Polishing apparatus and substrate processing apparatus

Abstract

A polishing apparatus includes a polishing table supplied with liquid on a upper surface and rotating around a central axis, a liquid receiver having an annular shape and disposed below a peripheral portion of the polishing table, and a drain member having a tubular shape, attached to a peripheral portion of the polishing table, and including a lower end portion extending toward the liquid receiver.

What is claimed is: 
     
         1 . A polishing apparatus comprising:
 a polishing table supplied with liquid on an upper surface and rotating around a central axis;   a liquid receiver having an annular shape and disposed below a peripheral portion of the polishing table; and   a drain member having a tubular shape, attached to a peripheral portion of the polishing table, and comprising a lower end portion extending toward the liquid receiver.   
     
     
         2 . The polishing apparatus according to  claim 1 , wherein:
 the liquid receiver comprises an inner peripheral wall disposed radially inward of the lower end portion of the water drain member; and   the lower end portion of the drain member extends downward from an upper end portion of the inner peripheral wall.   
     
     
         3 . The polishing apparatus according to  claim 1 , wherein:
 a step to which the water drain member is attached is formed in the peripheral edge portion of the polishing table;   the water drain member is attached to a bottom surface of the step via a bolt;   a first seal member sealing a gap between the water drain member and a side surface of the stepped portion in the radial direction is provided; and   a second seal member sealing an insertion hole of the water drain member through which the bolt is inserted is provided.   
     
     
         4 . The polishing apparatus according to  claim 1 , further comprising:
 a cover member disposed radially outward of the water drain member and having a gradually decreasing gap in the radial direction with respect to the water drain member toward the upper surface of the polishing table; and   a gas-liquid separation device sucking gas via the liquid receiver and separating liquid included in the gas,   wherein a suction path of the gas-liquid separation device is a gap formed between the water drain member and the cover member.   
     
     
         5 . The polishing apparatus according to  claim 4 , wherein:
 the cover member is disposed with a clearance from an outer peripheral wall of the liquid receiver; and   a gap dimension between the cover member and the outer peripheral wall is smaller than a gap dimension between the cover member and an upper end portion of the water drain member.   
     
     
         6 . The polishing apparatus according to  claim 4 , wherein the cover is vertically movable. 
     
     
         7 . A polishing apparatus comprising a polishing table in which a substrate is pressed against an upper surface of the polishing table and which rotates around a central axis,
 wherein the polishing table comprises:   a table forming the upper surface and comprising a heat medium flow path in an internal portion; and   a table base detachably supporting the table.   
     
     
         8 . The polishing apparatus according to  claim 7 , further comprising:
 a plurality of bolts detachably fixing a first peripheral portion of the table to a second peripheral portion of the table base; and   in the radially inward of the plurality of bolts, one or more knock pins positioning the table with respect to the table base.   
     
     
         9 . The polishing apparatus according to  claim 8 ,
 comprising a drain member having a tubular shape and covering the table and a dividing surface of the table base from outside in the radial direction,   wherein the water drain member is detachably attached to a peripheral portion of the polishing table by the plurality of bolts.   
     
     
         10 . The polishing apparatus according to  claim 7 , wherein:
 a flange having a tubular shape and rotatably driven by a motor is connected to a lower surface side of the table base; and   the flange forms a space for attaching a film thickness measurement device on the lower surface side of the table base that measures a film thickness of the substrate.   
     
     
         11 . The polishing apparatus according to  claim 7 , wherein on a lower surface side of a peripheral portion of the table base, a drain protrusion having an annular shape protruding downward is formed. 
     
     
         12 . The polishing apparatus according to  claim 8 , wherein a coating layer to which a polishing pad is peelably adhered is formed on an upper surface of the table. 
     
     
         13 . The polishing apparatus according to  claim 12 , wherein the coating layer is a fluororesin coating layer. 
     
     
         14 . The polishing apparatus according to  claim 12 , wherein the coating layer is a glass coating layer. 
     
     
         15 . The polishing apparatus according to  claim 12 , wherein the coating layer is a ceramic coating layer. 
     
     
         16 . The polishing apparatus according to  claim 12 , wherein the coating layer is a diamond coating layer. 
     
     
         17 . A substrate processing apparatus comprising:
 a polishing portion polishing a substrate; and   a cleaning portion cleaning the substrate polished by the polishing portion,   wherein the polishing portion comprises the polishing apparatus according to  claim 1 .