Pad conditioner and method of conditioning planarization pad

Abstract

A method including rotating a plate of a pad conditioner about an axis parallel to an axis of rotation of a planarization pad of a planarization device. The method further includes dispensing a fluid material onto an upper surface of the planarization pad through a nozzle opening of the pad conditioner during a planarization process, wherein the fluid material comprises an acid. The method further includes maintaining the pad conditioner at a position spaced from the upper surface of the planarization pad during the dispensing of the fluid material and the rotating of the plate.

What is claimed is: 
     
         1 . A method comprising:
 rotating a plate of a pad conditioner about an axis parallel to an axis of rotation of a planarization pad of a planarization device;   dispensing a fluid material onto an upper surface of the planarization pad through a nozzle opening of the pad conditioner during a planarization process, wherein the fluid material comprises an acid;   maintaining the pad conditioner at a position spaced from the upper surface of the planarization pad during the dispensing of the fluid material and the rotating of the plate.   
     
     
         2 . The method of  claim 1 , wherein the dispensing the fluid material further comprises:
 dispensing the fluid material at a predetermined spray pressure at the nozzle openings, the predetermined spray pressure ranging from 0.1 pounds per square inch (PSI) to 20 PSI.   
     
     
         3 . The method of  claim 1 , wherein the dispensing the fluid material further comprises:
 dispensing the fluid material at a predetermined spray angle at the nozzle openings, the predetermined spray angle ranging from 0 degrees to 45 degrees with respect to a direction perpendicular to the upper surface of the planarization pad.   
     
     
         4 . The method of  claim 1 , wherein the dispensing the fluid material further comprises dispensing a slurry material during a period the planarization pad is operated to perform the planarization process. 
     
     
         5 . The method of  claim 1 , wherein dispensing the fluid material further comprises dispensing one or more of water, de-ionized water NH 4 OH based solution, KOH based solution, silica based solution, cerium based solution, or hydrous solution having a water weight percentage greater than 20%, during a period before or after the planarization pad is operated to perform the planarization process. 
     
     
         6 . The method of  claim 1 , wherein dispensing the fluid material comprises dispensing the acid comprising at least one of an HF based solution or a citric acid based solution. 
     
     
         7 . The method of  claim 1 , wherein dispensing the fluid material comprises dispensing the fluid material from a plurality of nozzles. 
     
     
         8 . The method of  claim 1 , wherein dispensing the fluid material comprises dispensing the fluid material from a plurality of nozzles arranged in a concentric pattern. 
     
     
         9 . The method of  claim 1 , wherein dispensing the fluid material comprises dispensing the fluid material from a plurality of nozzles arranged in a circular pattern. 
     
     
         10 . The method of  claim 1 , wherein dispensing the fluid material comprises dispensing the fluid material from a plurality of nozzles arranged along two intersecting lines. 
     
     
         11 . The method of  claim 1 , wherein dispensing the fluid material comprises dispensing the fluid material from a plurality of nozzles arranged in a polygonal pattern. 
     
     
         12 . A planarization device, comprising:
 a planarization pad; and   a pad conditioner over the planarization pad, the pad conditioner comprising:
 a rotatable plate having a lower surface separated from an upper surface of the planarization pad by a predetermined distance; 
 a plurality of nozzle openings on the lower surface of the rotatable plate; and 
 a fluid dispensing unit configured to selectively dispense a fluid material onto the upper surface of the planarization pad through the plurality of nozzle openings based on an operating mode of the planarization device, wherein the fluid material comprises an acid, and the pad conditioner is configured to maintain at least the predetermined distance between the lower surface of the rotatable plate and the upper surface of the planarization pad during dispensing of the fluid material. 
   
     
     
         13 . The planarization device of  claim 12 , further comprising a slurry dispenser for dispensing a slurry onto the planarization pad, wherein the slurry dispenser is spaced from the pad conditioner. 
     
     
         14 . The planarization device of  claim 1 , wherein the plurality of nozzles is arranged in a concentric pattern. 
     
     
         15 . The planarization device of  claim 1 , wherein the plurality of nozzles is arranged in a circular pattern. 
     
     
         16 . The planarization device of  claim 1 , wherein the plurality of nozzles is arranged along two intersecting lines. 
     
     
         17 . The planarization device of  claim 1 , wherein the plurality of nozzles is arranged in a polygonal pattern. 
     
     
         18 . A method comprising:
 dispensing a slurry onto a planarization pad;   rotating the planarization pad about a first axis;   rotating a plate of a pad conditioner about an axis parallel to the first axis;   dispensing a fluid material onto an upper surface of the planarization pad through a plurality of nozzle openings of the pad conditioner during the rotation of the planarization pad, wherein the fluid material comprises an acid;   maintaining the pad conditioner at a position spaced from the upper surface of the planarization pad during the dispensing of the fluid material and the rotating of the plate.   
     
     
         19 . The method of  claim 18 , wherein dispensing the fluid material comprises dispensing the fluid material during the dispensing of the slurry. 
     
     
         20 . The method of  claim 18 , wherein dispensing the fluid material comprises dispensing the fluid material during a period before or after the planarization pad is operated to perform a planarization process.