Polyetherimide compositions, articles made therefrom, and method of manufacture thereof

Abstract

A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320° C., preferably 245 to 312° C., and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260° C., preferably 260 to 350° C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.

I/We claim: 
     
         1 . A polyetherimide composition comprising,
 a polyetherimide sulfone having a glass transition temperature of 240 to 320° C., preferably 245 to 312° C.; and   a particulate, thermally conductive filler composition,   
       wherein a layer comprising the polyetherimide composition
 resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260° C., preferably 260 to 350° C.; and 
 a layer comprising the polyetherimide composition has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008. 
 
     
     
         2 . The polyetherimide composition of  claim 1 , wherein a layer comprising the polyetherimide composition has one or both of
 an average water absorption of 0.1 to 0.5%, preferably 0.1 to 0.0.3%; and   a surface resistivity of greater than or equal to 1×10 13  ohm/sq   
     
     
         3 . The polyetherimide composition of  claim 1 , wherein the polyetherimide composition has a glass transition temperature of greater than or equal to 250° C., preferably 250 to 270° C., more preferably 260 to 270° C. 
     
     
         4 . The polyetherimide composition of  claim 1 , comprising
 40 to 90 wt. %, preferably 40 to 70 wt. % of the polyetherimide sulfone; and   10 to 60 wt. %, preferably 30 to 60 wt. % of the particulate, thermally conductive filler composition,   
       wherein weight percent is based on the total weight of the polyetherimide composition. 
     
     
         5 . The polyetherimide composition of  claim 1 , wherein the thermally conductive filler composition comprises boron nitride, graphite, aluminum nitride, silicon nitride, MgSiN 2 , silicon carbide, particles coated with one or more of the foregoing, zinc sulfide, calcium oxide, magnesium oxide, zinc oxide, titanium oxide, or a combination comprising at least one of the foregoing thermally conductive fillers, preferably wherein the thermally conductive filler composition comprises boron nitride, graphite, or a combination comprising at least one of the foregoing. 
     
     
         6 . The polyetherimide composition of  claim 1 , wherein the thermally conductive filler composition comprises 30 to 50 wt. % boron nitride, based on the total weight of the polyetherimide composition. 
     
     
         7 . The polyetherimide composition of  claim 1 , wherein the thermally conductive filler composition comprises
 30 to 50 wt. % boron nitride; and   5 to 15 wt. % graphite,   
       wherein weight percent is based on the total weight of the polyetherimide composition. 
     
     
         8 . A polyetherimide composition comprising,
 a polyetherimide sulfone having a glass transition temperature of 240 to 320° C., preferably 245 to 312° C.;   an additional polymer different from the polyetherimide sulfone having a glass transition temperature greater than 140° C.; and   a particulate, thermally conductive filler composition   
       wherein a layer comprising the polyetherimide composition
 resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260° C., preferably 260 to 350° C.; and 
 a layer comprising the polyetherimide composition has a thermal conductivity of 3 to 6 W/mK, preferably 3 to 5.5 W/mK, as determined in accordance with ISO 22007-2:2008. 
 
     
     
         9 . The polyetherimide composition of  claim 8 , wherein a layer comprising the polyetherimide composition has an average water absorption of 0.1 to 0.5%, preferably 0.1 to 0.3%. 
     
     
         10 . The polyetherimide composition of  claim 8 , wherein the polyetherimide composition has at least one glass transition temperature of greater than or equal to 230° C., preferably 230 to 270° C., more preferably 250 to 270° C. 
     
     
         11 . The polyetherimide composition of  claim 8 , comprising
 30 to 70 wt. %, preferably 30 to 60 wt. % of the polyetherimide sulfone; and   1 to 35 wt. %, preferably 10 to 30 wt. %, of the additional polymer different from the polyetherimide sulfone,   
       wherein weight percent is based on the total weight of the polyetherimide composition. 
     
     
         12 . The polyetherimide composition of  claim 8 , wherein the thermally conductive filler composition comprises boron nitride, graphite, aluminum nitride, silicon nitride, MgSiN 2 , silicon carbide, particles coated with one or more of the foregoing, zinc sulfide, calcium oxide, magnesium oxide, zinc oxide, titanium oxide, or a combination comprising at least one of the foregoing thermally conductive fillers, preferably wherein the thermally conductive filler composition comprises boron nitride, graphite, or a combination comprising at least one of the foregoing. 
     
     
         13 . The polyetherimide composition of  claim 8 , wherein the thermally conductive filler composition comprises 30 to 60 wt. % boron nitride, based on the total weight of the polyetherimide composition. 
     
     
         14 . The polyetherimide composition of  claim 13 , wherein the thermally conductive filler composition further comprises 1 to 15 wt. % graphite, wherein weight percent is based on the total weight of the polyetherimide composition. 
     
     
         15 . The polyetherimide composition of  claim 8 , wherein the additional polymer comprises a polyphenylsulfone, a polyether sulfone, a polysulfone, a polyphenylene sulfone, a polyphenylene sulfide, a polyetherketone, a polyetheretherketone, a polyketone, a polyphthalamide, an aromatic polyimide, an aromatic polyetherimide, polyaryletherketones, or a combination comprising at least one of the foregoing additional polymers, preferably a polyphenylsulfone, a polyetheretherketone, or a combination comprising at least one of the foregoing.