Patterned vacuum chuck for double-sided processing

Abstract

Embodiments described herein relate to a substrate chucking apparatus having a plurality of cavities formed therein. The cavities are formed in a body of the chucking apparatus. In one embodiment, a first plurality of ports are formed in a chucking surface of the body and extend to a bottom surface of the body. In another embodiment, a second plurality of ports are formed in a bottom surface of the plurality of cavities and extend through the body to a bottom surface of the body.

What is claimed is: 
     
         1 . A substrate chucking apparatus, comprising:
 a body having a chucking surface and a bottom surface opposite the chucking surface, the body having a plurality of cavities formed therein that are recessed from the chucking surface, wherein pairs of the plurality of cavities are in fluid communication with a plurality of first conduits; and   a plurality of second conduits formed in the body, one of the plurality of second conduits formed between a portion of the plurality of cavities, wherein a pressure in pairs of the cavities is individually controlled.   
     
     
         2 . The apparatus of  claim 1 , wherein the body is a metallic material. 
     
     
         3 . The apparatus of  claim 1 , wherein each of the plurality of cavities include a support member extending from a bottom thereof. 
     
     
         4 . The apparatus of  claim 1 , wherein the plurality of first conduits comprise a first pair of conduits and a second pair of conduits. 
     
     
         5 . The apparatus of  claim 4 , wherein the first pair of conduits is in fluid communication with a first pair of cavities of the plurality of cavities, and the second pair of conduits is in fluid communication with a second pair of cavities of the plurality of cavities. 
     
     
         6 . The apparatus of  claim 4 , wherein the first pair of conduits are in fluid communication with a first vacuum source and the second pair of conduits are in fluid communication with a second vacuum source. 
     
     
         7 . The apparatus of  claim 6 , wherein the first vacuum source is different than the second vacuum source. 
     
     
         8 . The apparatus of  claim 1 , wherein each of the plurality of second conduits are coupled to an opening formed in the chucking surface. 
     
     
         9 . The apparatus of  claim 8 , wherein each opening is formed in a groove pattern formed in the chucking surface. 
     
     
         10 . A substrate chucking apparatus, comprising:
 a circular body having a chucking surface;   a plurality of cavities formed in the chucking surface;   a plurality of first conduits, each of the plurality of first conduits coupled to a surface port formed in the chucking surface;   a second conduit coupled to a first pair of the plurality of cavities;   a third conduit coupled to a second pair of the plurality of cavities; and   a fourth conduit coupled to a third pair of the plurality of cavities, wherein a pressure in each of the pairs of the cavities is individually controlled.   
     
     
         11 . The apparatus of  claim 10 , wherein the chucking surface comprises a groove pattern. 
     
     
         12 . The apparatus of  claim 11 , wherein the surface ports are in fluid communication with the groove pattern. 
     
     
         13 . The apparatus of  claim 11 , wherein the groove pattern surrounds a portion of the plurality of cavities. 
     
     
         14 . The apparatus of  claim 10 , wherein each of the plurality of cavities include a support member extending from a bottom thereof. 
     
     
         15 . A method for processing a substrate, the method comprising:
 forming a plurality of structures on a first major surface of the substrate;   positioning the first major surface on a chuck, wherein each of the plurality of structures are positioned in a respective cavity formed in a chucking surface of the chuck; and   applying a first pressure to the major surface through a plurality of surface ports while applying a second pressure in pairs of the cavities, the first pressure being different than the second pressure.   
     
     
         16 . The method of  claim 15 , wherein the cavities include a first pair of cavities and a second pair of cavities. 
     
     
         17 . The method of  claim 16 , wherein the first pair of cavities is coupled to a first conduit and the second pair of cavities is coupled to a second conduit. 
     
     
         18 . The method of  claim 17 , wherein the first conduit is coupled to a first vacuum source and the second conduit is coupled to a second vacuum source. 
     
     
         19 . The method of  claim 15 , wherein each of the plurality of surface ports are in fluid communication with a groove pattern formed in the chucking surface. 
     
     
         20 . The method of  claim 19 , wherein the groove pattern surrounds a portion of the cavities.