectors by applying pressure to the handle wafer; and   the pressure applied to the handle wafer in the thermal compression bonding prevents the at least first electrical component from the bending during said attaching.   
     
     
         7 . The method according to  claim 1 , wherein:
 the handle wafer is attached to the at least a first electronic component; and   the method further comprises removing the handle wafer from the at least a first electronic component after the attaching the at least a first electronic component to the substrate.   
     
     
         8 . The method according to  claim 1 , wherein:
 the mounting at least a first electronic component on the substrate includes mounting a plurality of electronic components on the substrate, one of the electronic components at a time, to form a stack of the electronic components on the substrate, said plurality of electronic components including the first electronic component and one or more additional electronic components;   the attaching the at least a first electronic component to the substrate includes attaching each of the one or more additional electronic component to one of the electronic components below said each additional electronic component in the stack; and   the using the handle wafer to apply pressure includes, while attaching each of the one or more additional electronic components, using the handle wafer to apply pressure, toward the substrate, to said each additional electronic component to manage co-planarity of the plurality of the electronic components.   
     
     
         9 . The method according to  claim 1 , wherein:
 the at least a first electronic component is a first level electronic component;   the handle wafer is attached to the first level electronic component; and   the method further comprises, after the attaching the first level electronic component to the substrate:
 removing the handle wafer from the first level electronic component; 
 mounting a plurality of second level electronic components on the first level electronic component; and 
 attaching the second level electronic components to the first level electronic component via electrical connectors between the second level electronic component and the first level electronic component to form a plural level component stack on the substrate. 
   
     
     
         10 . The method according to  claim 1 , wherein:
 the mounting at least a first electronic component on the substrate includes forming a plurality of separate stacks on the substrate, each of the stacks including a plurality of flat electronic components;   the attaching includes, in each of the stacks, attaching the electronic component of said each stack in place in said each stack; and   the using the handle wafer includes, while attaching the electronic device of each stack in place, using the handle wafer to apply pressure, toward the substrate, to all of the plurality of stacks to manage co-planarity of the electronic components of the stacks.   
     
     
         11 . A stacked integrated device comprising:
 a substrate;   one or more flat electronic components mounted on the substrate, each of the electronic components having a thickness less than about 20 μm;   one or more groups of electrical connectors for attaching the one or more electronic components in place in a stack on the substrate and for attaching the stack to the substrate; and   a handle wafer on the stack of the electronic components to apply a pressure on the stack, toward the substrate, as the electronic components are attached in place in the stack and the stack is attached to the substrate, for co-planarity management to prevent the electronic components, each having the thickness less than about 20 μm, from bending and to keep the electronic components flat as the electronic components are attached in place in the stack and the stack is attached to the substrate.   
     
     
         12 . The stacked integrated device according to  claim 11 , wherein an open space is maintained directly between the one or more electronic components and the substrate while using the handle wafer applies the pressure toward the substrate. 
     
     
         13 . The stacked integrated device according to  claim 12 , further comprising an adhesive filling the open space directly between the one or more electronic components and the substrate with an adhesive to further attach the at least one or more electronic components to the substrate. 
     
     
         14 . The stacked integrated device according to  claim 11 , wherein:
 the one or more electronic components includes a first electronic component mounted on the substrate, and a second electronic component mounted on the first electronic component; and   the one or more groups of electrical connectors includes a first group of electrical connectors attaching the first electronic component to the substrate, and a second group of electrical connectors attaching the second electronic component to the first electronic component.   
     
     
         15 . The stacked integrated device according to  claim 11 , wherein:
 the one or more electronic component mounted on the substrate includes a multitude of flat electronic components forming a plurality of separate stacks on the substrate, each of the stacks comprising a plurality of the flat electronic components; and   the handle wafer extends over all of said stacks to apply pressure, toward the substrate, to all of the plurality of stacks to manage co-planarity of the electronic components of the stacks.   
     
     
         16 . A method of assembling a stacked integrated circuit device, comprising:
 providing a substrate;   mounting a plurality of flat electronic components on the substrate to form a stack of the electronic components on the substrate, each of the electronic components having a thickness less than about 20 μm;   attaching the plurality of electronic components in place in the stack and attaching the stack to the substrate via a plurality of groups of electrical connectors; and   while attaching the plurality of electronic components in place in the stack, using a handle wafer to manage co-planarity to apply a pressure, toward the substrate, to the plurality of electronic components, each having the thickness less than about 20 μm, to prevent the electronic components from bending and to keep the electronic components flat during said attaching the plurality of electronic components in place in the stack.   
     
     
         17 . The method according to  claim 16 , wherein the attaching the plurality of electronic components in place in the stack includes maintaining an open space directly between the plurality of electronic component in the stack and the substrate while using the handle wafer to apply the pressure toward the substrate. 
     
     
         18 . The method according to  claim 17 , wherein the attaching the plurality of electronic components in place in the stack to the substrate further includes after using the handle wafer to apply the pressure toward the substrate, filling the open space directly between the plurality of electronic components in the stack and the substrate with an adhesive to further attach the at least a first electronic component to the substrate. 
     
     
         19 . The method according to  claim 16 , wherein:
 the attaching the plurality of flat electronic components includes attaching the electronic components in place in the stack, one of the electronic component at a time by using a respective one of the groups of electrical connectors; and   the using the handle wafer includes using the handle wafer to apply pressure, toward the substrate, to each of the electronic components as said each electronic component is being attached in place in the stack.   
     
     
         20 . The method according to  claim 16 , wherein:
 the mounting a plurality of electronic components on the substrate includes forming a plurality of separate stacks on the substrate, each of the stacks including a respective group of the electronic components;   the attaching includes, in each of the stacks, attaching the electronic components of said each stack in place in said each stack; and   the using the handle wafer includes positioning the handle wafer over all of said stacks to apply pressure, toward the substrate, to all of the plurality of stacks to prevent the electronic components of the stacks from bending during said attaching.