Manufacturing method of vapor chamber

Abstract

A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome. A manufacturing method of the above-described vapor chamber is also disclosed.

What is claimed is: 
     
         1 . A manufacturing method of vapor chamber, comprising the following steps:
 (a) providing a metal plate and a ceramic plate;   (b) providing a wick structure and a support structure on faces of the metal plate and the ceramic plate that are to be faced toward each other later; and   (c) correspondingly closing the metal plate and the ceramic plate to each other to define a chamber therebetween, evacuating the chamber, filling a working fluid into the chamber, and sealing a joint between the closed metal plate and ceramic plate to complete a vapor chamber.   
     
     
         2 . The manufacturing method of vapor chamber as claimed in  claim 1 , wherein the wick structure is selected from the group consisting of a sintered powder structure, a netlike structure, and a plurality of grooves, in the case that the wicking structure is a plurality of grooves, the grooves being formed by way of laser processing, etching or cutting processing. 
     
     
         3 . The manufacturing method of vapor chamber as claimed in  claim 1 , wherein the ceramic plate is made of a material selected from the group consisting of silicon nitride (Si 3 N 4 ), zirconium nitride (ZrO 2 ), and aluminum oxide (Al 2 O 3 ). 
     
     
         4 . The manufacturing method of vapor chamber as claimed in  claim 1 , wherein the support structure is connected to the ceramic plate and the metal plate in a manner selected from the group consisting of soldering, brazing, diffusion bonding, ultrasonic welding, and direct bonding copper (DBC) process. 
     
     
         5 . The manufacturing method of vapor chamber as claimed in  claim 1 , wherein the support structure includes a plurality of copper posts. 
     
     
         6 . The manufacturing method of vapor chamber as claimed in  claim 1 , wherein the support structure is made of a material selected from a group consisting of copper, aluminum, iron, stainless steel, ceramic material, commercial pure titanium, titanium alloy, copper alloy and aluminum alloy. 
     
     
         7 . The manufacturing method of vapor chamber as claimed in  claim 1 , wherein, in the step (c), the correspondingly closed metal plate and ceramic plate are connected to each other in a manner selected from the group consisting of soldering, brazing, diffusion bonding, ultrasonic welding, and direct bonding copper (DBC) process.