Semiconductor package with die stacked on surface mounted devices

Abstract

One or more embodiments are directed to semiconductor packages and methods in which one or more electrical components are positioned between a semiconductor die and a surface of a substrate. In one embodiment, a semiconductor package includes a substrate having a first surface. One or more electrical components are electrically coupled to electrical contacts on the first surface of the substrate. A semiconductor die is positioned on the one or more electrical components, and the semiconductor die has an active surface that faces away from the substrate. An adhesive layer is on the first surface of the substrate and on the one or more electrical components, and the semiconductor die is spaced apart from the one or more electrical components by the adhesive layer. Wire bonds are provided that electrically couples the active surface of the semiconductor die to the substrate.

1 . A semiconductor package, comprising:
 a substrate having a first surface;   electrical contacts on the first surface of the substrate;   one or more surface mount electrical components on the first surface of the substrate and electrically coupled to the electrical contacts;   a semiconductor die on the one or more electrical components, the semiconductor die having an active surface that faces away from the substrate;   an adhesive layer on the first surface of the substrate and on the one or more electrical components, the semiconductor die being spaced apart from the one or more electrical components by the adhesive layer; and   wire bonds that electrically couple the active surface of the semiconductor die to the substrate.   
     
     
         2 . The semiconductor package of  claim 1  wherein the adhesive layer is glue, and the glue encapsulates the one or more electrical components between the semiconductor die and the first surface of the substrate. 
     
     
         3 . The semiconductor package of  claim 1  wherein the one or more electrical components are passive electrical components. 
     
     
         4 . The semiconductor package of  claim 1  wherein the substrate includes a second surface opposite to the first surface, the semiconductor package further including an array of solder balls or an array of lands on the second surface of the substrate. 
     
     
         5 . The semiconductor package of  claim 1 , further comprising an encapsulation layer on the semiconductor die, the wire bonds, and the first surface of the substrate. 
     
     
         6 . The semiconductor package of  claim 1 , wherein:
 the substrate includes a cavity that extends into the substrate from a second surface of the substrate to the first surface, the first surface being between the second surface and a third surface that is opposite the second surface.   
     
     
         7 . The semiconductor package of  claim 6  wherein the adhesive encapsulates the one or more electrical components between the semiconductor die and the first surface of the substrate. 
     
     
         8 . (canceled) 
     
     
         9 . The semiconductor package of  claim 6  further comprising an encapsulation layer on the semiconductor die and the second surface of the substrate. 
     
     
         10 . The semiconductor package of  claim 9  wherein the encapsulation layer extends between neighboring electrical components in the cavity. 
     
     
         11 . The semiconductor package of  claim 6  wherein the substrate is a multi-layer printed circuit board (PCB) having a plurality of electrical contacts exposed on the first surface of the substrate, and the one or more electrical components are electrically coupled to the substrate via the exposed electrical contacts. 
     
     
         12 . A semiconductor package, comprising:
 a substrate having a first surface;   electrical contacts on the first surface of the substrate;   one or more solder balls on the first surface of the substrate;   a semiconductor die spaced apart from the substrate by the one or more solder balls, the semiconductor die having an active surface that faces away from the substrate;   one or more electrical components on the first surface of the substrate and positioned between the semiconductor die and the substrate, the one or more electrical components being electrically coupled to the electrical contacts;   an adhesive layer between the semiconductor die and the one or more electrical components; and   wire bonds that electrically couple the active surface of the semiconductor die to the substrate.   
     
     
         13 . The semiconductor package of  claim 12  further comprising an encapsulation layer on the semiconductor die and the first surface of the substrate, wherein the encapsulation layer extends between neighboring electrical components between the semiconductor die and the substrate. 
     
     
         14 . The semiconductor package of  claim 12  wherein the one or more electrical components includes a first electrical component having a first height and a second electrical component having a second height that is greater than the first height. 
     
     
         15 . The semiconductor package of  claim 12  wherein the adhesive layer extends between the semiconductor die and the one or more solder balls. 
     
     
         16 . A semiconductor package, comprising:
 a substrate having a first surface;   electrical contacts on the first surface of the substrate;   a spacer on the first surface of the substrate;   a semiconductor die on the spacer and spaced apart from the substrate by the spacer, the semiconductor die having an active surface that faces away from the substrate;   one or more electrical components on the first surface of the substrate and positioned between the substrate and the semiconductor die, the one or more electrical components being electrically coupled to the electrical contacts;   an adhesive layer between the semiconductor die and the one or more electrical components; and   wire bonds that electrically couple the active surface of the semiconductor die to the substrate.   
     
     
         17 . The semiconductor package of  claim 16 , further comprising an encapsulation layer on the semiconductor die and the first surface of the substrate, wherein the encapsulation layer extends between the one or more electrical components and the spacer, and further extends between the one or more electrical components and the semiconductor die. 
     
     
         18 . The semiconductor package of  claim 16 , wherein the adhesive layer extends between the semiconductor die and the spacer. 
     
     
         19 . A method, comprising:
 attaching one or more electrical components to a surface of a substrate;   electrically coupling the one or more electrical components to corresponding electrical contacts on the substrate;   positioning a semiconductor die on the one or more electrical components, the semiconductor die having an active surface that faces away from the surface of the substrate;   electrically coupling the active surface of the semiconductor die to corresponding electrical contacts on the substrate; and   forming an encapsulation layer over the semiconductor die, the encapsulation layer extending from the active surface of the semiconductor die to the surface of the substrate.   
     
     
         20 . The method of  claim 19 , further comprising:
 forming a cavity in the substrate, wherein the attaching the one or more electrical components to the surface of the substrate includes attaching the one or more electrical components to a surface of the cavity, the surface of the cavity being between a first surface of the substrate and a second surface of the substrate that is opposite the first surface.   
     
     
         21 . The semiconductor package of  claim 6  wherein the wire bonds are electrically coupled to electrical contacts on the second surface of the substrate.