Substrate supporting apparatus, substrate processing apparatus including the same, and substrate processing method

Abstract

A substrate processing method capable of stably loading a substrate regardless of a variation in pressure of a reaction space includes supplying an inert gas; and forming a thin film by sequentially and repeatedly supplying a source gas, supplying a reaction gas, and activating the reaction gas, wherein a center portion of a substrate and a center portion of a susceptor are spaced apart from each other to form a separate space, the reaction space above the substrate and the separate space communicate with each other via one or more channels, an inert gas is introduced to the separate space through the one or more channels during the supplying of the inert gas, and the inert gas prevents pressure imbalance between the separate space and the reaction space during a thin film deposition process.

What is claimed is: 
     
         1 . A substrate supporting apparatus comprising:
 a susceptor main body comprising an inner portion, a periphery portion, and a concave portion between the inner portion and the periphery portion; and   a rim arranged in the concave portion,   wherein, when a substrate is mounted on the rim, the rim contacts the substrate within an edge exclusion zone of the substrate,   an upper surface of the inner portion is lower than an upper surface of the rim to make a rear surface of the substrate spaced apart from the inner portion,   a first space is formed between the rear surface of the substrate and the inner portion,   a second space is formed above the substrate, and   one or more channels are formed in at least one of the susceptor main body and the rim, the one or more channels connecting the first space to the second space separately or together with each other.   
     
     
         2 . The substrate supporting apparatus of  claim 1 , wherein the one or more channels are provided between an inner wall and an outer wall of the rim, and the one or more channels are arranged along a circumference that is separate from a center of the substrate supporting apparatus by a first distance. 
     
     
         3 . The substrate supporting apparatus of  claim 2 , wherein the first distance is greater than a radius of the substrate. 
     
     
         4 . The substrate supporting apparatus of  claim 1 , wherein the one or more channels are symmetrically arranged about a center axis of the substrate supporting apparatus. 
     
     
         5 . The substrate supporting apparatus of  claim 1 , wherein the one or more channels comprise a first sub-channel and a second sub-channel,
 the first sub-channel is a through hole which contacts an upper surface of the rim and thus communicates with the second space and extends toward a lower portion of the rim by penetrating through the rim, and   the substrate is not in contact with the first sub-channel.   
     
     
         6 . The substrate supporting apparatus of  claim 5 , wherein the second sub-channel of the one or more channels communicates with the first space, and the second sub-channel has a structure tapered towards the first space. 
     
     
         7 . The substrate supporting apparatus of  claim 5 , wherein the second sub-channel of the one or more channels communicates with the first space, and the second sub-channel is provided in a circumferential direction. 
     
     
         8 . The substrate supporting apparatus of  claim 1 , wherein a contact portion between the edge exclusion zone of the substrate and the rim has a ring shape that is continuously provided along a circumference that is spaced apart from a center of the substrate supporting apparatus by a predetermined distance. 
     
     
         9 . The substrate supporting apparatus of  claim 1 , wherein a portion where the one or more channels and the first space meet each other is spaced apart from a rear surface of the substrate. 
     
     
         10 . A substrate processing apparatus comprising:
 a reactor wall;   a substrate supporting apparatus;   a heater block;   a gas inlet;   a gas supply unit; and   an exhaust unit,   wherein the substrate supporting apparatus comprises a susceptor main body and a rim,   the susceptor main body comprises an inner portion, a periphery portion, and a concave portion between the inner portion and the periphery portion, and the rim is arranged on the concave portion,   when a substrate is mounted on the rim, the rim contacts the substrate within an edge exclusion zone of the substrate,   the reactor wall and the periphery portion of the substrate supporting apparatus form a reaction space through face-contact,   a separate space is formed between the inner portion and the substrate, and   the reaction space and the separate space communicate with each other through one or more channels.   
     
     
         11 . The substrate processing apparatus of  claim 10 , wherein the one or more channels comprise a first sub-channel and a second sub-channel,
 the first sub-channel is provided on a surface or an inner portion of the reactor wall to communicate with the reaction space above the substrate,   the second sub-channel is provided on a surface or an inner portion of at least one of the susceptor main body and the rim to communicate with the separate space, and   the first sub-channel communicates with the separate space via the second sub-channel.   
     
     
         12 . The substrate processing apparatus of  claim 11 , wherein each of the first sub-channel and the second sub-channel comprises a through hole or a groove. 
     
     
         13 . The substrate processing apparatus of  claim 10 , wherein the one or more channels comprise a first sub-channel and a second sub-channel,
 the first sub-channel is provided on a surface or an inner portion of the rim to communicate with the reaction space,   the second sub-channel is provided in at least one of the susceptor main body and the rim to communicate with the separate space, and   the first sub-channel communicates with the separate space via the second sub-channel.   
     
     
         14 . The substrate processing apparatus of  claim 10 , wherein the one or more channels have a structure tapered towards the separate space. 
     
     
         15 . The substrate processing apparatus of  claim 13 , wherein the first sub-channel comprises one or more first through holes penetrating through at least a part of the rim,
 the one or more first through holes are spaced apart from one another along a first circumference having a first radius on an upper surface of the rim, and   the first radius is greater than a radius of the substrate.   
     
     
         16 . The substrate processing apparatus of  claim 10 , wherein an inert gas is introduced from the reaction space to the separate space through the one or more channels before performing a thin film deposition process, and
 the inert gas introduced before the thin film deposition process prevents pressure imbalance between the reaction space and the separate space during the deposition of the thin film.   
     
     
         17 . A substrate processing method comprising:
 supplying an inert gas; and   depositing a thin film by sequentially and repeatedly supplying a source gas, supplying a reaction gas, and activating the reaction gas,   wherein a center portion of a substrate and a center portion of a susceptor are spaced apart from each other to form a separate space,   the reaction space above the substrate and the separate space communicate with each other via one or more channels,   the inert gas is introduced to the separate space through the one or more channels during the supplying of the inert gas, and   the introduced inert gas prevents pressure imbalance between the separate space and the reaction space during the deposition of the thin film.   
     
     
         18 . The substrate processing method of  claim 17 , wherein a thickness of a film deposited on a rear surface of the substrate during the deposition of the thin film is controlled by controlling a flow rate of the inert gas introduced into the separate space. 
     
     
         19 . The substrate processing method of  claim 17 , wherein a purge gas is supplied during the deposition of the thin film, and a flow rate of the purge gas supplied during the deposition of the thin film is adjusted to make a pressure in the separate space and a pressure in the reaction space be equal to each other. 
     
     
         20 . The substrate processing method of  claim 17 , wherein the introduced inert gas prevents the source gas and the reaction gas from being introduced into the separate space during the deposition of the thin film.