Visible light communication system-on-a-chip
Abstract
This disclosure relates to visible light communication (VLC) system-on-a-chip (SoC) systems/methods and VLC system-in-a-package (SiP) systems/methods. A VLC SoC system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a first portion of a silicon substrate and an LED fabricated in a compound semiconductor selectively grown on a second portion of the silicon substrate. A VLC SiP system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a silicon substrate and an LED fabricated in a compound semiconductor. The integrated circuit and the LED may be packaged in a SiP module. Interconnects may be formed between the integrated circuit and the LED.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of making a visible light communication (VLC) system-on-a-chip (SoC) system, comprising:
fabricating an integrated circuit comprising a VLC encoder and an LED driver on a first portion of a silicon substrate; selectively growing a compound semiconductor on a second portion of the silicon substrate; and fabricating an LED in the compound semiconductor selectively grown on the second portion of the silicon substrate; wherein the LED is configured as a VLC transmitter, the VLC encoder is configured to encode a VLC signal, and the LED driver is configured to drive the LED to emit visible light in accordance with the VLC signal.
2 . The method of claim 1 , wherein the step of selectively growing the compound semiconductor on the second portion of the silicon substrate comprises:
using a photo mask on the silicon substrate to define an opening; depositing seeds into the opening; and selectively growing the compound semiconductor in the opening.
3 . The method of claim 1 , further comprising:
growing a buffer layer between the compound semiconductor and the second portion of the silicon substrate.
4 . The method of claim 1 , wherein the VLC encoder comprises a Manchester encoder.
5 . The method of claim 1 , wherein the integrated circuit further comprises a serializer for serializing the VLC signal.
6 . The method of claim 1 , the integrated circuit further comprises a pre-equalizer using an overshoot/undershoot circuit configured to accelerate charging and discharging of the LED.
7 . The method of claim 1 , further comprising:
fabricating a photodetector in the compound semiconductor selectively grown on the second portion of the silicon substrate, or fabricating the photodetector in the same silicon substrate; wherein the photodetector is configured as a VLC receiver to receive the VLC signal, and the integrated circuit is configured to decode the VLC signal received by the photodetector.
8 . The method of claim 7 , wherein the integrated circuit further comprises an active feedback based ambient light cancellation circuit comprising a low pass filter, an error amplifier, and an NMOSFET.
9 . The method of claim 7 , further comprising:
integrating a micro-lens on top of the photodetector.
10 . The method of claim 1 , further comprising:
fabricating a photodetector on the first portion of a silicon substrate; integrating a micro-lens on top of the photodetector; wherein the photodetector is configured as a VLC receiver to receive the VLC signal, and the integrated circuit is configured to decode the VLC signal received by the photodetector.
11 . A visible light communication (VLC) system-on-a-chip (SoC) system, comprising:
an integrated circuit comprising a VLC encoder and an LED driver fabricated on a first portion of a silicon substrate; and an LED fabricated in a compound semiconductor selectively grown on a second portion of the silicon substrate; wherein the LED is configured as a VLC transmitter, the VLC encoder is configured to encode a VLC signal, and the LED driver is configured to drive the LED to emit visible light in accordance with the VLC signal.
12 . The system of claim 11 , wherein the system is a single chip integrated circuit.
13 . The system of claim 11 , further comprising a buffer layer between the compound semiconductor and the second portion of the silicon substrate.
14 . The system of claim 11 , wherein the VLC encoder comprises a Manchester encoder.
15 . The system of claim 11 , wherein the integrated circuit further comprises a serializer for serializing the VLC signal.
16 . The system of claim 11 , wherein the integrated circuit further comprises pre-equalizer using an overshoot/undershoot circuit configured to accelerate charging and discharging of the LED.
17 . The system of claim 11 , further comprising:
a photodetector fabricated in the compound semiconductor selectively grown on the second portion of the silicon substrate; wherein the photodetector is configured as a VLC receiver to receive the VLC signal, and the integrated circuit is configured to process the VLC signal received by the photodetector.
18 . The system of claim 17 , wherein the integrated circuit further comprises an active feedback based ambient light cancellation circuit comprising a low pass filter, an error amplifier, and an NMOSFET.
19 . The system of claim 17 , further comprising:
a micro-lens integrated on top of the photodetector.
20 . The system of claim 11 , further comprising:
a photodetector fabricated on the first portion of the silicon substrate; and a micro-lens integrated on top of the photodetector; wherein the photodetector is configured as a VLC receiver to receive the VLC signal, and the integrated circuit is configured to decode the VLC signal received by the photodetector.
21 . A method of making a visible light communication (VLC) System-in-Package (SiP) system, comprising:
fabricating an integrated circuit comprising a VLC encoder and an LED driver on a silicon substrate; fabricating an LED in a compound semiconductor; packaging the integrated circuit and the LED in a SiP module; forming interconnects between the integrated circuit and the LED; wherein the LED is configured as a VLC transmitter, the VLC encoder is configured to encode a VLC signal, and the LED driver is configured to drive the LED to emit visible light in accordance with the VLC signal.
22 . The method of claim 21 , further comprising packaging the integrated circuit and the LED in a SiP module using a flip-chip method.
23 . The method of claim 21 , wherein the interconnects comprise through-silicon vias and an interposer layer.
24 . The method of claim 21 , wherein the VLC encoder comprises a Manchester encoder.
25 . The method of claim 21 , wherein the integrated circuit comprises a serializer for serializing the VLC signal.
26 . The method of claim 21 , wherein the integrated circuit further comprises a pre-equalizer using an overshoot/undershoot circuit configured to accelerate charging and discharging of the LED.
27 . The method of claim 21 , further comprising:
fabricating a photodetector in the compound semiconductor, wherein the photodetector is configured as a VLC receiver to receive the VLC signal, and the integrated circuit is configured to decode the VLC signal received by the photodetector.
28 . The method of claim 27 , wherein the integrated circuit further comprises an active feedback based ambient light cancellation circuit comprising a low pass filter, an error amplifier, and an NMOSFET.
29 . The method of claim 27 , further comprising:
integrating a micro-lens on top of the photodetector.
30 . The method of claim 21 , further comprising:
fabricating a photodetector on the silicon substrate; integrating a micro-lens on top of the photodetector; wherein the photodetector is configured as a VLC receiver to receive the VLC signal, and the integrated circuit is configured to decode the VLC signal received by the photodetector.
31 . A visible light communication (VLC) System-in-Package (SiP) system, comprising:
an integrated circuit comprising a VLC encoder and an LED driver fabricated on a silicon substrate; an LED fabricated in a compound semiconductor; and interconnects formed between the integrated circuit and the LED; wherein the integrated circuit and the LED are packaged in a SiP module; wherein the LED is configured as a VLC transmitter, the VLC encoder is configured to encode a VLC signal, and the LED driver is configured to drive the LED to emit visible light in accordance with the VLC signal.
32 . The system of claim 31 , wherein the SiP module is packaged using a flip-chip method.
33 . The system of claim 31 , wherein the interconnects comprise through-silicon vias and an interposer layer.
34 . The system of claim 31 , wherein the VLC encoder comprises a Manchester encoder.
35 . The system of claim 31 , wherein the integrated circuit comprises a serializer for serializing the VLC signal.
36 . The system of claim 31 , wherein the integrated circuit further comprises a pre-equalizer using an overshoot/undershoot circuit configured to accelerate charging and discharging of the LED.
37 . The system of claim 31 , further comprising:
a photodetector fabricated in the compound semiconductor, wherein the photodetector is configured as a VLC receiver to receive the VLC signal, and the integrated circuit is configured to process the VLC signal received by the photodetector.
38 . The system of claim 37 , wherein the integrated circuit further comprises an active feedback based ambient light cancellation circuit comprising a low pass filter, an error amplifier, and an NMOSFET.
39 . The system of claim 37 , further comprising:
a micro-lens integrated on top of the photodetector.
40 . The system of claim 31 , further comprising:
a photodetector fabricated on the silicon substrate; a micro-lens integrated on top of the photodetector; wherein the photodetector is configured as a VLC receiver to receive the VLC signal, and the integrated circuit is configured to decode the VLC signal received by the photodetector.Join the waitlist — get patent alerts
Track US2019261470A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.