CMP groove processing positioning method and positioning device

Abstract

A CMP (chemical mechanical polishing) groove processing positioning method includes steps of: (S 1 ) preparing a positioning ring device for positioning a substrate of a polishing pad; (S 2 ) placing the positioning ring device on a processing platform of an engraving machine; (S 3 ) putting the substrate of the polishing pad into a slot of the positioning ring device; (S 4 ) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine; and (S 5 ) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine, and engraving a groove on the substrate of the polishing pad. In the present invention, the substrate is directly placed into the slot and vacuum-adsorbed onto the processing platform through the vacuum adsorption holes, thereby sufficiently fixing the substrate.

What is claimed is: 
     
         1 . A CMP (chemical mechanical polishing) groove processing positioning method comprising steps of:
 (S 1 ) preparing a positioning ring device for positioning a substrate of a polishing pad;   (S 2 ) placing the positioning ring device on a processing platform of an engraving machine;   (S 3 ) putting the substrate of the polishing pad into a slot of the positioning ring device;   (S 4 ) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine; and   (S 5 ) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine, and engraving a groove on the substrate of the polishing pad.   
     
     
         2 . The CMP groove processing positioning method, as recited in  claim 1 , wherein: the outer wall of the positioning ring device has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond. 
     
     
         3 . The CMP groove processing positioning method, as recited in  claim 1 , wherein: the slot is round and provided in a middle portion of the positioning ring device, the substrate of the polishing pad is round, and an inner diameter of the round slot is as same as a diameter of the round substrate of the polishing pad. 
     
     
         4 . The CMP groove processing positioning method, as recited in  claim 3 , wherein: the inner diameter of the round slot is in a range of 550 mm to 700 mm. 
     
     
         5 . The CMP groove processing positioning method, as recited in  claim 1 , wherein: the slot is square and provided in a middle portion of the positioning ring device, the substrate of the polishing pad is square, and an inner edge of the square slot is as same as an edge of the square substrate of the polishing pad. 
     
     
         6 . The CMP groove processing positioning method, as recited in  claim 5 , wherein: the inner edge of the square slot is in a range of 400 mm to 600 mm. 
     
     
         7 . A CMP (chemical mechanical polishing) groove processing positioning device, which is a positioning ring device which has a slot in a middle portion thereof for positioning a substrate of a polishing pad. 
     
     
         8 . The CMP groove processing positioning device, as recited in  claim 7 , wherein: the positioning ring device is made from scraps left after preparing the substrate of the polishing pad.