Metal electrodeposition cathode plate and production method therefor

Abstract

Provided are a metal electrodeposition cathode plate, the non-conductive film of which is not susceptible to failure and which can be used repeatedly, and a production method therefor. This cathode plate comprises a metal plate on which multiple disc-shaped protrusions are disposed, and a non-conductive film formed on the non-protrusion flat areas of the metal plate. The minimum film thickness Y of the non-conductive film at positions between the centers of adjacent protrusions is the same or greater than the height X of the protrusions. It is preferred that the height X of the protrusions is 50 μm to 1000 μm.

1 . A metal electrodeposition cathode plate comprising:
 a metal plate having a plurality of disc-shaped protrusions disposed on at least one surface of the metal plate; and   a non-conductive film formed on a surface of the metal plate except the protrusions,   wherein a minimum film thickness of the non-conductive film at a position between centers of the adjacent protrusions is the same as or greater than a height of the protrusion.   
     
     
         2 . The metal electrodeposition cathode plate according to  claim 1 , wherein the height of the protrusion is 50 μm or more and 1000 μm or less. 
     
     
         3 . The metal electrodeposition cathode plate according to  claim 1 , wherein a difference between the minimum film thickness of the non-conductive film at the position between centers of the adjacent protrusions and the height of the protrusion is 200 μm or less. 
     
     
         4 . The metal electrodeposition cathode plate according to  claim 1 , wherein the metal plate is formed of titanium or stainless steel. 
     
     
         5 . The metal electrodeposition cathode plate according to  claim 1 , wherein the metal electrodeposition cathode plate is used in production of electric nickel for plating. 
     
     
         6 . A method for producing a metal electrodeposition cathode plate, comprising:
 a first step of forming a plurality of disc-shaped protrusions on at least one surface of a metal plate; and   a second step of forming a non-conductive film on a surface of the metal plate except the protrusions,   wherein a minimum film thickness of the non-conductive film at a position between centers of the adjacent protrusions is set to be the same as or greater than a height of the protrusion in the second step.   
     
     
         7 . The metal electrodeposition cathode plate according to  claim 2 , wherein a difference between the minimum film thickness of the non-conductive film at the position between centers of the adjacent protrusions and the height of the protrusion is 200 μm or less. 
     
     
         8 . The metal electrodeposition cathode plate according to  claim 2 , wherein the metal plate is formed of titanium or stainless steel. 
     
     
         9 . The metal electrodeposition cathode plate according to  claim 3 , wherein the metal plate is formed of titanium or stainless steel. 
     
     
         10 . The metal electrodeposition cathode plate according to  claim 7 , wherein the metal plate is formed of titanium or stainless steel. 
     
     
         11 . The metal electrodeposition cathode plate according to  claim 2 , wherein the metal electrodeposition cathode plate is used in production of electric nickel for plating. 
     
     
         12 . The metal electrodeposition cathode plate according to  claim 3 , wherein the metal electrodeposition cathode plate is used in production of electric nickel for plating. 
     
     
         13 . The metal electrodeposition cathode plate according to  claim 4 , wherein the metal electrodeposition cathode plate is used in production of electric nickel for plating. 
     
     
         14 . The metal electrodeposition cathode plate according to  claim 7 , wherein the metal electrodeposition cathode plate is used in production of electric nickel for plating. 
     
     
         15 . The metal electrodeposition cathode plate according to  claim 8 , wherein the metal electrodeposition cathode plate is used in production of electric nickel for plating. 
     
     
         16 . The metal electrodeposition cathode plate according to  claim 9 , wherein the metal electrodeposition cathode plate is used in production of electric nickel for plating. 
     
     
         17 . The metal electrodeposition cathode plate according to  claim 10 , wherein the metal electrodeposition cathode plate is used in production of electric nickel for plating.