Heat dissipation device

Abstract

A heat dissipation device includes a storage structure, plural pipes, plural heat sink fin groups and a vaporization-enhancing structure. The heat sink fin groups are disposed on outer surfaces of the pipes. The storage structure includes a chamber. The storage structure is in thermal contact with a heat source. Each pipe has a channel. A first end of the channel is in fluid communication with the chamber. A working medium is filled in the chamber and the channels of the pipes. The vaporization-enhancing structure is disposed within the chamber and in thermal contact with at least a portion of the working medium. After the vaporization-enhancing structure receives heat energy from the heat source, the heat energy is transferred to the working medium. The vaporization-enhancing structure facilitates liquid-gas transformation of the working medium. Consequently, the working medium moves toward a second end of the first channel.

What is claimed is: 
     
         1 . A heat dissipation device, comprising:
 a first storage structure comprising a first chamber, wherein the first storage structure is in thermal contact with a heat source;   at least one first pipe, wherein an inner portion of each first pipe has a first channel, a first end of the first channel is in fluid communication with the first chamber, and a working medium is filled in the first chamber and the first channel;   at least one heat sink fin group disposed on an outer surface of the at least one first pipe; and   a vaporization-enhancing structure disposed within the first chamber and in thermal contact with the first storage structure and at least a portion of the working medium, wherein after the vaporization-enhancing structure receives heat energy from the heat source, the heat energy is transferred to the working medium, wherein the vaporization-enhancing structure facilitates liquid-gas transformation of the working medium, so that the working medium moves in a direction toward a second end of the first channel.   
     
     
         2 . The heat dissipation device according to  claim 1 , wherein the at least one first pipe comprises plural first pipes, and the at least one heat sink fin group comprises plural heat sink fin groups, wherein each of the plural first pipes is arranged between two adjacent ones of the plural heat sink fin groups. 
     
     
         3 . The heat dissipation device according to  claim 1 , wherein the vaporization-enhancing structure comprises plural skived fins. 
     
     
         4 . The heat dissipation device according to  claim 1 , wherein the first storage structure further comprises a first plate, a second plate and plural lateral plates, wherein the plural lateral plates are connected between the first plate and the second plate, and the first chamber is defined by the first plate, the second plate and the plural lateral plates collaboratively. 
     
     
         5 . The heat dissipation device according to  claim 4 , wherein the second plate comprises at least one opening, and the opening is in communication with the first end of the first channel. 
     
     
         6 . The heat dissipation device according to  claim 1 , wherein the heat dissipation device further comprises a second storage structure, and the second storage structure comprises a second chamber, wherein the second chamber is in fluid communication with the second end of the first channel, and a sealed space is defined by the first chamber, the second chamber and the at least one first channel. 
     
     
         7 . The heat dissipation device according to  claim 6 , wherein the heat dissipation device further comprises a heat dissipation element, wherein the heat dissipation element is disposed on an outer surface of the second storage structure. 
     
     
         8 . The heat dissipation device according to  claim 6 , wherein the heat dissipation device further comprises a liquefaction-enhancing structure, wherein the liquefaction-enhancing structure is disposed within the second chamber and in thermal contact with the second storage structure and at least a portion of the working medium, wherein the liquefaction-enhancing structure facilitates gas-liquid transformation of the working medium, so that the working medium moves in a direction toward the first end of the first channel. 
     
     
         9 . The heat dissipation device according to  claim 8 , wherein the liquefaction-enhancing structure comprises plural skived fins. 
     
     
         10 . The heat dissipation device according to  claim 1 , wherein the second end of the first channel is closed. 
     
     
         11 . The heat dissipation device according to  claim 1 , wherein the first end and the second end of the at least one first pipe are connected with the first storage structure. 
     
     
         12 . The heat dissipation device according to  claim 1 , wherein an inner portion of the at least one first pipe is equipped with a liquefaction-enhancing structure, wherein the liquefaction-enhancing structure facilitates gas-liquid transformation of the working medium, so that the working medium moves in a direction toward the first end of the first channel. 
     
     
         13 . The heat dissipation device according to  claim 12 , wherein the liquefaction-enhancing structure comprises plural capillary structures or recesses, which are formed on an inner surface of the at least one first pipe and disposed within the first channel. 
     
     
         14 . The heat dissipation device according to  claim 1 , wherein the heat dissipation device further comprises:
 a third storage structure comprising a third chamber, wherein the third storage structure is in thermal contact with the heat source or an additional heat source;   at least one second pipe, wherein an inner portion of each second pipe has a second channel, a first end of the second channel is in fluid communication with the third chamber, and an additional working medium is filled in the third chamber and the second channel;   at least one additional heat sink fin group disposed on an outer surface of the at least one second pipe; and   an additional vaporization-enhancing structure disposed within the third chamber and in thermal contact with the third storage structure and at least a portion of the additional working medium, wherein after the vaporization-enhancing structure receives heat energy from the heat source or the additional heat source, the heat energy is transferred to the additional working medium, wherein the additional vaporization-enhancing structure facilitates liquid-gas transformation of the additional working medium, so that the additional working medium moves in a direction toward a second end of the second channel.   
     
     
         15 . The heat dissipation device according to  claim 14 , wherein at least one of the first storage structure and the at least one first pipe and at least one of the third storage structure and the at least one second pipe are directly connected with each other and linked with each other, or at least one of the first storage structure and the at least one first pipe and at least one of the third storage structure and the at least one second pipe are linked with each other through an intermediate coupling mechanism. 
     
     
         16 . The heat dissipation device according to  claim 14 , wherein the first pipe is a vertical pipe, and the second pipe is a horizontal pipe. 
     
     
         17 . The heat dissipation device according to  claim 14 , wherein the additional vaporization-enhancing structure comprises plural skived fins.