Electroluminescent diode array substrate, manufacturing method thereof and display panel

Abstract

An electroluminescent diode array substrate, a method of manufacturing the electroluminescent diode array substrate and a display panel are provided, and the electroluminescent diode array substrate includes: a base substrate; and an auxiliary electrode, a pixel definition layer, a first electrode, a functional layer and a second electrode disposed on the base substrate, the pixel definition layer is provided with a via hole structure, the auxiliary electrode is disposed on at least one side of the via hole structure, and the second electrode is electrically connected with the auxiliary electrode.

1 . An electroluminescent diode array substrate, comprising:
 a base substrate, and   an auxiliary electrode, a pixel definition layer, a first electrode, a functional layer, and a second electrode which are disposed on the base substrate,   wherein the pixel definition layer is provided with a via hole structure;   the auxiliary electrode is disposed on at least one side of the via hole structure; and   the second electrode is electrically connected with the auxiliary electrode.   
     
     
         2 . The electroluminescent diode array substrate according to  claim 1 , wherein an upper surface of the auxiliary electrode is higher than an upper surface of the functional layer in the via hole structure. 
     
     
         3 . The electroluminescent diode array substrate according to  claim 1 , wherein the auxiliary electrode is a structure in a U shape. 
     
     
         4 . The electroluminescent diode, array substrate according to  claim 1 , wherein the auxiliary electrode is a plate-type structure; or there are a plurality of auxiliary electrodes which are spaced apart from each other. 
     
     
         5 . The electroluminescent diode array substrate according to  claim 3 , wherein a conductive polymer layer is provided in the via hole structure, and the second electrode is electrically connected with the auxiliary electrode by the conductive polymer layer. 
     
     
         6 . The electroluminescent diode array substrate according to  claim 5 , wherein a thickness of the conductive polymer layer is less than a thickness of the pixel definition layer. 
     
     
         7 . The electroluminescent diode array substrate according to  claim 5 , wherein a conductivity of the conductive polymer layer is greater than 10 −6  S/m. 
     
     
         8 . The electroluminescent diode array substrate according to  claim 5 , wherein a material of the conductive polymer layer comprises at least one of polypyrrole, polyphenylene sulfide, polyphthalocyanine, polyaniline and polythiophene. 
     
     
         9 . The electroluminescent diode array substrate according to  claim 5 , further comprising a planarization layer disposed between the base substrate and the pixel definition layer,
 wherein the via hole structure extends from the pixel definition layer and penetrates through the planarization layer.   
     
     
         10 . The electroluminescent diode array substrate according to  claim 9 , wherein a thickness of the conductive polymer layer is larger than a thickness of the planarization layer, and the thickness of the conductive polymer layer is smaller than a sum of the thickness of the planarization layer and a thickness of the pixel definition layer. 
     
     
         11 . The electroluminescent diode array substrate according to  claim 9 , wherein an upper surface of the conductive polymer layer is flush with an upper surface of the pixel definition layer. 
     
     
         12 . The electroluminescent diode array substrate according to  claim 9 , wherein there are a plurality of via hole structures penetrating through the planarization layer and the pixel definition layer, and the second electrode is electrically connected with the auxiliary electrode by the plurality of via hole structures. 
     
     
         13 . The electroluminescent diode array substrate according to  claim 9 , wherein a thickness of the functional layer is from about 100 nm to about 300 nm, a thickness of the auxiliary electrode is from about 0.5 μm to about 1 μm, a thickness of the planarization layer is from about 1 μm to about 3 μm, a thickness of the pixel definition layer is from about 1 μm to about 3 μm, and a thickness of the conductive polymer layer is from about 2 μm to about 5.7 μm. 
     
     
         14 . The electroluminescent diode array substrate according to  claim 13 , wherein the functional layer comprises at least one of a light-emitting layer, an electron injection layer, an electron transmission layer, a hole injection layer and a hole transmission layer. 
     
     
         15 . A display panel, comprising the electroluminescent diode array substrate according to  claim 1 . 
     
     
         16 . A method of manufacturing an electroluminescent diode array substrate, comprising:
 providing a base substrate,   forming an auxiliary electrode, a pixel definition layer, a first electrode, a functional layer and a second electrode on the base substrate,   wherein the pixel definition layer is provided with a via hole structure;   the auxiliary electrode is disposed on at least one side of the via hole structure; and   the second electrode is electrically connected with the auxiliary electrode.   
     
     
         17 . The manufacturing method according to  claim 16 , wherein an upper surface of the auxiliary electrode which is formed on at least one side of the via hole structure is higher than an upper surface of the functional layer in the via hole structure. 
     
     
         18 . The manufacturing method according to  claim 16 , before forming the auxiliary electrode, further comprising:
 forming a planarization layer on the base substrate, wherein the via hole structure extends from the pixel definition layer and penetrates through the planarization layer.   
     
     
         19 . The manufacturing method according to  claim 16 , further comprising:
 forming a conductive polymer layer in the via hole structure, wherein the second electrode is electrically connected with the auxiliary electrode by the conductive polymer layer.   
     
     
         20 . The manufacturing method according to  claim 19 , wherein the conductive polymer layer is formed by an inkjet printing method.