Systems and methods for depositing compounds in a structure

Abstract

Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin within the void during the repair. Systems may include a dispenser for holding the compound, a vacuum canister, and a valve operable to allow the compound to flow from the dispenser, through at least a portion of the vacuum canister, and into the void. After the compound flows into the void, the system is configured to apply ambient air pressure to the compound and the void, before the compound is allowed to harden or cure. Some such systems are pre-filled with the compound, and/or configured to be disposable after a single use.

1 . A method for depositing a compound into a void within a structure, the method comprising:
 positioning a vacuum canister with respect to the void such that a canister outlet of the vacuum canister surrounds an opening to the void, the canister outlet being configured to allow the compound to flow into the void from a dispenser configured to hold the compound;   drawing air out of the vacuum canister and the void to maintain a target reduced air pressure within the vacuum canister, using a vacuum system operably coupled to the vacuum canister via a vacuum port;   moving a valve from a first position, in which the valve is operable to retain the compound in the dispenser, to a second position, in which the compound flows from the dispenser, through at least a portion of the vacuum canister, and into the void, wherein the moving the valve to the second position is performed during a period of time during which the target reduced air pressure is maintained, wherein the period of time is sufficient to allow the compound to flow into the void; and   exposing the compound and the void to ambient air pressure after the period of time during which the target reduced air pressure is maintained, wherein the exposing the compound and the void to the ambient air pressure is performed before the compound has cured.   
     
     
         2 . The method according to  claim 1 , further comprising positioning the dispenser with respect to the vacuum canister such that the dispenser is configured to allow the compound to flow from a dispenser outlet of the dispenser into the vacuum canister once the moving the valve to the second position is performed. 
     
     
         3 . The method according to  claim 2 , further comprising filling at least a portion of the dispenser with the compound prior to the positioning the vacuum canister with respect to the void. 
     
     
         4 . The method according to  claim 3 , further comprising deaerating the compound prior to the filling at least the portion of the dispenser with the compound. 
     
     
         5 . The method according to  claim 3 , further comprising positioning the valve in the first position prior to the filling at least the portion of the dispenser with the compound. 
     
     
         6 . The method according to  claim 3 , further comprising closing a dispenser inlet through which the at least the portion of the dispenser is filled, such that the compound is substantially prevented from flowing through the dispenser inlet after the closing the dispenser inlet. 
     
     
         7 . The method according to  claim 1 , wherein the exposing the compound and the void to the ambient air pressure comprises opening the valve such that the void is exposed to ambient air. 
     
     
         8 . The method according to  claim 1 , further comprising disposing of the dispenser after the period of time during which the target reduced air pressure is maintained while the compound flows into the void. 
     
     
         9 . A method for depositing a compound into a void of a damaged area of a structure, the method comprising:
 positioning a vacuum canister with respect to the void such that a canister outlet of the vacuum canister surrounds an opening to the void, the canister outlet being configured to allow the compound to flow into the void from a dispenser configured to hold the compound to be dispensed into the void, and wherein at least a portion of the dispenser is positioned within the vacuum canister;   forming an at least substantially air-impermeable seal between the canister outlet and the structure;   drawing air out of the vacuum canister and the void to maintain a target reduced air pressure within the vacuum canister, using a vacuum system operably coupled to the vacuum canister via a vacuum port; and   moving a valve from a first position, in which the valve is operable to retain the compound in the dispenser, to a second position, in which the compound flows from the dispenser, through at least a portion of the vacuum canister, and into the void, wherein the moving the valve to the second position is performed during a period of time during which the target reduced air pressure is maintained, wherein the period of time is sufficient to allow the compound to flow into the void.   
     
     
         10 . The method according to  claim 9 , wherein at least a portion of the valve is positioned within the vacuum canister. 
     
     
         11 . The method according to  claim 9 , wherein the dispenser comprises a dispenser inlet to receive the compound and a dispenser outlet to channel the compound to the vacuum canister, the dispenser inlet being different from the dispenser outlet, and wherein the method further comprises positioning the dispenser with respect to the vacuum canister such that the dispenser outlet is positioned within the vacuum canister and such that the dispenser inlet is positioned outside of the vacuum canister. 
     
     
         12 . The method according to  claim 9 , wherein the vacuum canister comprises a canister inlet configured to allow the compound to flow from the dispenser into at least a portion of the vacuum canister, and wherein the method further comprises forming an inlet seal adjacent the canister inlet, wherein the inlet seal is configured to prevent air from passing between the inlet seal and the dispenser when the dispenser is at least partially positioned within the vacuum canister. 
     
     
         13 . The method according to  claim 9 , further comprising positioning the dispenser, wherein the positioning the dispenser is performed after the positioning the vacuum canister. 
     
     
         14 . The method according to  claim 13 , wherein the positioning the dispenser comprises inserting at least a portion of the dispenser through a canister inlet of the vacuum canister, wherein the canister inlet is configured to allow the compound to flow from the dispenser into at least a portion of the vacuum canister. 
     
     
         15 . The method according to  claim 9 , further comprising:
 separating the vacuum canister from the void, wherein the separating the vacuum canister is performed before the compound has cured; and   curing the compound.   
     
     
         16 . A method for depositing a compound into a void of a damaged area of a structure, the method comprising:
 at least partially filling a dispenser with the compound, via a dispenser inlet of the dispenser, wherein the dispenser is configured to hold the compound to be dispensed into the void;   positioning a vacuum canister with respect to the void such that a canister outlet of the vacuum canister surrounds an opening to the void, the canister outlet being configured to allow the compound to flow into the void from a dispenser outlet of the dispenser, wherein the dispenser outlet is configured to channel the compound to the vacuum canister, wherein the at least partially filling the dispenser is performed when the dispenser is spaced apart from the vacuum canister, and wherein the dispenser outlet is the same as the dispenser inlet;   forming an at least substantially air-impermeable seal between the canister outlet and the structure;   drawing air out of the vacuum canister and the void to maintain a target reduced air pressure within the vacuum canister, using a vacuum system operably coupled to the vacuum canister via a vacuum port; and   moving a valve from a first position, in which the valve is operable to retain the compound in the dispenser, to a second position, in which the compound flows from the dispenser, through at least a portion of the vacuum canister, and into the void, wherein the moving the valve to the second position is performed during a period of time during which the target reduced air pressure is maintained, wherein the period of time is sufficient to allow the compound to flow into the void.   
     
     
         17 . The method according to  claim 16 , further comprising operatively coupling the dispenser to the vacuum canister, wherein the operatively coupling the dispenser is performed such that the dispenser is operatively coupled to the vacuum canister when the compound is channeled through the dispenser outlet to the vacuum canister, and wherein the dispenser is operatively coupled to the vacuum canister such that the dispenser outlet is adjacent a canister inlet of the vacuum canister, wherein the canister inlet is configured to allow the compound to flow from the dispenser outlet into the vacuum canister. 
     
     
         18 . The method according to  claim 17 , wherein the operatively coupling the dispenser to the vacuum canister comprises coupling the dispenser outlet to the canister inlet. 
     
     
         19 . The method according to  claim 16 , further comprising:
 sealing the dispenser inlet with a dispenser seal such that the compound is prevented from flowing through the dispenser inlet once the dispenser inlet is sealed, wherein the sealing the dispenser inlet is performed after the at least partially filling the dispenser with the compound.   
     
     
         20 . The method according to  claim 19 , further comprising:
 removing the dispenser seal, such that the compound may flow through the dispenser inlet; and   positioning the dispenser with respect to the vacuum canister such that the compound enters the vacuum canister after it flows through the dispenser inlet, wherein the removing the dispenser seal is performed after the at least partially filling the dispenser with the compound and after the sealing the dispenser inlet with the dispenser seal.