Surface Mounting Device for a Sensor Package
Abstract
A surface mounting device is disclosed. The mounting device may be configured for coupling to a sensor package. The mounting device may include an active adherent and one or more passive adherents. The active adherent may include a suction cup with a powered pressurizer in fluid communication with a cavity of the suction cup. The passive adherent(s) may include one or more pads having an adhering coating. The mounting device may be positioned proximate a suitable mounting surface by a vehicle, such as an aerial vehicle. Once proximate a suitable surface, the mounting device may first attach itself to the surface using the active adherent. The mounting surface may attach itself to the surface using the passive adherent(s) if a more permanent attachment is desired, and/or if power is in short supply.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A mounting device for securing a sensor payload at an object, comprising:
a base configured to support the sensor payload; a suction cup coupled to a first surface of the base, the suction cup defining a cavity that is in fluid communication with a pressurizer, wherein the pressurizer is configured to create a negative pressure within the cavity to adhere the suction cup to a mounting surface of the object; a controller operatively coupled to the pressurizer, the controller configured to selectively activate the pressurizer to achieve a predetermined negative pressure within the cavity; and a release valve configured to vent the cavity, thereby releasing the suction cup from the mounting surface of the object.
2 . The mounting device of claim 1 , further comprising a check valve positioned in line between the pressurizer and the cavity, wherein the check valve is configured to maintain the predetermined negative pressure within the cavity when the pressurizer is inactive.
3 . The mounting device of claim 1 , wherein the release valve is operatively coupled to the controller, the controller being configured to actuate the release valve to releases the suction cup from the mounting surface of the object.
4 . The mounting device of claim 1 , wherein the controller is operatively coupled with a pressure sensor configured to measure the negative pressure within the cavity.
5 . The mounting device of claim 4 , wherein the controller is operatively coupled to the release valve, the controller being configured to actuate the pressurizer or the release valve as a function of a measurement from the pressure sensor.
6 . The mounting device of claim 1 , wherein the suction cup comprises a gasket that is configured to conform to a shape or a texture of the mounting surface, thereby providing a fluid-tight seal between the suction cup and the mounting surface.
7 . The mounting device of claim 1 , wherein the sensor package comprises at least one sensor configured to observe a surrounding environment.
8 . The mounting device of claim 7 , wherein the at least one sensor is configured to determine a position of the mounting device within the surrounding environment.
9 . The mounting device of claim 8 , wherein the at least one sensor comprises a camera, a motion sensor, a position sensor, a proximity sensor, a pressure sensor, or an accelerometer.
10 . The mounting device of claim 7 , wherein the sensor package is communicatively coupled with a second sensor package in via a network.
11 . The mounting device of claim 1 , further comprising a coupling configured to couple releasably the mounting device to an aerial vehicle.
12 . The mounting device of claim 1 , further comprising a passive adherent coupled to the first surface of the base, wherein the passive adherent is configured to adhere the mounting device to the mounting surface via the base.
13 . The mounting device of claim 12 , wherein the passive adherent comprises a plurality of adhesive pads.
14 . The mounting device of claim 12 , wherein the pressurizer is coupled to a power source, wherein the controller is configured to adhere the mounting device to the mounting surface via the suction cup or the passive adherent based at least in part on a status of the power source.
15 . A method for securing a sensor payload at an object using a mounting device, the method comprising:
positioning at a mounting surface a base configured to support the sensor payload, wherein a suction cup is coupled to a first surface of the base, the suction cup defining a cavity that is in fluid communication with a pressurizer; creating, via a pressurizer, a negative pressure within the cavity to adhere the suction cup to the mounting surface of the object; and selectively activating, via a controller, a pressurizer to achieve a predetermined negative pressure within the cavity.
16 . The method of claim 15 , further comprising the step of releasing the suction cup from the mounting surface of the object via a release valve configured to vent the cavity.
17 . The method of claim 15 , further comprising the step of determining, via one or more sensors coupled to the controller, whether the mounting device is proximate the mounting surface, wherein the negative pressure within the cavity is generated if the mounting device is proximate the mounting surface.
18 . The method of claim 15 , further comprising the step of determining, via the controller, whether the mounting device is positioned at a suitable position based at least in part on surveillance data acquired by the sensor package, wherein the mounting device is adhered to the mounting surface using a passive adherent if the mounting device is positioned at a suitable position.
19 . The method of claim 18 , wherein the mounting device is adhered to the mounting surface using the passive adherent by applying negative pressure to the cavity via the pressurizer to compress the suction cup until the passive adherent is brought into adhering contact with the mounting surface.
20 . A surveillance system comprising:
a first mounting device configured to secure a first sensor payload to a first mounting surface, wherein the first mounting device comprises: a base configured to support the first sensor payload: a suction cup coupled to a first surface of the base, the suction cup defining a cavity that is in fluid communication with a pressurizer, wherein the pressurizer is configured to create a negative pressure within the cavity to adhere the suction cup to the first mounting surface; a controller operatively coupled to the pressurizer, the controller configured to selectively activate the pressurizer to achieve a predetermined negative pressure within the cavity; and a release valve configured to vent the cavity, thereby releasing the suction cup from the first mounting surface; a second mounting device configured to secure a second sensor payload to a second mounting surface, wherein the second mounting device comprises: a base configured to support the second sensor payload: a suction cup coupled to a second surface of the base, the suction cup defining a cavity that is in fluid communication with a pressurizer, wherein the pressurizer is configured to create a negative pressure within the cavity to adhere the suction cup to the second mounting surface; a controller operatively coupled to the pressurizer, the controller configured to selectively activate the pressurizer to achieve a predetermined negative pressure within the cavity; and a release valve configured to vent the cavity, thereby releasing the suction cup from the second mounting surface; and an aerial vehicle configured to place the second mounting device at the second mounting surface based at least in part on information from the first sensor payload.Join the waitlist — get patent alerts
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