Substrate processing apparatus, substrate processing method, and storage medium with program stored therein for executing substrate processing method

Abstract

The present disclosure relates to a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of an adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to a substrate, a substrate heating unit configured to subsequently heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent in the processing liquid and is lower than the boiling point of the removing agent, and a rinsing liquid supplying unit configured to subsequently supply a rinsing liquid to the substrate so as to remove the adhered substance from the substrate.

What is claimed is: 
     
         1 . A substrate processing apparatus comprising:
 a removal processing unit configured to remove an adhered substance from the substrate; and   a controller configured to control an operation of the removal processing unit, wherein the removal processing unit comprises:   a processing liquid supplying unit configured to supply a processing liquid that contains a removing agent of the adhered substance and a solvent having a boiling point lower than a boiling point of the removing agent to the substrate;   a substrate heating unit configured to heat the substrate at a predetermined temperature that is equal to or higher than the boiling point of the solvent and is lower than the boiling point of the removing agent; and   a rinsing liquid supplying unit configured to supply a rinsing liquid to the substrate, and   wherein the controller controls the processing liquid supplying unit, the substrate heating unit, and the rinsing liquid supplying unit in such a manner that the processing liquid supplying unit supplies the processing liquid to the substrate, the substrate heating unit heats the substrate at the predetermined temperature so as to promote evaporation of the solvent and reaction of the adhered substance with the removing agent, and the rinsing liquid supplying unit supplies the rinsing liquid to the substrate so as to remove the adhered substance from the substrate.   
     
     
         2 . The substrate processing apparatus of  claim 1 , wherein the processing liquid further contains a thickener. 
     
     
         3 . The substrate processing apparatus of  claim 2 , wherein the thickener has a glass transition point that exceeds the boiling point of the solvent and is equal to or lower than the boiling point of the removing agent. 
     
     
         4 . The substrate processing apparatus of  claim 3 , wherein the predetermined temperature is equal to or higher than the boiling point of the solvent and is lower than the glass transition point of the thickener. 
     
     
         5 . The substrate processing apparatus of  claim 3 , wherein the predetermined temperature is equal to or higher than the glass transition point of the thickener and is lower than the boiling point of the removing agent. 
     
     
         6 . The substrate processing apparatus of  claim 2 , wherein the thickener has a glass transition point equal to or higher than the boiling point of the removing agent. 
     
     
         7 . The substrate processing apparatus of  claim 1 , wherein the adhered substance is a hard mask film for etching. 
     
     
         8 . The substrate processing apparatus of  claim 1 , wherein the controller controls the processing liquid supplying unit, the substrate heating unit, and the rinsing liquid supplying unit in such a manner that the processing liquid supplying unit supplies the processing liquid to the substrate so as to form a film of the processing liquid that covers the adhered substance on the substrate, the substrate heating unit subsequently heats the substrate at the predetermined temperature while the adhered substance is covered by the film of the processing liquid so as to promote the evaporation of the solvent and the reaction of the adhered substance with the removing agent, and the rinsing liquid supplying unit supplies the rinsing liquid to the substrate so as to remove the adhered substance from the substrate.