Bonded aluminum-dissimilar metal structure and method of making same

Abstract

A bonded dissimilar material structure includes a first component made of a first dissimilar material; a second component made of a second dissimilar material stacked under the first component; and a plurality of blind holes formed on an upper surface of the second component; and the first component has a plurality of protrusions formed in the plurality of blind holes on the second component, respectively.

What is claimed is: 
     
         1 . A method for producing a bonded dissimilar material structure, comprising:
 providing a first component made of a first material;   providing a second component made of a second material, wherein the second material has a yield strength higher than the yield strength of the first material;   forming a plurality of blind holes on an upper surface of the second component;   cleaning surfaces the first component and the second component;   stacking the first component on the second component; and   bonding the first component and the second component using a diffusion bonding process.   
     
     
         2 . The method for producing a bonded dissimilar material structure according to  claim 1 , wherein cleaning surfaces of the first and second components includes using acidic or alkaline solutions to remove oxide material from the first and second components. 
     
     
         3 . The method for producing a bonded dissimilar material structure according to  claim 1 , wherein cleaning surfaces of the plurality of dissimilar material layers includes using etchant consisting of 75%˜85% phosphoric acid (H 3 PO 4 ), 0%˜10% acetic acid (CH 3 COOH), 0%˜10% nitric acid (HNO 3 ), and 5%˜15% water (H 2 O) to remove oxide material from the dissimilar material layers. 
     
     
         4 . The method for producing a bonded dissimilar material structure according to  claim 1 , wherein bonding the first component and the second component using a diffusion bonding process includes:
 disposing the stacked components in a diffusion bonding apparatus; and   applying a mechanical force or an isostatic pressure to the stacked components, the pressure is distributed within the components, the first component is extruded into the plurality of blind holes on the second component.