Semiconductor structure with metal gate, and method for manufacturing the same
Abstract
The present disclosure provides a semiconductor structure of a metal gate and a manufacturing method therefor. The manufacturing method includes providing a semiconductor substrate; uniformly depositing a first hard mask layer on the semiconductor substrate, corresponding to a region where the metal gate is located, patterning and etching the first hard mask layer to form a recess, forming a sloping sidewall on a sidewall of the recess, the sloping sidewall and an upper surface of the substrate forming a groove structure, with the size of an upper part of the groove structure being larger than that of a lower part thereof, and forming a metal gate in the groove structure; and removing the first hard mask layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A semiconductor structure, comprising:
a semiconductor substrate; a sloping sidewall located on the semiconductor substrate and forming a groove structure with an upper surface of the substrate, wherein a size of an upper part of the groove structure being larger than that of a lower part; and a metal gate located in the groove structure.
2 . The structure of claim 1 , further comprising:
a dielectric layer formed on the semiconductor substrate, a surface of the dielectric layer being flush with an upper surface of the metal gate.
3 . The structure of claim 2 , wherein material of the sloping sidewall is the same material as the dielectric layer.
4 . The structure of claim 3 , wherein material of the sloping sidewall and the dielectric layer is one or both of silicon nitride and silicon oxide.
5 . The structure of claim 2 , further comprising lightly doped drain structures located on two sides of the metal gate.Join the waitlist — get patent alerts
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