Ribbon wire bond

Abstract

In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.

1 . An electrical apparatus, comprising:
 a substrate having a first surface;   lead pads on the first surface of the substrate;   a ribbon wire bond having open ends connected to the lead pads and at least one central portion between the open ends; and   an electrical component bonded to the at least one central portion of the ribbon wire bond, wherein the at least one central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.   
     
     
         2 . The electrical apparatus of  claim 1  wherein the ribbon wire bond is a U-shaped ribbon wire bond having legs at the open ends with ends of the legs bent parallel to the lead pads on the substrate, the legs extending from the open ends to the central portion and the central portion of the U-shaped ribbon wire bond straightened and parallel to the ends of the legs. 
     
     
         3 . The electrical apparatus of  claim 1  wherein the ribbon wire bond is U-shaped ribbon wire bond with legs at open ends of the U-shaped ribbon wire bond and having ends of the legs bent perpendicular to the first surface and extending into a surface of the lead pads, and the legs extending from the open ends to the central portion, the central portion of the U-shaped ribbon wire bond perpendicular to the ends of the legs. 
     
     
         4 . The electrical apparatus of  claim 1  wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs at an open end bent parallel to the lead pads on the substrate, and with central portions on points of the W of the W-shaped ribbon wire bond parallel to the ends of the legs. 
     
     
         5 . The electrical apparatus of  claim 1  wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs at the open ends of the W-shaped ribbon wire bond bent perpendicular to the first surface of the substrate and inserted into a surface of the lead pads, and with points of the W of the W-shaped ribbon wire bond flattened to form central portions that are perpendicular to the ends of the legs. 
     
     
         6 . The electrical apparatus of  claim 1  wherein the electrical component mounted on the ribbon wire bond is an inductor. 
     
     
         7 . The electrical apparatus of  claim 1  wherein the electrical component mounted on the ribbon wire bond is a transformer. 
     
     
         8 . The electrical apparatus of  claim 1  wherein the electrical component mounted on the ribbon wire bond is a bulk acoustic wave device. 
     
     
         9 . The electrical apparatus of  claim 1 , wherein the substrate is a printed circuit board (PCB). 
     
     
         10 . The electrical apparatus of  claim 9  wherein the electrical component mounted on the ribbon wire bond is a sub printed circuit board (sub-PCB) with one or more electrical components mounted on it. 
     
     
         11 . The electrical apparatus of  claim 1  wherein the substrate is a lead frame. 
     
     
         12 . A method for making an electrical apparatus, comprising:
 making a ribbon wire bond with a shape that is one selected from a group consisting essentially of a U-shape and a W-shape, the ribbon wire bond having at least one central portion between open ends;   soldering the open ends of the ribbon wire bond to lead pads on a first surface of a substrate; and   mounting an electrical component to the at least one central portion of the ribbon wire bond, the electrical component and the at least one central portion spaced from the first surface of the substrate.   
     
     
         13 . The method of  claim 12  wherein the ribbon wire bond is a U-shaped ribbon wire bond with ends of legs of open ends of the U-shaped ribbon wire bond bent parallel to the lead pads and with the central portion of the U-shaped ribbon wire bond parallel with the ends of the legs. 
     
     
         14 . The method of  claim 12  wherein the ribbon wire bond is a U-shaped ribbon wire bond with ends of legs of an open end of the U-shaped ribbon wire bond bent perpendicular to the first surface of the substrate and inserted into through-holes in the lead pads. 
     
     
         15 . The method of  claim 12  wherein the ribbon wire bond is a W-shaped ribbon wire bond with ends of legs of an open end of the W-shaped ribbon wire bond bent parallel to lead pads on a surface of the substrate. 
     
     
         16 . The method of  claim 12  wherein the ribbon wire bond is a through-hole mount, W-shaped ribbon wire bond with ends of legs of the open ends of the W-shaped ribbon wire bond perpendicular to a surface of the substrate and extending into the surface of the substrate through the lead pads. 
     
     
         17 . The method of  claim 12  wherein mounting an electrical component further comprises soldering a terminal of the electrical component to the central portion of the ribbon wire bond. 
     
     
         18 . A method of making a ribbon wire bond comprising:
 opening a stamping die consisting of a first half and a second half configured to bend a wire into a ribbon wire bond;   inserting a wire between the first half and second half of the open stamping die;   closing the stamping die and bending the wire to form the ribbon wire bond and to detach the ribbon wire bond from the wire; and   re-opening the stamping die and removing the ribbon wire bond.   
     
     
         19 . The method of  claim 18 , and further comprising:
 making the stamping die to accommodate at least two wires between the first half and second half when the stamping die is opened;   inserting at least two bond wires between the first half and second half;   closing the stamping die to form at least two ribbon wire bonds and to detach them from the wires; and   opening the stamping die and removing at least two ribbon wire bonds.   
     
     
         20 . The method of  claim 18  wherein the ribbon wire bond is a surface mount ribbon wire bond. 
     
     
         21 . The method of  claim 18  wherein the ribbon wire bond is a through-hole ribbon wire bond. 
     
     
         22 . The method of  claim 18  wherein the ribbon wire bond is a U-shaped ribbon wire bond. 
     
     
         23 . The method of  claim 18  wherein the ribbon wire bond is a W-shaped ribbon wire bond.