Plasma processing apparatus

Abstract

Temperature uniformity in a mounting surface of a mounting table is improved. A plasma processing apparatus includes a mounting table having thereon a mounting surface on which a work-piece serving as a plasma processing target is mounted; a coolant path formed within the mounting table along the mounting surface of the mounting table; an inlet path connected to the coolant path from a backside of the mounting surface of the mounting table and configured to introduce a coolant into the coolant path; and a thermal resistor provided in a region, facing a connection portion between the inlet path and the coolant path, of an inner wall of the coolant path.

We claim: 
     
         1 . A plasma processing apparatus, comprising:
 a mounting table having thereon a mounting surface on which a work-piece serving as a plasma processing target is mounted;   a coolant path formed within the mounting table along the mounting surface of the mounting table;   an inlet path connected to the coolant path from a backside of the mounting surface of the mounting table and configured to introduce a coolant into the coolant path; and   a thermal resistor provided in a region, facing a connection portion between the inlet path and the coolant path, of an inner wall of the coolant path.   
     
     
         2 . The plasma processing apparatus of  claim 1 ,
 wherein the thermal resistor is made of the same material as a base of the mounting table and provided as a single body with the base of the mounting table to be protruded toward the connection portion from the region, facing the connection portion between the inlet path and the coolant path, of the inner wall of the coolant path.   
     
     
         3 . The plasma processing apparatus of  claim 1 ,
 wherein the thermal resistor is made of a material having a thermal conductivity lower than a base of the mounting table and provided as a member separate from the base of the mounting table in the region, facing the connection portion between the inlet path and the coolant path, of the inner wall of the coolant path.   
     
     
         4 . The plasma processing apparatus of  claim 3 ,
 wherein the thermal resistor is buried in the region, facing the connection portion between the inlet path and the coolant path, of the inner wall of the coolant path.   
     
     
         5 . The plasma processing apparatus of  claim 1 ,
 wherein the thermal resistor has an inclined surface such that a thickness thereof is decreased toward a flow direction of the coolant flowing through the coolant path.   
     
     
         6 . The plasma processing apparatus of  claim 1 ,
 wherein the thermal resistor has a curved surface such that a thickness thereof is decreased toward a flow direction of the coolant flowing through the coolant path.   
     
     
         7 . The plasma processing apparatus of  claim 1 ,
 wherein the inlet path is extended from a backside of the mounting surface of the mounting table such that an extension direction of the inlet path is inclined at an angle of greater than 90° with respect to a flow direction of the coolant flowing through the coolant path, and then, connected to the coolant path.