Non-rectangular electronic device components

Abstract

Electronic device shape configuration technology is disclosed. In an example, an electronic device substrate is provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. An electronic device die is also provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. In addition, an electronic device package is provided that can comprise a substrate having a top surface configured to receive a die and a bottom surface opposing the top surface. The package can also include a die having a top surface and a bottom surface opposing the top surface. The die can be coupled to the top surface of the substrate. The top surface and/or the bottom surface of either the substrate, or the die, or both can have a non-rectangular shaped perimeter.

1 - 25 . (canceled) 
     
     
         26 . An electronic device die, comprising:
 a top surface; and   a bottom surface opposing the top surface, wherein at least one of the top surface and the bottom surface has a non-rectangular shaped perimeter.   
     
     
         27 . The electronic device die of  claim 26 , wherein the non-rectangular perimeter comprises a circular shape, a semi-circular shape, an elliptical shape, a polygonal shape, a curvilinear shape, a free form shape, or a combination thereof. 
     
     
         28 . The electronic device die of  claim 27 , wherein the polygonal shape comprises a triangular shape, a pentagonal shape, a hexagonal shape, a heptagonal shape, an octagonal shape, or a combination thereof. 
     
     
         29 . The electronic device die of  claim 28 , wherein the polygonal shape is a triangular shape. 
     
     
         30 . The electronic device die of  claim 26 , wherein the shape minimizes areas of lost electrical contact with a package substrate or motherboard to which the die is coupled due to thermally induced warping of the die. 
     
     
         31 . The electronic device die of  claim 30 , wherein the area of lost electrical contact is along a periphery of the die. 
     
     
         32 . The electronic device die of  claim 26 , wherein the shape of the die is selected in order to maximize a number of dies harvested from a single wafer. 
     
     
         33 . The electronic device die of  claim 26 , wherein the perimeters of the top and bottom surfaces match in shape and size. 
     
     
         34 . The electronic device die of  claim 26 , wherein the perimeters of the top and bottom surfaces differ in shape or size. 
     
     
         35 . The electronic device die of  claim 26 , wherein the perimeter has a shape that maximizes perimeter length for a given area. 
     
     
         36 . The electronic device die of  claim 35 , wherein the shape is a polygon. 
     
     
         37 . The electronic device die of  claim 36 , wherein the shape is an ellipse. 
     
     
         38 . The electronic device die of  claim 37 , wherein the shape is a circle. 
     
     
         39 . An electronic device package, comprising:
 a substrate having a top surface configured to receive a die and a bottom surface opposing the top surface; and   a die as recited in  claim 26 , said die coupled to the top surface of the substrate.   
     
     
         40 . The electronic device package of  claim 39 , wherein at least one of the top surface and the bottom surface of the substrate has a non-rectangular shaped perimeter. 
     
     
         41 . The electronic device package of  claim 39 , wherein the substrate and die have substantially matching perimeter shapes. 
     
     
         42 . The electronic device package of  claim 39 , wherein the substrate and die have different perimeter shapes. 
     
     
         43 . The electronic device package of  claim 40 , wherein the non-rectangular perimeter of either the die or the substrate or both comprises a circular shape, a semi-circular shape, an elliptical shape, a polygonal shape, a curvilinear shape, a free form shape, or a combination thereof. 
     
     
         44 . The electronic device package of  claim 43 , wherein the polygonal shape comprises a triangular shape, a pentagonal shape, a hexagonal shape, a heptagonal shape, an octagonal shape, or a combination thereof. 
     
     
         45 . The electronic device package of  claim 44 , wherein the polygonal shape is a triangular shape. 
     
     
         46 . The electronic device package of  claim 40 , wherein the shape minimizes areas of lost electrical contact with a motherboard to which the substrate is coupled due to thermally induced warping of the substrate. 
     
     
         47 . The electronic device package of  claim 46 , wherein the area of lost electrical contact is along a periphery of the substrate. 
     
     
         48 . The electronic device package of  claim 43 , wherein the shape is a polygon. 
     
     
         49 . The electronic device package of  claim 43 , wherein the shape is an ellipse. 
     
     
         50 . The electronic device package of  claim 43 , wherein the shape is a circle.