Power module and method for manufacturing the same

Abstract

A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plane layer and a plurality of organic heat dissipating protrusions formed on a lower surface of the plane layer, wherein an upper surface of the plane layer is attached on the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.

What is claimed is: 
     
         1 . A power module, comprising:
 a substrate having an upper surface and a lower surface;   at least one power device bonded to the upper surface of the substrate; and   an organic heat dissipating structure comprising a plane layer and a plurality of organic heat dissipating protrusions formed on a lower surface of the plane layer, wherein an upper surface of the plane layer is attached on the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly;   wherein the organic heat dissipating protrusions and the plane layer are made from a same type of organic heat conduction material.   
     
     
         2 . The power module of  claim 1 , wherein the organic heat dissipating protrusions and the plane layer are from organic heat conduction material serving as filler material, the filler material being provided with an organic material as a matrix and doped with particles having high thermal conductivity. 
     
     
         3 . The power module of  claim 1 , wherein the power device and the substrate are coated with a molding component, and the heat generated by the power device is transferred outwardly through the organic heat dissipating structure via the substrate. 
     
     
         4 . The power module of  claim 1 , wherein the plane layer is formed on the lower surface of the substrate by means of curing process, and the organic heat dissipating protrusions are formed on a lower surface of the plane layer by means of printing or die casting process after the curing process. 
     
     
         5 . The power module of  claim 1 , wherein the organic heat dissipating protrusions are formed in pillar bumps, cylinders or fins. 
     
     
         6 . The power module of  claim 5 , wherein the organic heat dissipating protrusions are formed in multiple rows and two adjacent rows are arranged staggered or in line with each other. 
     
     
         7 . The power module of  claim 1 , wherein the organic heat conduction material has a thermal conductivity between 0.2 w/m·K and 20 w/m·K. 
     
     
         8 . The power module of  claim 2 , wherein the organic heat conduction material is selected from a group consisting of epoxy resin, acrylic acid and organic silicon, and the particles having high thermal conductivity are made from electrically insulated material selected from a group consisting of aluminum oxide ceramic, silicon dioxide, aluminum nitride ceramic, graphite, metallic oxide, and electrically conductive metal particles. 
     
     
         9 . The power module of  claim 1 , wherein a thermal spread is sandwiched between the lower surface of the substrate and the upper surface of the plane layer, the thermal spread is made from material having high thermal conductivity. 
     
     
         10 . A method for manufacturing a power module, comprising:
 providing at least one power device and a substrate having an upper surface and a lower surface; and   forming an organic heat dissipating structure having a plurality of organic heat dissipating protrusions, wherein the organic heat dissipating structure is located on the upper surface side or the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.   
     
     
         11 . The method of  claim 10 , further comprising:
 providing a molding component to cover the power device and the substrate,   wherein the organic heat dissipating structure is formed on the lower surface of the substrate, and the heat generated by the power device is transferred outwardly through the organic heat dissipating structure via the substrate   
     
     
         12 . The method of  claim 10 , further comprising:
 providing a molding component to cover the power device and the substrate; and   forming the organic heat dissipating structure on a surface of the molding component,   wherein the heat generated by the power device is transferred outwardly through the organic heat dissipating structure via the molding component.   
     
     
         13 . The method of  claim 10 , wherein the step of forming an organic heat dissipating structure comprises:
 forming a plane layer on the lower surface of the substrate by means of curing process, and   forming the organic heat dissipating protrusions on a lower surface of the plane layer by means of printing or die casting process after the curing process.   
     
     
         14 . The method of  claim 10 , wherein the step of forming an organic heat dissipating structure comprises:
 independently making the organic heat dissipating protrusions; and   attaching the organic heat dissipating protrusions onto the lower surface of the substrate through a plane layer.   
     
     
         15 . The method of  claim 10 , wherein the step of forming an organic heat dissipating structure comprises:
 forming the organic heat dissipating protrusions by means of any process selected from screen printing process, imprinting process, spraying or planting process, and film-pressing process.   
     
     
         16 . The method of  claim 15 , wherein the step of forming the organic heat dissipating protrusions by means of film-pressing process comprises:
 providing a thermal conductive resin on the lower surface of the substrate, the thermal conductive resin being provided with thermosetting organic material as a matrix and internally doped with a filler having high thermal conductivity, and the thermal conductive resin presenting a form of liquid state or B-stage state; and   forming the organic heat dissipating protrusions, in a shape as required, by molds under high temperature and high pressure, wherein the thermal conductive resin is converted into a form of solid state.