US2019232397A1PendingUtilityA1

Methods and apparatus for cutting profiles

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Assignee: SEOUL LASER DIEBOARD SYSTEM CO LTDPriority: Nov 6, 2007Filed: Apr 9, 2019Published: Aug 1, 2019
Est. expiryNov 6, 2027(~1.3 yrs left)· nominal 20-yr term from priority
Inventors:Sang Moo Lee
B21D 28/243Y10T83/162B21D 11/08Y10T83/0524Y10T83/8736B23D 15/002B23D 23/00B21D 28/02B21D 5/00B21D 43/28B23D 3/00
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Claims

Abstract

An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An apparatus for cutting a profile, comprising:
 a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile;   a first drive unit to drive said cutter forward and backward to and from the first surface of the profile; and   a second drive unit to drive said cutter up and down along the first surface of the profile.

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