Middle member of heat dissipation device and the heat dissipation device

Abstract

A middle member of heat dissipation device and the heat dissipation device. The middle member includes a middle member main body having a first face, a second face, multiple perforations and a channeled structure. The channeled structure is disposed on the first face or the second face. The perforations are formed through the middle member main body between the first and second faces. The channeled structure and the perforations are arranged in alignment with each other or not in alignment with each other. The middle member and a first plate body and a second plate body are overlapped with each other to form the heat dissipation device. The complex structures disposed on the first and second faces of the middle member main body are able to achieve a stable vapor-liquid circulation effect.

What is claimed is: 
     
         1 . A middle member of heat dissipation device, comprising a middle member main body, the middle member main body having a first face, a second face, multiple perforations and a channeled structure, the channeled structure being disposed on the first face or the second face, the perforations being formed through the middle member main body between the first and second faces, the channeled structure and the perforations being arranged in alignment with each other or not in alignment with each other. 
     
     
         2 . The middle member of heat dissipation device as claimed in  claim 1 , wherein the channeled structure has multiple recesses, the recesses being arranged at intervals and recessed from the first face to the second face, the perforations and the recesses being horizontally arranged not in alignment with each other, at least one communication passage being formed between each two recesses, two ends of the communication passage being serially connected with the recesses. 
     
     
         3 . The middle member of heat dissipation device as claimed in  claim 1 , wherein the channeled structure has multiple bosses, the bosses being arranged in array at intervals, the bosses defining multiple channels therebetween, the perforations and the bosses being horizontally arranged not in alignment with each other or vertically arranged corresponding to each other. 
     
     
         4 . The middle member of heat dissipation device as claimed in  claim 3 , wherein the channels are disposed on the first face in a longitudinal direction of the middle member main body or in a transverse direction of the middle member main body or in both the longitudinal and transverse directions of the middle member main body to intersect each other. 
     
     
         5 . The middle member of heat dissipation device as claimed in  claim 3 , wherein the channels are disposed on the first face in a longitudinal direction or in a transverse direction or in both the longitudinal and transverse directions to intersect each other. 
     
     
         6 . The middle member of heat dissipation device as claimed in  claim 2 , wherein the cross section of the recesses has a geometrical configuration selected from a group consisting of circular, elliptic, quadrangular, rhombic and triangular configuration, the cross section meaning the cross sectional horizontally extending along the first face or the second face of the middle member main body. 
     
     
         7 . The middle member of heat dissipation device as claimed in  claim 3 , wherein the cross section of the bosses has a geometrical configuration selected from a group consisting of circular, elliptic, quadrangular, rhombic and triangular configuration, the cross section meaning the cross sectional horizontally extending along the first face or the second face of the middle member main body. 
     
     
         8 . The middle member of heat dissipation device as claimed in  claim 1 , wherein the middle member main body is made of a material selected from a group consisting of pure titanium, titanium alloy, copper, aluminum, stainless steel, ceramic material, aluminum alloy and copper alloy. 
     
     
         9 . The middle member of heat dissipation device as claimed in  claim 1 , wherein the channeled structure has multiple bosses, the bosses being arranged in array at intervals, the bosses defining multiple channels therebetween, the middle member main body being defined with a first section, a second section and a third section, two ends of the first section being connected with the second and third sections, the intervals between the bosses of the first section being smaller than the intervals between the bosses of the second and third sections, the diameter of the perforations of the first section being smaller than the diameter of the perforations of the second and third sections, the first section being an evaporation section, while the second and third sections being condensation sections. 
     
     
         10 . The middle member of heat dissipation device as claimed in  claim 9 , wherein the volume of the bosses of the first section is smaller than the volume of the bosses of the second and third sections. 
     
     
         11 . The middle member of heat dissipation device as claimed in  claim 1 , wherein the channeled structure is disposed on both the first and second faces of the middle member main body. 
     
     
         12 . The middle member of heat dissipation device as claimed in  claim 11 , wherein the channeled structure is composed of multiple recesses or multiple bosses or multiple recesses and multiple bosses arranged at intervals. 
     
     
         13 . The middle member of heat dissipation device as claimed in  claim 1 , wherein the perforations have multiple connection passages in horizontal direction, the connection passages horizontally extending to connect two adjacent perforations, the connection passages being disposed on any of the first and second faces or both the first and second faces or disposed between the first and second faces of the middle member main body. 
     
     
         14 . The middle member of heat dissipation device as claimed in  claim 1 , wherein the surface of the channeled structure has a nanometer structure layer, the nanometer structure layer being nanometer whisker layer or nanometer carbonized layer or nanometer oxidization layer, the nanometer oxidization layer being copper oxide, titanium oxide or aluminum oxide. 
     
     
         15 . A heat dissipation device comprising:
 a middle member main body, the middle member main body having a first face, a second face, multiple perforations and a channeled structure, the channeled structure being disposed on the first face or the second face, the perforations being formed through the middle member main body between the first and second faces, the channeled structure and the perforations being arranged in alignment with each other or not in alignment with each other;   a first plate body having a first surface and a second surface; and   a second plate body having a third surface and a fourth surface, the first and third surfaces being correspondingly mated with each other to together define a closed chamber, the middle member main body being disposed in the closed chamber, a working fluid being filled in the closed chamber.   
     
     
         16 . The heat dissipation device as claimed in  claim 15 , wherein the first surface of the first plate body has multiple raised sections, the second surface being formed with multiple depressions in positions opposite to the raised sections, the raised sections being correspondingly attached to the first face of the middle member main body, the third surface of the second plate body being correspondingly attached to the second face of the middle member main body. 
     
     
         17 . The heat dissipation device as claimed in  claim 15 , wherein the first surface of the first plate body has multiple raised sections, the second surface being formed with multiple depressions in positions opposite to the raised sections, the raised sections being correspondingly attached to the second face of the middle member main body, the third surface of the second plate body being correspondingly attached to the first face of the middle member main body. 
     
     
         18 . The heat dissipation device as claimed in  claim 15 , wherein the second surface of the first plate body is defined as a condensation face, at least one section of the first surface being defined as a condensation section, the fourth surface of the second plate body being defined as a heat absorption face, at least one section of the third surface being defined as an evaporation section, the condensation section and the evaporation section being up and down correspondingly arranged. 
     
     
         19 . The heat dissipation device as claimed in  claim 15 , wherein the middle member main body and the first and second plate bodies are made of a material selected from a group consisting of pure titanium, titanium alloy, copper, aluminum, stainless steel and ceramic material. 
     
     
         20 . The heat dissipation device as claimed in  claim 15 , wherein a microstructure is disposed on the third surface of the second plate body, the microstructure being a rough face composed of multiple channels or multiple pits and multiple protrusions or a sintered powder layer or a coating layer, the coating layer being a hydrophobic layer or a hydrophilic layer. 
     
     
         21 . The heat dissipation device as claimed in  claim 15 , wherein the channeled structure is disposed on both the first and second faces of the middle member main body. 
     
     
         22 . The heat dissipation device as claimed in  claim 15 , wherein at least one section of the third surface of the second plate body is defined as an evaporation section and either or both of the left end and the right end of the third surface relative to the evaporation section are defined as condensation ends. 
     
     
         23 . The heat dissipation device as claimed in  claim 15 , wherein the surface of the channeled structure has a nanometer structure layer, the nanometer structure layer being nanometer whisker layer or nanometer carbonized layer or nanometer oxidization layer, the nanometer oxidization layer being copper oxide, titanium oxide or aluminum oxide. 
     
     
         24 . The heat dissipation device as claimed in  claim 23 , wherein the channeled structure is correspondingly attached to the third surface of the second plate body.