US2019279970A1PendingUtilityA1

Solid-state transducer assemblies with remote converter material for improved light extraction efficiency and associated systems and methods

Assignee: MICRON TECHNOLOGY INCPriority: May 4, 2012Filed: May 23, 2019Published: Sep 12, 2019
Est. expiryMay 4, 2032(~5.8 yrs left)· nominal 20-yr term from priority
H10W 90/00H01L 33/507H01L 2924/0002H01L 25/0753H10H 20/8515H10H 20/856H10H 20/853
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Claims

Abstract

Solid state transducer (“SST”) assemblies with remote converter material and improved light extraction efficiency and associated systems and methods are disclosed herein. In one embodiment, an SST assembly has a front side from which emissions exit the SST assembly and a back side opposite the front side. The SST assembly can include a support substrate having a forward-facing surface directed generally toward the front side of the SST assembly and an SST structure carried by the support substrate. The SST structure can be configured to generate SST emissions. The SST assembly can further include a converter material spaced apart from the SST structure. The forward-facing surface and the converter material can be configured such that at least a portion of the SST emissions that exit the SST assembly at the front side do not pass completely through the converter material.

Claims

exact text as granted — not AI-modified
I/We claim: 
     
         1 . A method of making a solid state transducer (SST) assembly having a front side from which emissions exit the SST assembly and a back side opposite the front side, the method comprising:
 forming a converter material having a thickness on a forward-facing surface of a support substrate, wherein the forward-facing surface is directed toward an opening of the support substrate at the front side of the SST assembly; and   mounting an SST structure on a portion of the support substrate spaced apart from the converter material, the SST structure being configured to generate SST emissions, wherein at least a portion of the SST emissions pass through less than the thickness of the converter material before exiting the SST assembly.   
     
     
         2 . The method of  claim 1  wherein:
 mounting the SST structure comprises positioning the SST structure on a surface of the support substrate facing generally toward the back side of the SST assembly; and 
 forming the converter material comprises positioning the converter material a greater distance from the front side of the SST assembly than the SST structure. 
 
     
     
         3 . The method of  claim 1  wherein:
 mounting the SST structure comprises positioning the SST structure on a surface of the substrate facing generally toward the front side of the SST assembly; and 
 forming the converter material comprises positioning the converter material laterally apart from the SST structure at an angle facing generally toward the front side. 
 
     
     
         4 . The method of  claim 1 , further comprising forming a cover feature over the SST structure, wherein the cover feature is configured to direct the SST emissions generally toward the converter material. 
     
     
         5 . The method of  claim 1 , further comprising forming a reflective material on the forward-facing surface, wherein the converter material is on the reflective material of the forward-facing surface. 
     
     
         6 . The method of  claim 1 , further comprising forming the support substrate, the support substrate including a flanged portion and an opening at the front side of the SST assembly, the flanged portion having a support surface facing generally toward the back side of the SST assembly and configured to carry the SST structure, wherein the forward-facing surface is positioned toward the back side of the SST assembly relative to the support surface and configured to direct emissions through the opening. 
     
     
         7 . The method of  claim 6 , further comprising forming the forward-facing surface of the substrate such that the forward-facing surface is configured to direct SST emissions toward the front side of the SST assembly. 
     
     
         8 . The method of  claim 1  mounting the SST structure comprises positioning the SST structure on a surface of the support substrate such that at least a portion of SST emissions that exit the SST assembly at the front side do not pass completely through the thickness of the converter material. 
     
     
         9 . The method of  claim 1  wherein the thickness of the converter material is such that more SST emissions reflect from an outer surface of the converter material than pass through the converter material. 
     
     
         10 . A method of operating a solid-state transducer (SST) assembly having a front side and a back side opposite the front side, the method comprising:
 generating emissions with an SST structure directed generally toward a converter material on a forward-facing surface of a support substrate, the converter material being spaced apart from the SST structure and having a thickness;   stimulating the converter material with the emissions generated by the SST structure; and   extracting emissions from the front side of the SST assembly via an opening in the support substrate, wherein at least a portion of the emissions that exit the SST assembly do not pass completely through the thickness of the converter material.   
     
     
         11 . The method of  claim 10  wherein:
 generating emissions from the SST structure includes generating emissions directed generally toward the back side of the SST assembly, wherein the forward-facing surface is positioned toward the back side of the SST assembly relative to the SST structure; and 
 the method further comprises directing the emissions generally toward the front side through the opening using the converter material and/or the forward-facing surface. 
 
     
     
         12 . The method of  claim 10  wherein:
 generating emissions from the SST structure includes directing emissions generally toward the front side of the SST assembly, wherein the forward-facing surface is spaced laterally outward from the SST structure and is angled toward the front side; and 
 the method further comprises directing the emissions from the SST structure toward the forward-facing surface via a cover feature. 
 
     
     
         13 . The method of  claim 12  wherein directing the emissions from the SST structure toward the forward-facing surface via the cover feature further comprises:
 directing a first portion of the emissions laterally outward in a first direction via a first lobe of the cover feature; and 
 directing a second portion of the emissions laterally outward in a second direction different from the first direction. 
 
     
     
         14 . The method of  claim 10 , further comprising reflecting the emissions from the forward-facing surface toward the opening via a reflective portion of the forward-facing surface, wherein the converter material is on the reflective portion. 
     
     
         15 . The method of  claim 10  wherein extracting emissions from the front side of the SST assembly comprises reflecting the emissions from the SST structure once from an outer surface of the converter material before exiting the SST assembly. 
     
     
         16 . The method of  claim 10  wherein the thickness of the converter material is such that more SST emissions reflect from an outer surface of the converter material than pass completely through the converter material. 
     
     
         17 . A method of making a light emitting diode (LED) assembly having a front side from which emissions exit the LED assembly and a back side opposite the front side, the method comprising:
 forming a wavelength converter material having a thickness on a forward-facing surface of a support substrate, wherein the forward-facing surface is directed toward an opening of the support substrate at the front side of the LED assembly; and   mounting an LED structure on a portion of the support substrate spaced apart from the wavelength converter material, wherein, when the LED structure generates light, at least a portion of light that exits the LED assembly at the front side does not pass completely through the thickness of the wavelength converter material.   
     
     
         18 . The method of  claim 17  wherein the thickness of the wavelength converter material is such that more light reflects off of an outer surface of the wavelength converter material than passes completely through the wavelength converter material. 
     
     
         19 . The method of  claim 17 , further comprising:
 forming a reflective material on the forward-facing surface of the substrate before forming the wavelength converter material thereon.   
     
     
         20 . The method of  claim 17  wherein mounting the LED structure comprises mounting the LED structure on a surface that generally faces the back side of the LED assembly such that, when the LED structure generates light, the light initially travels generally toward the back side of the LED assembly where the light strikes an outer surface of the wavelength converter material and reflects toward the front side to exit the LED assembly.

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