Cleaning device, plating device including the same, and cleaning method

Abstract

There is provided a cleaning device capable of conveying a substrate even when having large warpage. A cleaning device configured to clean a substrate W1 includes a horizontal conveyance mechanism 56 configured to convey the substrate W1 to be subjected to cleaning processing. Furthermore, the cleaning device includes a pressurizing roller 70 provided at a position facing the horizontal conveyance mechanism 56 with the substrate W1 therebetween and configured to press the substrate W1 against the horizontal conveyance mechanism 56, and a roller moving mechanism 72 configured to move the pressurizing roller 70 toward the horizontal conveyance mechanism 56 to cause the pressurizing roller 70 to press the substrate W1 against the horizontal conveyance mechanism 56.

What is claimed is: 
     
         1 . A cleaning device configured to clean a target object, comprising:
 a conveyance mechanism configured to convey the target object to be subjected to cleaning processing;   a pressurizing roller provided at a position facing the conveyance mechanism with the target object therebetween, the pressurizing roller being configured to press the target object against the conveyance mechanism; and   a roller moving mechanism configured to move the pressurizing roller toward the conveyance mechanism to cause the pressurizing roller to press the target object against the conveyance mechanism.   
     
     
         2 . The cleaning device according to  claim 1 , wherein
 the number of the pressuring rollers is at least four.   
     
     
         3 . The cleaning device according to  claim 1 , further comprising:
 a drive mechanism configured to rotationally drive the pressurizing roller.   
     
     
         4 . A plating device, comprising:
 the cleaning device according to  claim 1 .   
     
     
         5 . A method for cleaning a target object in a cleaning device configured to clean the target object, the cleaning device comprising a conveyance mechanism configured to convey the target object to be subjected to cleaning processing, a pressurizing roller provided at a position facing the conveyance mechanism with the target object therebetween, the pressurizing roller being configured to press the target object against the conveyance mechanism, and a roller moving mechanism configured to move the pressurizing roller toward the conveyance mechanism to cause the pressurizing roller to press the target object against the conveyance mechanism, the method comprising:
 a process of mounting the target object on the conveyance mechanism;   a process of moving the pressurizing roller toward the conveyance mechanism by the roller moving mechanism to cause the pressurizing roller to press the target object against the conveyance mechanism; and   a process of conveying the target object in a state in which the target object is pressed against the conveyance mechanism.   
     
     
         6 . A cleaning device configured to clean a target object, comprising:
 a supporting part configured to support the target object that has been subjected to plating processing and cleaning processing;   a pressing part provided at a position facing the supporting part with the target object therebetween, the pressing part being configured to press the target object against the supporting part;   a moving mechanism configured to move the pressing part toward the supporting part to cause the pressing part to press the target object against the supporting part; and   a film thickness measuring part configured to measure a film thickness of a plated film of the target object.   
     
     
         7 . The cleaning device according to  claim 6 , wherein
 the supporting part is a conveyance mechanism configured to convey the target object.   
     
     
         8 . The cleaning device according to  claim 6 , wherein
 the pressing part has a roller, and the roller is configured to press the target object against the supporting part.   
     
     
         9 . The cleaning device according to  claim 6 , wherein
 the number of the rollers is at least four.   
     
     
         10 . The cleaning device according to  claim 6 , wherein
 the film thickness measuring part is moved for the measurement to measure a film thickness of a plated film of the target object at a plurality of points of the target object.   
     
     
         11 . The cleaning device according to  claim 6 , wherein
 a plurality of the film thickness measuring parts are provided.   
     
     
         12 . The cleaning device according to  claim 6 , wherein
 the film thickness measuring part has an eddy current sensor.   
     
     
         13 . The cleaning device according to  claim 6 , wherein
 the target object has a resist, and the film thickness measuring part is configured to measure the film thickness of the plated film of the target object having the resist.   
     
     
         14 . A plating device, comprising
 the cleaning device according to  claim 6 .   
     
     
         15 . A method for cleaning a target object in a cleaning device configured to clean the target object, the cleaning device comprising a supporting part configured to support the target object that has been subjected to plating processing and cleaning processing, a pressing part provided at a position facing the supporting part with the target object therebetween, the pressing part being configured to press the target object against the supporting part, a moving mechanism configured to move the pressing part toward the supporting part to cause the pressing part to press the target object against the supporting part, and a film thickness measuring part configured to measure a film thickness of a plated film of the target object, the method comprising:
 a process of mounting the target object on the supporting part;   a process of moving the pressing part toward the supporting part by the moving mechanism to cause the pressing part to press the target object against the supporting part; and   a process of measuring the film thickness of the plated film of the target object using the film thickness measuring part in a state in which the target object is pressed against the supporting part.